Very high current density package level electromigration test for copper interconnects
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1999 ◽
Vol 43
(8)
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pp. 1425-1428
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1990 ◽
Vol 23
(6)
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pp. 637-642
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2004 ◽
Vol 108
(17)
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pp. 5182-5184
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2007 ◽
Vol 22
(22)
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pp. 3784-3793
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