Study on onset of nucleate boiling with screw tube for fusion reactor application

2021 ◽  
Author(s):  
Ji Hwan Lim ◽  
Minkyu Park
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Flow Boiling ◽  
Nucleate Boiling ◽  
High Heat ◽  
Transfer Mechanism ◽  
High Heat Flux ◽  
Heat Transfer Mechanism ◽  
System Parameters ◽  
Smooth Tubes

Abstract The onset of nucleate boiling (ONB) is the point at which the heat transfer mechanism in fluids changes and is one of the thermo-hydraulic factors that must be considered when establishing a cooling system operation strategy. Because the high heat flux of several MW/m2, which is loaded within a tokamak, is applied under a one-side heating condition, it is necessary to determine a correlative relation that can predict ONB under special heating conditions. In this study, the ONB of a one-side-heated screw tube was experimentally analyzed via a subcooled flow boiling experiment. The helical nut structure of the screw tube flow path wall allows for improved heat transfer performance relative to smooth tubes, providing a screw tube with a 53.98% higher ONB than a smooth tube. The effects of the system parameters on the ONB heat flux were analyzed based on the changes in the heat transfer mechanism, with the results indicating that the flow rate and degree of subcooling are proportional to the ONB heat flux because increasing these factors improves the forced convection heat transfer and increases the condensation rate, respectively. However, it was observed that the liquid surface tension and latent heat decrease as the pressure increases, leading to a decrease in the ONB heat flux. An evaluation of the predictive performance of existing ONB correlations revealed that most have high error rates because they were developed based on ONB experiments on micro-channels or smooth tubes and not under one-side high heat load conditions. To address this, we used dimensional analysis based on Python code to develop new ONB correlations that reflect the influence of system parameters.

Flow Boiling Enhancement in Microchannels With Diffusion Bonded Wire Mesh

2007 ◽  
Author(s):  
Hailei Wang ◽  
Richard Peterson
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Flow Boiling ◽  
Nucleate Boiling ◽  
High Heat ◽  
Wire Mesh ◽  
Working Fluid ◽  
High Heat Flux ◽  
Vapor Quality ◽  
Heating Wall

Flow boiling and heat transfer enhancement in four parallel microchannels using a dielectric working fluid, HFE 7000, was investigated. Each channel was 1000 μm wide and 510 μm high. A unique channel surface enhancement technique via diffusion bonding a layer of conductive fine wire mesh onto the heating wall was developed. According to the obtained flow boiling curves for both the bare and mesh channels, the amount of wall superheat was significantly reduced for the mesh channel at all stream-wise locations. This indicated that the nucleate boiling in the mesh channel was enhanced due to the increase of nucleation sites the mesh introduced. Both the nucleate boiling dominated and convective evaporation dominated regimes were identified. In addition, the overall trend for the flow boiling heat transfer coefficient, with respect to vapor quality, was increasing until the vapor quality reached approximately 0.4. The critical heat flux (CHF) for the mesh channel was also significantly higher than that of the bare channel in the low vapor quality region. Due to the fact of how the mesh was incorporated into the channels, no pressure drop penalty was identified for the mesh channels. Potential applications for this kind of mesh channel include high heat-flux electronic cooling systems and various energy conversion systems.

Enhanced Flow Boiling Over Open Microchannels With Uniform and Tapered Gap Manifolds

2013 ◽  
Vol 135 (6) ◽  
Author(s):  
Satish G. Kandlikar ◽  
Theodore Widger ◽  
Ankit Kalani ◽  
Valentina Mejia
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Heat Transfer Performance ◽  
Flow Boiling ◽  
Nucleate Boiling ◽  
High Heat ◽  
High Heat Flux ◽  
Transfer Performance ◽  
Transfer Coefficients ◽  
Heat Transfer Coefficients

