Incorporation of oxygen and chlorine atoms into low‐temperature (850 °C) silicon epitaxial films by chemical vapor deposition
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2020 ◽
Vol 38
(3)
◽
pp. 033414
High Temperature Material Processes An International Quarterly of High-Technology Plasma Processes
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2006 ◽
Vol 10
(3)
◽
pp. 457-466
Keyword(s):
Keyword(s):