scholarly journals Experimental study on heat transfer performance of gas-liquid pulsating heat pipe heat exchanger

2020 ◽  
Vol 165 ◽  
pp. 06048
Author(s):  
Fumin Shang ◽  
Chaoyue Liu ◽  
Qingjing Yang ◽  
Yifang Dong ◽  
Weijia Cao ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Heat Exchanger ◽  
Heat Pipe ◽  
Heat Dissipation ◽  
Heat Transfer Performance ◽  
Waste Heat ◽  
Transfer Performance ◽  
Pulsating Heat Pipe ◽  
Heat Exchange Equipment ◽  
Pipe Heat

With the continuous development of industrial technology, the safety and efficiency of thermal equipment work in related industries and industrial fields are facing many problems. First, with the improvement of integrated level, the size of electronic components is getting smaller and smaller, and the heat load per unit area is increasing, which makes the traditional heat dissipation method difficult to meet the requirements; second, with the increase of energy-saving pressure, the temperature difference of low-temperature waste heat recovery is reduced, and the traditional heat exchange equipment is difficult to meet the working requirements. The pulsating heat pipe has the characteristics of small volume and excellent heat transfer performance. In view of the heat transfer performance of the pulsating heat pipe, we designed the gas-liquid pulsating heat pipe heat exchanger and studied its heat transfer performance, which has been verified to be effective.

scholarly journals An experimental study on heat transfer performance of a pulsating heat pipe radiator for CPU heat dissipation

2020 ◽  
Vol 165 ◽  
pp. 06035
Author(s):  
Fumin Shang ◽  
Qingjing Yang ◽  
Chaoyue Liu ◽  
Shilong Fan ◽  
Jianhong Liu
Keyword(s):  
Heat Transfer ◽  
Temperature Distribution ◽  
Surface Temperature ◽  
Heat Pipe ◽  
Heat Dissipation ◽  
Heat Transfer Performance ◽  
High Heat ◽  
Transfer Performance ◽  
Pulsating Heat Pipe ◽  
Surface Temperature Distribution

To meet the requirement of electronic heat dissipation with high heat flux, a kind of heat dissipation device using pulsating heat pipe (PHP) for CPU heat dissipation was put forward. The heat transfer performance and surface temperature distribution of the radiator are analyzed by analyzing the wall temperature distribution and the distribution of the evaporator and condenser of the PHP. The experimental results show that the change of wind speed has obvious influence on the operation of the PHP radiator. The surface temperature distribution of the PHP radiator is very uniform, which is especially beneficial for CPU cooling. The heat transfer performance of the PHP is better, and the minimum average thermal resistance is 0.19 k/W. In addition, there is no drying phenomenon when the temperature reaches about 120 °C, which indicates that the pulsating heat pipe has a very high heat transfer limit.

Experimental Study on Heat Transfer Performance of Pulsating Heat Pipe CPU Radiator

2019 ◽  
Author(s):  
Fu-Min Shang ◽  
Qing-Jing Yang ◽  
Jian-Hong Liu
Keyword(s):  
Heat Transfer ◽  
Heat Pipe ◽  
Wall Temperature ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Heat Transfer Performance ◽  
Structural Characteristics ◽  
Hot Water ◽  
Transfer Performance ◽  
Pulsating Heat Pipe

Abstract According to the characteristics of heat dissipation process and the structural characteristics of traditional heat dissipation device, pulsating heat pipe (PHP) and traditional The pin-finned heat sink are used to simulate the cooling process of CPU, so as to meet the cooling requirements of computer CPU. By comparing the heat transfer perform of the two heat sinks under three conditions: the top wall temperature of the heat sink, the wall temperature of the heat sink and the temperature difference between the inlet and outlet of hot water, it can be found that the heat transfer performance of the PHP radiator is better. The experimental results show that in order to further improve the heat dissipation performance of the computer CPU, the CPU radiator device can be manufactured by the PHP device, and the PHP technology has broad application prospects in electronic heat dissipation.

Experimental Study on Heat Pipe Radiator in Cooling Electronic Apparatus

2012 ◽  
Vol 197 ◽  
pp. 216-220
Author(s):  
Zhong Chao Zhao ◽  
Rui Ye ◽  
Gen Ming Zhou
Keyword(s):  
Heat Transfer ◽  
Experimental Study ◽  
Heat Pipe ◽  
Heat Dissipation ◽  
Heat Transfer Performance ◽  
Electronic Device ◽  
Transfer Performance ◽  
Air Velocity ◽  
Electronic Apparatus ◽  
Operational Temperature

To solve the cooling problem in modern electronic device, a kind of heat pipe radiator was designed and manufactured in this paper. The heat transfer performance of heat pipe radiator and its relationship with air velocity were investigated by experimental method. The experimental results show that the heat pipe radiator can meet the temperature requirement of electronic device with the power range from 40W to 160W. To keep the operational temperature of electronic device with power of 160W under 75°C，the air velocity should be keep at 1.7m/s. The heat dissipation performance of heat pipe radiator was enhanced with the air velocity increased from 0.2m/s to 1.7m/s.for the electronic equipment with power of 160W.

Investigation on Heat Transfer Performance of Heat Pipe Grinding Wheel in Dry Grinding

2016 ◽  
Vol 138 (11) ◽  
Author(s):  
Qingshan He ◽  
Yucan Fu ◽  
Jiajia Chen ◽  
Wei Zhang
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Heat Pipe ◽  
Heat Transfer Performance ◽  
Grinding Wheel ◽  
Grinding Temperature ◽  
Transfer Performance ◽  
Equivalent Thermal Conductivity ◽  
Dry Grinding ◽  
Pipe Heat

The use of fluid in grinding enhances heat exchange at the contact zone and reduces grinding temperature. However, the massive use of fluid can cause negative influences on environment and machining cost. In this paper, a novel method of reducing grinding temperature based on heat pipe technology is proposed. One new heat pipe grinding wheel and its heat transfer principle are briefly introduced. A heat transfer mathematical model is established to calculate equivalent thermal conductivity of heat pipe grinding wheel. Compared with the wheel without heat pipe, heat transfer effect of heat pipe grinding wheel is presented, and the influences of heat flux input, cooling condition, wheel speed, and liquid film thickness on heat transfer performance are investigated. Furthermore, dry grinding experiments with two different wheels are conducted to verify the cooling effectiveness on grinding temperature. The results show that thermal conductivity of the wheel with heat pipe can be greatly improved compared to the one without heat pipe; heat transfer performance of heat pipe grinding wheel can change with different grinding conditions; meanwhile, grinding temperatures can be significantly decreased by 50% in dry grinding compared with the wheel without heat pipe.

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