scholarly journals Preparation and characterization of alloy Al –SiC made by using powder metallurgy method

2020 ◽  
Author(s):  
Suprapedi ◽  
Mulyadi ◽  
Priyo Sardjono ◽  
Ramlan
Rare Metals ◽  
2016 ◽  
Vol 36 (10) ◽  
pp. 806-811 ◽  
Author(s):  
M. Anandajothi ◽  
S. Ramanathan ◽  
V. Ananthi ◽  
P. Narayanasamy

2015 ◽  
Vol 21 (3) ◽  
Author(s):  
Märt Kolnes ◽  
Jakob Kübarsepp ◽  
Lauri Kollo ◽  
Mart Viljus

2011 ◽  
Vol 217-218 ◽  
pp. 88-92 ◽  
Author(s):  
Xue Zhang ◽  
Zhi Meng Xiu ◽  
Xiao Wu Li

(HAp/SiO2)/Ti biocomposites were prepared by the powder metallurgy method. The phase compositions and the in vitro bioactivity of such biocomposites were systematically characterized. The XRD result shows that the phase compositions of (HAp/SiO2)/Ti composites are mainly composed of Ca4O(PO4)2 (TTCP), Ti, TiO2 and CaO. The synthesized (HAp/SiO2)/Ti biocomposites exhibit a good bioactivity, for example, after the samples are immersed in SBF solution only for 24 hours, the bone-like layer consisting of spherical apatite crystal clusters has deposited on the surface of the samples. The density and thickness of the apatite layer increases with increasing immersion time. The formation process and mechanisms of bone-like apatite layer are also discussed.


2012 ◽  
Vol 501 ◽  
pp. 160-164 ◽  
Author(s):  
Iziana Yahya ◽  
Noor Asikin Ab Ghani ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Hamidi Abd Hamid ◽  
Zainal Arifin Ahmad ◽  
...  

The toxicity in the Sn-Pb solder has promoted the development of Pb-free solder in the electronics industries. Among the Pb-solders, the Sn-3.5Ag-1.0Cu solder is considered a potential replacement and being studied by many researchers. In the present study, the characteristics of Sn-3.5Ag-1.0Cu lead-free solder were studied. The raw materials were tin, silver and copper powders in micron size. The solder was prepared using powder metallurgy route which includes blending, compacting and sintering. Four blending times and two compacting pressures were used to investigate for optimum condition. The melting temperature of the samples were studied using differential scanning calorimeter (DSC) and the presence of Sn Ag, Cu were confirmed using x-ray diffraction analysis (XRD). Finally the effect of variables on the hardness of the solders is reported.


The Tungsten carbide (WC) based composites are good choice to replace the traditional conventional materials for obtaining high hardness and wear resistance. This work investigates the influence of cobalt content on the characterization of Tungsten carbide. The composite specimens are prepared by using powder metallurgy technique. The effect of cobalt material on the performance of Tungsten carbide hardness, fracture toughness is estimated by conducting suitable experiments. While performing experiments, a powder mixture of 89% WC, 11% of Co was manufactured with powder metallurgy, under appropriate milling conditions and Sintering temperature to ensure uniform microstructure. From the present work the optimum sintering temperature of Tungsten carbide mixed nano cobalt composite is identified. The crystalanity of the resulting materials is identified from a rapid analytical technique, X -ray Diffraction.


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