Experimental Characterization of a Three-Dimensional-Printed Adiabatic Desorber for Absorption Chillers

2022 ◽  
pp. 1-18
Author(s):  
Amín Altamirano ◽  
Benoit Stutz ◽  
Nolwenn Le Pierrès
Keyword(s):  
Three Dimensional ◽  
Experimental Characterization ◽  
Absorption Chillers

Experimental characterization of three-dimensional corner flows at low Reynolds numbers

2012 ◽  
Vol 707 ◽  
pp. 37-52 ◽  
Author(s):  
J. Sznitman ◽  
L. Guglielmini ◽  
D. Clifton ◽  
D. Scobee ◽  
H. A. Stone ◽  
...  
Keyword(s):  
Reynolds Number ◽  
Numerical Solutions ◽  
Three Dimensional ◽  
Reynolds Numbers ◽  
Secondary Flows ◽  
Channel Cross Section ◽  
Experimental Characterization ◽  
Low Reynolds Numbers ◽  
Low Reynolds

AbstractWe investigate experimentally the characteristics of the flow field that develops at low Reynolds numbers ($\mathit{Re}\ll 1$) around a sharp $9{0}^{\ensuremath{\circ} } $ corner bounded by channel walls. Two-dimensional planar velocity fields are obtained using particle image velocimetry (PIV) conducted in a towing tank filled with a silicone oil of high viscosity. We find that, in the vicinity of the corner, the steady-state flow patterns bear the signature of a three-dimensional secondary flow, characterized by counter-rotating pairs of streamwise vortical structures and identified by the presence of non-vanishing transverse velocities (${u}_{z} $). These results are compared to numerical solutions of the incompressible flow as well as to predictions obtained, for a similar geometry, from an asymptotic expansion solution (Guglielmini et al., J. Fluid Mech., vol. 668, 2011, pp. 33–57). Furthermore, we discuss the influence of both Reynolds number and aspect ratio of the channel cross-section on the resulting secondary flows. This work represents, to the best of our knowledge, the first experimental characterization of the three-dimensional flow features arising in a pressure-driven flow near a corner at low Reynolds number.

Characterization of “Bulk Lithography” Process for Fabrication of Three-Dimensional Microstructures

2013 ◽  
Vol 1 (4) ◽  
Author(s):  
Prasanna Gandhi ◽  
Kiran Bhole
Keyword(s):  
Laser Beam ◽  
Spatial Variation ◽  
Three Dimensional ◽  
Single Layer ◽  
Exposure Dose ◽  
Laser Exposure ◽  
Experimental Characterization ◽  
Gaussian Laser Beam ◽  
Lithography Process

Various ways of fabricating a three-dimensional (3D) component in a single-layer exposure using spatial variation of exposure dose have been presented in the literature. While some of them are based on dynamic mask process, more recently, a process based on varying intensity of a scanning Gaussian laser beam termed as “bulk lithography” has been proposed. In bulk lithography, the entire varying depth 3D microstructure gets fabricated because of spatial variation of intensity of laser imposed at every point in single layer scan. For the bulk lithography process, this paper first presents experimental characterization of unconstrained depth photopolymerization of resin upon exposure to Gaussian laser beam. Experimental characterization carried out for two resins systems: namely 1,6 hexane diol-diacrylate (HDDA) and trimethylolpropane triacrylate (TMPTA), over relatively wider range of Ar+ laser exposure dose and time, show behavior well beyond Beer–Lambert law. A unified empirical model is proposed to represent the nondimensional depth variation with respect to the time and energy of exposure for both resins. Finally, using these models, successful fabrication of several microstructures including micro-Fresnel lens, textured curved surface, otherwise difficult or impossible to fabricate, is demonstrated. Several advantages of the bulk lithography as compared to other similar processes in the literature are highlighted.

