Properties of titanium nitride thin films deposited by rapid‐thermal‐low‐pressure‐metalorganic‐chemical‐vapor‐deposition technique using tetrakis (dimethylamido) titanium precursor
1992 ◽
Vol 31
(Part 2, No. 5A)
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pp. L571-L573
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1991 ◽
Vol 30
(Part 2, No. 8B)
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pp. L1477-L1479
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1985 ◽
Vol 71
(1)
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pp. 209-219
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2009 ◽
Vol 86
(1)
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pp. 47-54
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1997 ◽
Vol 182
(3-4)
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pp. 314-320
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