Single-pulse laser-electron collision within a micro-channel plasma target

2019 ◽  
Vol 61 (6) ◽  
pp. 065019 ◽  
Author(s):  
L L Ji ◽  
J Snyder ◽  
B F Shen
Keyword(s):  
Pulse Laser ◽  
Single Pulse ◽  
Electron Collision ◽  
Micro Channel ◽  
Plasma Target

scholarly journals Thermal dynamic analysis of picosecond and nanosecond single pulse laser flash-heating of Al/NC nanoenergetic composites

2009 ◽  
Vol 58 (1) ◽  
pp. 655
Author(s):  
Peng Ya-Jing ◽  
Liu Yu-Qiang ◽  
Wang Ying-Hui ◽  
Zhang Shu-Ping ◽  
Yang Yan-Qiang
Keyword(s):  
Dynamic Analysis ◽  
Pulse Laser ◽  
Single Pulse ◽  
Laser Flash

MRR Prediction in Micro Channel Grooving Process by Ultra-Fast Pulse Laser

2013 ◽  
Vol 318 ◽  
pp. 350-355
Author(s):  
Gang Chang ◽  
Yi Liu Tu
Keyword(s):  
Pulse Laser ◽  
Integrated Model ◽  
Machining Process ◽  
Machining Efficiency ◽  
Micro Channel ◽  
Design Requirement ◽  
Machining Quality ◽  
Suitable Parameter ◽  
Nano Channel ◽  
Fast Pulse

Ultra-fast pulse laser is a popular tool in the Micro/nano channel fabrication. The final machining result is affected by numerous factors. To fulfill the design requirement and obtain a satisfactory machining quality and accuracy, screening the suitable parameter combination before experiment can save time and cost. This paper uses an integrated model of five prominent engineer parameters in a grooving process to plan the machining process. Additionally, some parameters in the model are adjustable during the machining process, the machining efficiency and fine finish are balanced due to prediction the evolution of the grooving.

Numerical Study on Bending Behavior of Copper Alloy Thin Plate by Single Pulse Laser

2014 ◽  
Vol 1003 ◽  
pp. 113-116
Author(s):  
Su Qin Jiang ◽  
Ai Hui Liu ◽  
Xue Ting Wang ◽  
Jian Hua Wu ◽  
Bo Kui Li
Keyword(s):  
Thin Plate ◽  
Pulse Laser ◽  
Copper Alloy ◽  
Numerical Study ◽  
Dynamic Change ◽  
Single Pulse ◽  
Coupling Model ◽  
Laser Forming ◽  
Bottom Surface ◽  
Mechanical Coupling

To study the bending characteristics of copper alloy thin plate by single pulse laser, the thermal mechanical coupling model of pulsed laser forming (PLF) was established; the dynamic change and steady distribution for the fields of temperature, stress& strain and displacement were analyzed. The results show n that during the pulse laser heating stage, the temperature gradient along the thickness direction is far less than that of the heat affected zone; due to the constraints of materials around the heating field, the compressive stress and negative strain are appeared, the cantilever end of sample produces warping deformations; in the cooling stage, the temperature of top and bottom surface material drops rapidly, the sample is with a negative bending and reduced deformation. This is related to the transferring of the stress change and the recovery of part of the elastic deformation in heating area.

Single-pulse laser-induced decomposition of trifluoromethylsilane

1991 ◽  
Vol 178 (2-3) ◽  
pp. 192-196 ◽  
Author(s):  
J. Pola ◽  
H. Beckers ◽  
H. Bürger
Keyword(s):  
Pulse Laser ◽  
Single Pulse ◽  
Induced Decomposition

The structure and photoconductivity of SiGe/Si epitaxial layers modified by single-pulse laser radiation

2014 ◽  
Vol 40 (12) ◽  
pp. 1042-1044
Author(s):  
G. D. Ivlev ◽  
N. M. Kazuchits ◽  
S. L. Prakopyeu ◽  
M. S. Rusetsky ◽  
P. I. Gaiduk
Keyword(s):  
Laser Radiation ◽  
Pulse Laser ◽  
Single Pulse ◽  
Epitaxial Layers ◽  
Pulse Laser Radiation
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