Experimental Characterization of the Vertical and Lateral Heat Transfer in Three-Dimensional Stacked Die Packages

2016 ◽  
Vol 138 (1) ◽  
Author(s):  
Herman Oprins ◽  
Vladimir Cherman ◽  
Geert Van der Plas ◽  
Joeri De Vos ◽  
Eric Beyne
Keyword(s):  
Power Distribution ◽  
Printed Circuit Board ◽  
Hot Spot ◽  
Three Dimensional ◽  
Lateral Spreading ◽  
Circuit Board ◽  
Experimental Characterization ◽  
Test Chip ◽  
Conductivity Increase

In this paper, we present the experimental characterization of three-dimensional (3D) packages using a dedicated stackable test chip. An advanced complementary metal oxide silicon (CMOS) test chip with programmable power distribution has been designed, fabricated, stacked, and packaged in molded and bare die 3D packages. The packages have been experimentally characterized in test sockets with and without cooling and soldered to the printed circuit board (PCB). Using uniform and localized hot spot power distribution, the thermal self-heating and thermal coupling resistance and the lateral spreading in the 3D packages have been studied. Furthermore, the measurements have been used to characterize the thermal properties of the die–die interface and to calibrate a thermal model for the calculation of equivalent properties of underfilled μbump arrays. This model has been applied to study the tradeoff between the standoff height reduction and the underfill thermal conductivity increase in order to reduce the interdie thermal resistance.

Experimental characterization of the overturning of three-dimensional square based rigid block

2015 ◽  
Vol 69 ◽  
pp. 137-145 ◽  
Author(s):  
Angelo Di Egidio ◽  
Rocco Alaggio ◽  
Alessandro Contento ◽  
Marco Tursini ◽  
Emidio Della Loggia
Keyword(s):  
Three Dimensional ◽  
Rigid Block ◽  
Experimental Characterization

Three dimensional experimental characterization of a NiMnGa alloy

2013 ◽  
Author(s):  
Isaac Nelson ◽  
Constantin Ciocanel ◽  
Doug LaMaster ◽  
Heidi Feigenbaum
Keyword(s):  
Three Dimensional ◽  
Experimental Characterization

Viscoelastic Characterization of Woven Dacron for Aortic Grafts by Using Direction-Dependent Quasi-Linear Viscoelasticity

2018 ◽  
Author(s):  
Eleonora Tubaldi ◽  
Giovanni Ferrari ◽  
Prabakaran Balasubramanian ◽  
Ivan Breslavskyi ◽  
Marco Amabili
Keyword(s):  
Dynamic Modulus ◽  
Static Loading ◽  
Linear Viscoelasticity ◽  
Loss Factor ◽  
Three Dimensional ◽  
Dynamic Modelling ◽  
Experimental Characterization ◽  
Infinite Time ◽  
Aortic Prosthesis

In case of direction-dependent viscoelasticity, a simplified formulation of the three-dimensional quasi-linear viscoelasticity has been obtained manipulating the original Fung equation. The experimental characterization of the static hyperelastic behaviour, the relaxation, the dynamic modulus and the loss factor of woven Dacron from a commercial aortic prosthesis has been performed. An 11 % difference of the reduced relaxation (after infinite time) between axial and circumferential directions has been observed for the woven Dacron. A very large increase in stiffness is obtained in case of harmonic loading with respect to the static loading. These findings are particularly relevant for dynamic modelling of currently used aortic grafts.

Three dimensional sensitivity characterization of plasmonic nanorods for refractometric biosensors

Nanoscale ◽  
2016 ◽  
Vol 8 (5) ◽  
pp. 2974-2981 ◽  
Author(s):  
V. Leitgeb ◽  
A. Trügler ◽  
S. Köstler ◽  
M. K. Krug ◽  
U. Hohenester ◽  
...  
Keyword(s):  
Refractive Index ◽  
Three Dimensional ◽  
Three Dimensions ◽  
Experimental Characterization ◽  
Refractive Index Sensitivity ◽  
Index Sensitivity ◽  
Local Refractive Index ◽  
Plasmonic Particles

The work shows an extensive experimental characterization of the local refractive index sensitivity of plasmonic particles in three dimensions.

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