A new ultrasonic electrochemical potential activation method to enhance the adhesion strength between electroforming layer and Cu substrate

2021 ◽  
pp. 1-12
Author(s):  
Zhong Zhao ◽  
Qing Zhang ◽  
Pengcheng Zhu
Keyword(s):  
Adhesion Strength ◽  
Electrochemical Potential ◽  
Activation Method ◽  
Cu Substrate

Effect of dislocation density on adhesion strength of electroforming Ni layer on Cu substrate

2018 ◽  
Vol 33 (3) ◽  
pp. 301-313
Author(s):  
Zhong Zhao ◽  
Pengcheng Zhu ◽  
Linchu Yang ◽  
Yaoxiang Geng
Keyword(s):  
Dislocation Density ◽  
Adhesion Strength ◽  
Cu Substrate

Composition and heat-treatment effects on the adhesion strength of Sn-Zn-Al solders on Cu substrate

JOM ◽  
2000 ◽  
Vol 52 (6) ◽  
pp. 36-39 ◽  
Author(s):  
Shan-Pu Yu ◽  
Min-Hsiung Hon ◽  
Hsin-Chien Wang ◽  
Moo-Chin Wang
Keyword(s):  
Heat Treatment ◽  
Adhesion Strength ◽  
Treatment Effects ◽  
Cu Substrate

Microstructure and adhesion strength of Sn–9Zn–xAg lead-free solders wetted on Cu substrate

2006 ◽  
Vol 429 (1-2) ◽  
pp. 36-42 ◽  
Author(s):  
Tao-Chih Chang ◽  
Shih-Min Chou ◽  
Min-Hsiung Hon ◽  
Moo-Chin Wang
Keyword(s):  
Adhesion Strength ◽  
Lead Free ◽  
Cu Substrate ◽  
Lead Free Solders

Microstructure and adhesion properties of Sn–0.7Cu/Cu solder joints

2002 ◽  
Vol 17 (4) ◽  
pp. 743-746 ◽  
Author(s):  
Kyoo-Sik Bae ◽  
Si-Jung Kim
Keyword(s):  
Aging Time ◽  
Adhesion Strength ◽  
Joint Strength ◽  
Solder Joints ◽  
Adhesion Properties ◽  
Cu Substrate

The microstructure and adhesion strength of the Sn–0.7Cu/Cu solder joints were examined. The acicular η(Cu6Sn5)-phase was formed inside the solder and at the solder/Cu interface, mostly in the direction normal to the interface. Compared to the Sn–3.5Ag alloy, the Sn–0.7Cu solder showed comparable wettability, but lower microhardness and joint strength. After aging, the acicular η-phase grew into a round and scallop-shaped morphology, thin є(Cu3Sn)-phase evolved just above the Cu substrate, and the joint strength decreased linearly with aging time.

scholarly journals Microstructure, adhesion strength and thermal conductivity of AlN/(Ti, W)/Cu substrate system

2020 ◽  
Vol 7 (10) ◽  
pp. 106404
Author(s):  
Yingfei Lin ◽  
Yangyang Hao ◽  
Jianning Lu ◽  
Tianlong Liu
Keyword(s):  
Thermal Conductivity ◽  
Adhesion Strength ◽  
Cu Substrate

Formation of intermetallic compounds at eutectic Sn–Zn–Al solder/Cu interface

2001 ◽  
Vol 16 (1) ◽  
pp. 76-82 ◽  
Author(s):  
Shan-Pu Yu ◽  
Moo-Chin Wang ◽  
Min-Hsiung Hon
Keyword(s):  
Electron Microscope ◽  
Electron Diffraction ◽  
Intermetallic Compounds ◽  
Adhesion Strength ◽  
Heating Time ◽  
Electron Diffraction Analysis ◽  
Cu Substrate ◽  
Transmission Electron ◽  
Kirkendall Voids ◽  
Scanning Electron

The eutectic Sn–Zn–Al solder alloy was used [composition: 91Sn–9(5Al–Zn)] to investigate the intermetallic compounds (IMCs) formed between solder and a Cu substrate. Scanning electron microscope, transmission electron microscope, and electron diffraction analysis were used to study the IMCs between solder and a Cu substrate. The γ–Cu5Zn8 and γ–Cu9Al4 IMCs were found at the Sn–Zn–Al/Cu interface. Thermodynamic calculation can explain the formation of γ–Cu5Zn8 and γ–Cu9Al4 IMCs instead of Cu–Sn compounds. The formation and growth of γ–Cu9Al4 IMC at 423 K resulted in the decrease of adhesion strength at the interface of solder and a Cu substrate, where the Kirkendall voids were severely formed. As the heating time increased up to 1000 h at 423 K, the adhesion strength between the eutectic Sn–Zn–Al solder and a Cu substrate decreased from 7.6 ± 0.7 MPa to 4.4 ± 0.8 MPa.

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