scholarly journals The role of electric current in the formation of white-etching-cracks

Author(s):  
P.-Y. Tung ◽  
E. McEniry ◽  
M. Herbig
2021 ◽  
Vol 12 (1) ◽  
Author(s):  
Licong Peng ◽  
Kosuke Karube ◽  
Yasujiro Taguchi ◽  
Naoto Nagaosa ◽  
Yoshinori Tokura ◽  
...  

AbstractDriving and controlling single-skyrmion motion promises skyrmion-based spintronic applications. Recently progress has been made in moving skyrmionic bubbles in thin-film heterostructures and low-temperature chiral skyrmions in the FeGe helimagnet by electric current. Here, we report the motion tracking and control of a single skyrmion at room temperature in the chiral-lattice magnet Co9Zn9Mn2 using nanosecond current pulses. We have directly observed that the skyrmion Hall motion reverses its direction upon the reversal of skyrmion topological number using Lorentz transmission electron microscopy. Systematic measurements of the single-skyrmion trace as a function of electric current reveal a dynamic transition from the static pinned state to the linear flow motion via a creep event, in agreement with the theoretical prediction. We have clarified the role of skyrmion pinning and evaluated the intrinsic skyrmion Hall angle and the skyrmion velocity in the course of the dynamic transition. Our results pave a way to skyrmion applications in spintronic devices.


1997 ◽  
Vol 40-41 ◽  
pp. 699-704
Author(s):  
T. Sakai ◽  
K. Kobayashi ◽  
M. Sato

2021 ◽  
Vol 5 (4) ◽  
pp. 119
Author(s):  
Romaric Collet ◽  
Sophie Le Gallet ◽  
Frédéric Charlot ◽  
Sabine Lay ◽  
Jean-Marc Chaix ◽  
...  

When a current is involved, as in spark plasma sintering, metallic powders are heated by the Joule effect through both tool and specimen. Other mechanisms might occur, but it is difficult to separate the role of the temperature from the role of the current inside the sample as, in most cases, the two parameters are not controlled independently. In this paper, the consolidation and the densification of a pure copper powder were studied in three configurations for obtaining different electric current paths: (i) current flowing through both the powder and the die, (ii) current forced into the powder and (iii) no current allowed in the powder. Electrical conductivity measurements showed that even low-density samples displayed higher conductivities than graphite by several orders of magnitude. FEM simulations confirmed that these copper specimens were mainly heated by the graphite punches. No modification of the microstructure by the flow of current could be observed. However, the absence of current in the specimen led to a decrease in densification. No significant temperature difference was modeled between the configurations, suggesting that differences are not linked to a thermal cause but rather to a current effect.


2006 ◽  
Vol 30 (5) ◽  
pp. 306-309 ◽  
Author(s):  
N. Leitgeb ◽  
J. Schroettner ◽  
R. Cech

Metals ◽  
2018 ◽  
Vol 8 (7) ◽  
pp. 538 ◽  
Author(s):  
Dina Dudina ◽  
Alexander Matvienko ◽  
Anatoly Sidelnikov ◽  
Mikhail Legan ◽  
Vyacheslav Mali ◽  
...  

Pulsed electric current can be used for the fast sintering of powders as well as joining of macroobjects. In this work, we brazed copper plates using a silver layer that was formed in situ by the decomposition of a silver oxalate Ag2C2O4 powder placed between the plates. Joining was conducted in the chamber of a Spark Plasma Sintering (SPS) facility with and without a graphite die. In the die-assisted tooling configuration, indirect heating of the assembly from the graphite die carrying electric current occurred until the brazing layer transformed into metallic silver. The passage of electric current through a Cu/Ag2C2O4/Cu stack placed between the electrodes without a die was possible because of the formation of Cu/Cu contacts in the areas free from the Ag2C2O4 particles. Joints that were formed in the die-assisted experiments showed a slightly higher shear strength (45 MPa) in comparison with joints formed without a die (41 MPa). The shear strength of the reference sample (obtained without a die), a stack of copper plates joined without any brazing layer, was only 31 MPa, which indicates a key role of the silver in producing strong bonding between the plates. This study shows that both die-assisted tooling configurations and those without a die can be used for the SPS brazing of materials by the oxalate-derived silver interlayer.


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