Dislocation-free strained silicon-on-silicon by in-place bonding

2005 ◽  
Vol 86 (25) ◽  
pp. 251902 ◽  
Author(s):  
G. M. Cohen ◽  
P. M. Mooney ◽  
V. K. Paruchuri ◽  
H. J. Hovel
2003 ◽  
Vol 765 ◽  
Author(s):  
Minjoo L. Lee ◽  
Eugene A. Fitzgerald

AbstractThe use of alternative channel materials such as germanium [1,2] and strained silicon (ε-Si) [3-5] is increasingly being considered as a method for improving the performance of MOSFETs. While ε-Si grown on relaxed Si1-x Gex is drawing closer to widespread commercialization, it is currently believed that almost all of the performance benefit in CMOS implementations will derive from the enhanced mobility of the n -MOSFET [5]. In this paper, we demonstrate that ε-Si p -MOSFETs can be engineered to exhibit mobility enhancements that increase or remain constant as a function of inversion density. We have also designed and fabricated ε-Si / ε-Ge dual-channel p -MOSFETs exhibiting mobility enhancements of 10 times. These p -MOSFETs can be integrated on the same wafers as ε-Si n -MOSFETs, making symmetric-mobility CMOS possible.


2007 ◽  
Author(s):  
Richard Zhu ◽  
Ernian Pan ◽  
Peter W. Chung ◽  
Xinli Cai ◽  
Kim M. Liew ◽  
...  

2021 ◽  
Vol 130 (5) ◽  
pp. 055105
Author(s):  
Nicolas Roisin ◽  
Guillaume Brunin ◽  
Gian-Marco Rignanese ◽  
Denis Flandre ◽  
Jean-Pierre Raskin

2013 ◽  
Vol 46 (8) ◽  
pp. 1018-1043 ◽  
Author(s):  
Gerard T. Kyle ◽  
Jinhee Jun ◽  
James D. Absher
Keyword(s):  

2017 ◽  
Vol 110 (10) ◽  
pp. 103105 ◽  
Author(s):  
Arianna Lucia ◽  
Onofrio Antonino Cacioppo ◽  
Enrico Iulianella ◽  
Luca Latessa ◽  
Giuseppe Moccia ◽  
...  

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