Measuring the thermal resistance of typical multi-layer building walls using the accelerated measurement method

Abstract. This paper presents the measurement results of three building wall materials which are commonly used for residential housings in Indonesia, namely clay brick, batako (concrete brick), and precast concrete. In-situ measurement of the steady state thermal flow (heat flux) at building walls (envelopes) is conducted in order to determine the thermal resistance of building wall according to ASTM C1155. The results show that all three building materials having a thermal resistance values are far below the energy conservation provisions of ASHRAE 90.1 and especially when compared to the provision of high performance green building ASHRAE 189.1 It is found that precast concrete has higher thermal resistance (or has lower thermal conductivity) than that of other two materials, hence a better compliance to the ASHRAE standards.

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The Analysis Of Accuracy Of Selected Methods Of Measuring The Thermal Resistance Of IGBTs

Metrology and Measurement Systems ◽

10.1515/mms-2015-0036 ◽

2015 ◽

Vol 22 (3) ◽

pp. 455-464 ◽

Cited By ~ 16

Author(s):

Krzysztof Górecki ◽

Paweł Górecki

Keyword(s):

Measurement Error ◽

Thermal Resistance ◽

Measurement Method ◽

Bipolar Transistor ◽

Operating Conditions ◽

Measuring Error ◽

Insulated Gate Bipolar Transistor ◽

Theoretical Considerations

Abstract In the paper selected methods of measuring the thermal resistance of an IGBT (Insulated Gate Bipolar Transistor) are presented and the accuracy of these methods is analysed. The analysis of the measurement error is performed and operating conditions of the considered device, at which each measurement method assures the least measuring error, are pointed out. Theoretical considerations are illustrated with some results of measurements and calculations.

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Noninvasive Residential Building Envelope R-Value Measurement Method Based on Interfacial Thermal Resistance

Journal of Architectural Engineering ◽

10.1061/(asce)ae.1943-5568.0000182 ◽

2016 ◽

Vol 22 (4) ◽

Cited By ~ 2

Author(s):

Keke Zheng ◽

Yong K. Cho ◽

Chao Wang ◽

Haorong Li

Keyword(s):

Thermal Resistance ◽

Measurement Method ◽

Residential Building ◽

Building Envelope ◽

Interfacial Thermal Resistance ◽

R Value ◽

Value Measurement

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Non-Intrusive Case Temperature Measurement Method of Direct-Water-Cooled Power Module

Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays ◽

10.1115/ipack2015-48625 ◽

2015 ◽

Author(s):

Keisuke Horiuchi ◽

Yuichiro Konishi ◽

Atsuo Nishihara

Keyword(s):

Thermal Resistance ◽

Structure Function ◽

Temperature Measurement ◽

Flow Rate ◽

Measurement Method ◽

Water Flow Rate ◽

Power Module ◽

Thermal Capacitance ◽

Simulation Results ◽

Heat Spreading

In this paper, we present a non-intrusive case temperature measurement method of the direct-water-cooled power module. It uses the structure function, which in this case comprises the cumulative thermal capacitance and the cumulative thermal resistance. Since the effective heat transfer rate of the pinfin heatsink varies with the water flow rate, in this study we assumed the inflection point of the structure function corresponding to the change in the flow rate was junction-case thermal resistance. We compared numerical simulation results with experimental results and present our findings. Finally, we show that the design area in which the heat spreading angle of 45 degrees, the well-known rule of thumb, is suitable.

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Measurements of thermal resistance of power LEDs

Microelectronics International ◽

10.1108/mi-11-2013-0069 ◽

2014 ◽

Vol 31 (3) ◽

pp. 217-223 ◽

Cited By ~ 7

Author(s):

Krzysztof Górecki

Keyword(s):

Thermal Resistance ◽

Measurement Method ◽

Classical Method ◽

Thermal Power ◽

Electrical Power ◽

New Method ◽

Content Type ◽

Light Emitting ◽

Cooling Conditions ◽

Infrared Method

Purpose – The purpose of this paper is to present a new method of measuring thermal resistance of power light-emitting diodes (LEDs). Properties of power LEDs strongly depend on their internal temperature. The value of this temperature depends on the cooling conditions characterized by thermal resistance. Design/methodology/approach – The new method of measuring the value of this parameter belongs to the group of electric methods. In this method, the problem of estimating the value of electrical power converted into light is solved. By comparing the values of the case temperature obtained for the LED operating in the forward mode and the reverse-breakdown mode, the thermal power is estimated. On the basis of the measured value of the thermally sensitive parameter (the LED forward voltage) and the estimated value of the thermal power, thermal resistance is calculated. Findings – The elaborated method was used to measure thermal resistance of the selected types of power LEDs operating at different cooling conditions. The correctness of the elaborated measurement method was proved by comparing the results of measurements obtained with the use of the new method and the infrared method. Research limitations/implications – On the basis of the obtained results of measurements and the catalog data of the tested diodes, the dependence of the measurement error of thermal resistance of the LED on its luminous efficiency is discussed. Originality/value – The new measurement method is easy to use and more accurate than the classical method of thermal resistance measurement of the diode.

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