Prospective graphene-based through silicon vias in three-dimensional integrated circuits

VLSI and Post-CMOS Electronics. Volume 2: Devices, circuits and interconnects ◽

10.1049/pbcs073g_ch11 ◽

2019 ◽

pp. 223-246

Keyword(s):

Integrated Circuits ◽

Three Dimensional ◽

Through Silicon Vias ◽

Silicon Vias

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On Through Silicon Vias as used in three dimensional integrated circuits

2013 4th Annual International Conference on Energy Aware Computing Systems and Applications (ICEAC) ◽

10.1109/iceac.2013.6737650 ◽

2013 ◽

Author(s):

Robert Minvielle ◽

Magdy Bayoumi

Keyword(s):

Integrated Circuits ◽

Three Dimensional ◽

Through Silicon Vias ◽

Silicon Vias

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Modelling of crosstalk in differential through silicon vias for three‐dimensional integrated circuits

IET Microwaves Antennas & Propagation ◽

10.1049/iet-map.2018.5297 ◽

2019 ◽

Vol 13 (10) ◽

pp. 1529-1535

Author(s):

Jin‐Wei Pan ◽

Kai Fu ◽

Qi Liu ◽

Wen‐Sheng Zhao ◽

Linxi Dong ◽

...

Keyword(s):

Integrated Circuits ◽

Three Dimensional ◽

Through Silicon Vias ◽

Silicon Vias

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Low-Loss Air-Cavity Through-Silicon Vias (TSVs) for High Speed Three-Dimensional Integrated Circuits (3-D ICs)

IEEE Microwave and Wireless Components Letters ◽

10.1109/lmwc.2016.2517325 ◽

2016 ◽

Vol 26 (2) ◽

pp. 89-91 ◽

Cited By ~ 10

Author(s):

Xiaoxian Liu ◽

Zhangming Zhu ◽

Yintang Yang ◽

Ruixue Ding

Keyword(s):

Integrated Circuits ◽

High Speed ◽

Three Dimensional ◽

Low Loss ◽

Air Cavity ◽

Through Silicon Vias ◽

Silicon Vias

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Copper Anisotropy Effects in Three-Dimensional Integrated Circuits Using Through-Silicon Vias

IEEE Transactions on Device and Materials Reliability ◽

10.1109/tdmr.2012.2189401 ◽

2012 ◽

Vol 12 (2) ◽

pp. 225-232 ◽

Cited By ~ 9

Author(s):

Aditya P. Karmarkar ◽

Xiaopeng Xu ◽

Kong-Boon Yeap ◽

Ehrenfried Zschech

Keyword(s):

Integrated Circuits ◽

Three Dimensional ◽

Through Silicon Vias ◽

Silicon Vias

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Power bumps and through‐silicon‐vias placement with optimised power mesh structure for power delivery network in three‐dimensional‐integrated circuits

IET Computers & Digital Techniques ◽

10.1049/iet-cdt.2012.0047 ◽

2013 ◽

Vol 7 (1) ◽

pp. 11-20 ◽

Cited By ~ 3

Author(s):

Cheoljon Jang ◽

Jaehwan Kim ◽

Byunggyu Ahn ◽

Jongwha Chong

Keyword(s):

Integrated Circuits ◽

Three Dimensional ◽

Power Delivery ◽

Through Silicon Vias ◽

Mesh Structure ◽

Power Delivery Network ◽

Silicon Vias ◽

Delivery Network

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Electrical modeling of carbon nanotube‐based shielded through‐silicon vias for three‐dimensional integrated circuits

International Journal of Numerical Modelling Electronic Networks Devices and Fields ◽

10.1002/jnm.2842 ◽

2020 ◽

Author(s):

Qing‐Hao Hu ◽

Wen‐Sheng Zhao ◽

Kai Fu ◽

Da‐Wei Wang ◽

Gaofeng Wang

Keyword(s):

Carbon Nanotube ◽

Integrated Circuits ◽

Three Dimensional ◽

Through Silicon Vias ◽

Electrical Modeling ◽

Silicon Vias

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Parasitic effects of air-gap through-silicon vias in high-speed three-dimensional integrated circuits

Chinese Physics B ◽

10.1088/1674-1056/25/11/118401 ◽

2016 ◽

Vol 25 (11) ◽

pp. 118401

Author(s):

Xiaoxian Liu ◽

Zhangming Zhu ◽

Yintang Yang ◽

Ruixue Ding ◽

Yuejin Li

Keyword(s):

Integrated Circuits ◽

High Speed ◽

Three Dimensional ◽

Air Gap ◽

Through Silicon Vias ◽

Parasitic Effects ◽

Silicon Vias

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Compact modelling of Through-Silicon Vias (TSVs) in three-dimensional (3-D) integrated circuits

2009 IEEE International Conference on 3D System Integration ◽

10.1109/3dic.2009.5306541 ◽

2009 ◽

Cited By ~ 61

Author(s):

Roshan Weerasekera ◽

Matt Grange ◽

Dinesh Pamunuwa ◽

Hannu Tenhunen ◽

Li-Rong Zheng

Keyword(s):

Integrated Circuits ◽

Three Dimensional ◽

Through Silicon Vias ◽

Silicon Vias

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Corrections to “Copper Anisotropy Effects in Three-Dimensional Integrated Circuits Using Through-Silicon Vias” [Jun 12 225-232]

IEEE Transactions on Device and Materials Reliability ◽

10.1109/tdmr.2012.2209531 ◽

2012 ◽

Vol 12 (3) ◽

pp. 582-582

Author(s):

Aditya P. Karmarkar ◽

Xiaopeng Xu ◽

Kong-Boon Yeap ◽

Ehrenfried Zschech

Keyword(s):

Integrated Circuits ◽

Three Dimensional ◽

Through Silicon Vias ◽

Silicon Vias

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Leakage current conduction mechanism of three-dimensional capacitors embedded in through-silicon vias

Japanese Journal of Applied Physics ◽

10.7567/jjap.57.07mf01 ◽

2018 ◽

Vol 57 (7S2) ◽

pp. 07MF01 ◽

Cited By ~ 1

Author(s):

Ye Lin ◽

Chuan Seng Tan

Keyword(s):

Leakage Current ◽

Conduction Mechanism ◽

Three Dimensional ◽

Through Silicon Vias ◽

Current Conduction ◽

Silicon Vias

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