FTIR analysis of PZT damage during wafer level transfer of thermo-piezoelectric SI3N4 cantilevers on the CMOS-wafer for nano data storage applications

2007 ◽  
Vol T129 ◽  
pp. 213-217
Author(s):  
Young-sik Kim ◽  
WonHyeok Jin ◽  
Sung Hoon Ahn ◽  
Caroline Sunyong Lee
Keyword(s):  
Data Storage ◽  
Ftir Analysis ◽  
Wafer Level ◽  
Wafer Level Transfer

Wafer-Level Transfer of Thermo-Piezoelectric Si>inf/infinf/inf

2006 ◽  
Author(s):  
Young-Sik Kim ◽  
Hyo-Jin Nam ◽  
SeongSoo Jang ◽  
Caroline Sunyong Lee ◽  
Won-Hyeog Jin ◽  
...  
Keyword(s):  
Data Storage ◽  
High Density ◽  
Cmos Circuit ◽  
Wafer Level ◽  
Cantilever Array ◽  
Wafer Level Transfer ◽  
Density Probe

Investigation of PZT Damage during Wafer-Level Bonding of Thermo-Piezoelectric Cantilevers with CMOS Wafers for Probe-Based Data Storage

2007 ◽  
Vol 51 (4) ◽  
pp. 1374 ◽  
Author(s):  
Caroline Sunyong Lee ◽  
Hyo-Jin Nam ◽  
Sung-Soo Jang ◽  
Il-Joo Cho ◽  
Jong-Uk Bu
Keyword(s):  
Data Storage ◽  
Wafer Level ◽  
Piezoelectric Cantilevers

Low Warpage Wafer Level Transfer Molding Post 3D Die to Wafer Assembly

2016 ◽  
Author(s):  
Francisco Cadacio ◽  
Teng Wang ◽  
Abdellah Salahouelhadj ◽  
Giovanni Capuz ◽  
Goedele Potoms ◽  
...  
Keyword(s):  
Wafer Level ◽  
Transfer Molding ◽  
Wafer Level Transfer

RECENT PROGRESSES OF APPLICATION-ORIENTED MEMS THROUGH INDUSTRY-UNIVERSITY COLLABORATION

2006 ◽  
Vol 16 (02) ◽  
pp. 693-704
Author(s):  
MASAYOSHI ESASHI
Keyword(s):  
Data Storage ◽  
Conductive Polymer ◽  
Small Diameter ◽  
Recording Media ◽  
Wafer Level ◽  
Practical Applications ◽  
Wafer Level Packaging ◽  
Electron Field ◽  
Press Molding ◽  
Electron Field Emitter

MEMS research has been carried out through industry-university (Tohoku) collaboration for practical applications. Sophisticated devices such as electrostatically levitated rotational gyroscope, MEMS relay for wafer level packaging, array MEMS including multi-probe data storage and multi-column electron beam lithography system, small diameter fiber optic pressure sensor and SiC micro structure or glass press molding, have been developed. Electrical feedthroughs in glass play important role in the wafer level packaging and array MEMS. Materials such as conductive polymer for recording media, carbon nanotube for electron field emitter, SiC for harsh environment are used in these MEMS because of their unique features.

Wafer-Level Transfer Technologies for PZT-Based RF MEMS Switches

2010 ◽  
Vol 19 (3) ◽  
pp. 548-560 ◽  
Author(s):  
Roland Guerre ◽  
Ute Drechsler ◽  
Debabrata Bhattacharyya ◽  
Pekka Rantakari ◽  
Richard Stutz ◽  
...  
Keyword(s):  
Rf Mems ◽  
Wafer Level ◽  
Mems Switches ◽  
Rf Mems Switches ◽  
Wafer Level Transfer
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