Characterization of Sn-3.5Ag-1.0Cu Lead-Free Solder Prepared via Powder Metallurgy Method

2012 ◽  
Vol 501 ◽  
pp. 160-164 ◽  
Author(s):  
Iziana Yahya ◽  
Noor Asikin Ab Ghani ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Hamidi Abd Hamid ◽  
Zainal Arifin Ahmad ◽  
...  
Keyword(s):  
Powder Metallurgy ◽  
Raw Materials ◽  
Lead Free ◽  
Powder Metallurgy Method ◽  
Lead Free Solder ◽  
X Ray Diffraction ◽  
Copper Powders ◽  
Micron Size ◽  
Free Solder

The toxicity in the Sn-Pb solder has promoted the development of Pb-free solder in the electronics industries. Among the Pb-solders, the Sn-3.5Ag-1.0Cu solder is considered a potential replacement and being studied by many researchers. In the present study, the characteristics of Sn-3.5Ag-1.0Cu lead-free solder were studied. The raw materials were tin, silver and copper powders in micron size. The solder was prepared using powder metallurgy route which includes blending, compacting and sintering. Four blending times and two compacting pressures were used to investigate for optimum condition. The melting temperature of the samples were studied using differential scanning calorimeter (DSC) and the presence of Sn Ag, Cu were confirmed using x-ray diffraction analysis (XRD). Finally the effect of variables on the hardness of the solders is reported.

Microstructural Observation and Phase Analysis of Sn-Cu-Ni (SN100C) Lead Free Solder with Addition of Micron-Size Silicon Nitride (Si3N4) Reinforcement

2015 ◽  
Vol 754-755 ◽  
pp. 518-523 ◽  
Author(s):  
Mohd Izrul Izwan Ramli ◽  
Norainiza Saud ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Mohd Nazree Derman ◽  
Rita Mohd Said ◽  
...  
Keyword(s):  
Silicon Nitride ◽  
Powder Metallurgy ◽  
Phase Analysis ◽  
Solder Alloy ◽  
Composite Solder ◽  
Lead Free ◽  
Lead Free Solder ◽  
Microstructural Observation ◽  
Micron Size ◽  
Free Solder

The effect of micron-size silicon nitride (Si3N4) particles additions, up to 1.0 wt. % on Sn-Cu-Ni (SN100C) solder alloy was investigated. Sn-Cu-Ni composite solder were prepared via powder metallurgy (PM) technique. Different percentages of Si3N4(0, 0.25, 0.5, 0.75 and 1.0 wt. %) were added into the alloy. Result revealed that reinforcement was well distributed between the grain boundaries which could positively affect the properties of the composite solder.

The Effects of Zinc Addition on the Microstructure, Melting Point and Microhardness of Sn-0.7Cu Lead-Free Solder Fabricated via Powder Metallurgy Method

2016 ◽  
Vol 857 ◽  
pp. 13-17 ◽  
Author(s):  
Nisrin Adli ◽  
Nurul Razliana Abdul Razak ◽  
Norainiza Saud
Keyword(s):  
Powder Metallurgy ◽  
Melting Point ◽  
Lead Free ◽  
Powder Metallurgy Method ◽  
Lead Free Solder ◽  
Zn Addition ◽  
The World ◽  
Zinc Addition ◽  
Free Solder ◽  
Lead Free Solders

The attempt to produce various types of lead-free solder has been actively investigated around the world in order to substitute the harmful SnPb solders. The effects of Zn addition on the microstructure, melting point and microhardness of Sn-0.7Cu lead-free solder were investigated with 1 wt% and 5 wt% of Zn additions. Powder metallurgy (PM) method was used to fabricate these Sn-0.7Cu-Zn lead-free solders. The results revealed that the addition of Zn was able to improve the solder properties. The melting point of Sn-0.7Cu-Zn lead-free solder was decreased drastically as the increasing of Zn additions. The Zn particles were distributed homogenously along the grain boundaries and produced refined dendrite β-Sn, which also lead to a superior microhardness values of solders.

Process characterization of PCB assembly using 0201 packages with lead‐free solder

2003 ◽  
Vol 15 (2) ◽  
pp. 22-27 ◽  
Author(s):  
David Geiger ◽  
Fredrik Mattsson ◽  
Dongkai Shangguan ◽  
MT Ong ◽  
Patrick Wong ◽  
...  
Keyword(s):  
Lead Free ◽  
Lead Free Solder ◽  
Pcb Assembly ◽  
Process Characterization ◽  
Free Solder

Medium to High Strain-Rate Characterization of Lead Free Solder Alloys Through Metal Cutting Experiments

2019 ◽  
Author(s):  
Yuvraj Singh ◽  
Anirudh Udupa ◽  
Srinivasan Chandrasekar ◽  
Ganesh Subbarayan
Keyword(s):  
High Strain Rate ◽  
Strain Rate ◽  
Metal Cutting ◽  
High Strain ◽  
Lead Free ◽  
Strain Rates ◽  
Lead Free Solder ◽  
Orthogonal Metal Cutting ◽  
Free Solder

Abstract Studies on medium to high strain-rate characterization (≥ 0.1s−1) of lead-free solder are relatively few, primarily due to the lack of available methods for testing. Prior work in literature uses Split Hopkinson Bar (SPHB) experiments for high strain-rate characterization (≥ 300s−1) [1,2], while a modified micro-scale tester is used for medium strain-rate characterization (0.005s−1 to 300s−1) [3] and an impact hammer test setup for testing in a strain-rate regime from 1s−1 to 100s−1 [4]. However, there is still limited data in strain-rate regimes of relevance, specifically for drop shock applications. In this paper, we present orthogonal metal cutting as a novel method to characterize lead-free solder alloys. Experiments are carried out using a wedgelike tool that cuts through a work piece at a fixed depth and rake angle while maintaining a constant cutting velocity. These experiments are conducted at room temperature on Sn1.0Ag0.5Cu bulk test specimens with strain-rates varying from 0.32 to 48s−1. The range of strain-rates is only limited by the ball screw driven slide allowing higher strain-rates if needed. The strains and strain-rates are captured through Particle Image Velocimetry (PIV) using sequential images taken from a high-speed camera just ahead of the cutting tool. The PIV enables non-contact recording of high strain-rate deformations, while the dynamometer on the cutting head allows one to capture the forces exerted during the cutting process. Results for the stress-strain response obtained through the experiments are compared to prior work for validation. Orthogonal metal cutting is shown to be a potentially attractive method for characterization of solder at higher strain-rates.

Sign in / Sign up

Export Citation Format

Share Document