scholarly journals Ductility Sensitivity to Stacking Fault Energy and Grain Size in Cu–Al Alloys

2016 ◽  
Vol 4 (2) ◽  
pp. 112-117 ◽  
Author(s):  
Yanzhong Tian ◽  
Akinobu Shibata ◽  
Zhefeng Zhang ◽  
Nobuhiro Tsuji
2015 ◽  
Vol 2015 ◽  
pp. 1-12 ◽  
Author(s):  
Ehab A. El-Danaf ◽  
Mahmoud S. Soliman ◽  
Ayman A. Al-Mutlaq

The effect of grain size and stacking fault energy (SFE) on the strain hardening rate behavior under plane strain compression (PSC) is investigated for pure Cu and binary Cu-Al alloys containing 1, 2, 4.7, and 7 wt. % Al. The alloys studied have a wide range of SFE from a low SFE of 4.5 mJm−2for Cu-7Al to a medium SFE of 78 mJm−2for pure Cu. A series of PSC tests have been conducted on these alloys for three average grain sizes of ~15, 70, and 250 μm. Strain hardening rate curves were obtained and a criterion relating twinning stress to grain size is established. It is concluded that the stress required for twinning initiation decreases with increasing grain size. Low values of SFE have an indirect influence on twinning stress by increasing the strain hardening rate which is reflected in building up the critical dislocation density needed to initiate mechanical twinning. A study on the effect of grain size on the intensity of the brass texture component for the low SFE alloys has revealed the reduction of the orientation density of that component with increasing grain size.


2019 ◽  
Vol 34 (13) ◽  
pp. 2398-2405
Author(s):  
Yusheng Li ◽  
Liangjuan Dai ◽  
Yang Cao ◽  
Yonghao Zhao ◽  
Yuntian Zhu

Abstract


2010 ◽  
Vol 667-669 ◽  
pp. 379-384 ◽  
Author(s):  
X.H. An ◽  
Shi Ding Wu ◽  
Z.F. Zhang

The microstructural evolution and grain refinement of Cu-Al alloys with different stacking fault energies (SFEs) processed by equal-channel angular pressing (ECAP) were investigated. The grain refinement mechanism was gradually transformed from dislocation subdivision to twin fragmentation with tailoring the SFE of Cu-Al alloys. Concurrent with the transition of grain refinement mechanism, the grain size can be refined into from ultrafine region (1 m~100 nm) to the nanoscale (<100 nm) and then it is found that the minimum equilibrium grain size decreases in a roughly linear way with lowering the SFE. Moreover, in combination with the previous results, it is proposed that the formation of a uniform ultrafine microstructure can be formed more readily in the materials with high SFE due to their high recovery rate of dislocations and in the materials with low SFE due to the easy formation of a homogeneously-twinned microstructure.


2009 ◽  
Vol 24 (12) ◽  
pp. 3636-3646 ◽  
Author(s):  
Xianghai An ◽  
Qingyun Lin ◽  
Shen Qu ◽  
Gang Yang ◽  
Shiding Wu ◽  
...  

X-ray diffraction (XRD) and transmission electron microscope (TEM) investigations have been carried out to decode the influence of stacking-fault energy (SFE) on the accommodation of large shear deformation in Cu-Al alloys subjected to one-pass equal-channel angular pressing. XRD results exhibit that the microstrain and density of dislocations initially increased with the reduction in the SFE, whereas they sharply decreased with a further decrease in SFE. By systematic TEM observations, we noticed that the accommodation mechanism of intense shear strain was gradually transformed from dislocation slip to deformation twin when SFE was lowered. Meanwhile, twin intersections and internal twins were also observed in the Cu-Al alloy with extremely low SFE. Due to the large external plastic deformation, microscale shear bands, as an inherent deformation mechanism, are increasingly significant to help carry the high local plasticity because low SFE facilitates the formation of shear bands.


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