Ti/Si interface enabling complementary metal oxide semiconductor compatible, high reliable bonding for inter-die micro-fluidic cooling for future advanced 3D integrated circuit integration
2020 ◽
Vol 30
(10)
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pp. 105005
2019 ◽
Vol 19
(10)
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pp. 6473-6480
2015 ◽
Vol 9
(3)
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pp. 221-226
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2019 ◽
Vol 30
(12)
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pp. 945-950
2021 ◽
Vol 2108
(1)
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pp. 012034
2008 ◽
Vol 47
(5)
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pp. 3384-3389
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