Flow boiling in microchannels has been extensively studied in the past decade. Instabilities, low critical heat flux (CHF) values, and low heat transfer coefficients have been identified as the major shortcomings preventing its implementation in practical high heat flux removal systems. A novel open microchannel design with uniform and tapered manifolds (OMM) is presented to provide stable and highly enhanced heat transfer performance. The effects of the gap height and flow rate on the heat transfer performance have been experimentally studied with water. The critical heat fluxes (CHFs) and heat transfer coefficients obtained with the OMM are significantly higher than the values reported by previous researchers for flow boiling with water in microchannels. A record heat flux of 506 W/cm2 with a wall superheat of 26.2 °C was obtained for a gap size of 0.127 mm. The CHF was not reached due to heater power limitation in the current design. A maximum effective heat transfer coefficient of 290,000 W/m2 °C was obtained at an intermediate heat flux of 319 W/cm2 with a gap of 0.254 mm at 225 mL/min. The flow boiling heat transfer was found to be insensitive to flow rates between 40–333 mL/min and gap sizes between 0.127–1.016 mm, indicating the dominance of nucleate boiling. The OMM geometry is promising to provide exceptional performance that is particularly attractive in meeting the challenges of high heat flux removal in electronics cooling applications.

scholarly journals Boiling Heat Transfer Performance of Parallel Porous Microchannels

Energies ◽  
2020 ◽  
Vol 13 (11) ◽  
pp. 2970
Author(s):  
Donghui Zhang ◽  
Haiyang Xu ◽  
Yi Chen ◽  
Leiqing Wang ◽  
Jian Qu ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Boiling Heat Transfer ◽  
Flow Boiling ◽  
Nucleate Boiling ◽  
High Heat ◽  
High Heat Flux ◽  
Transfer Coefficients ◽  
Heat Transfer Coefficients ◽  
Boiling Process

Flow boiling in microporous layers has attracted a great deal of attention in the enhanced heat transfer field due to its high heat dissipation potential. In this study, flow boiling experiments were performed on both porous microchannels and a copper-based microchannel, using water as the coolant. As the heat flux was less than 80 W/cm2, the porous microchannels presented significantly higher boiling heat transfer coefficients than the copper-based microchannel. This was closely associated with the promotion of the nucleation site density of the porous coating. With the further increase in heat flux, the heat transfer coefficients of the porous microchannels were close to those of the copper-based sample. The boiling process in the porous microchannel was found to be dominated by the nucleate boiling mechanism from low to moderate heat flux (<80 W/cm2).This switched to the convection boiling mode at high heat flux. The porous samples were able to mitigate flow instability greatly. A visual observation revealed that porous microchannels could suppress the flow fluctuation due to the establishment of a stable nucleate boiling process. Porous microchannels showed no advantage over the copper-based sample in the critical heat flux. The optimal thickness-to-particle-size ratio (δ/d) for the porous microchannel was confirmed to be between 2–5. In this range, the maximum enhanced effect on boiling heat transfer could be achieved.

scholarly journals High heat flux flow boiling of refrigerant R236fa in parallel microchannels

2019 ◽  
Vol 196 ◽  
pp. 00062
Author(s):  
Vladimir Kuznetsov ◽  
Alisher Shamirzaev ◽  
Alexander Mordovskoy
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Flow Boiling ◽  
Nucleate Boiling ◽  
High Heat ◽  
Heat Fluxes ◽  
High Heat Flux ◽  
Flux Flow ◽  
Microchannel Heat Exchanger ◽  
Parallel Microchannels

This paper presents the results of an experimental study of the heat transfer during flow boiling of refrigerant R236fa in a horizontal microchannel heat sink. The experiments were performed using closed loop that re-circulates coolant. Microchannel heat exchanger that contains two microchannels with 2x0.4 mm cross-section was used as the test section. The dependence of average heat flux on wall superheat and critical heat flux were measured in the range of mass fluxes from 600 to 1600 kg/m2s and in the range of heat fluxes from 5 to 120 W/cm2. For heat flux greater than 60 W/cm2, nucleate boiling suppression has significant effect on the flow boiling heat transfer, and this leads to decrease of the heat transfer coefficient with heat flux grows.

Heat Transfer Enhancement in Compact Phase Change Microchannel Heat Exchangers for High Flux Laser Diodes

2018 ◽  
Author(s):  
Jensen Hoke ◽  
Todd Bandhauer ◽  
Jack Kotovsky ◽  
Julie Hamilton ◽  
Paul Fontejon
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Phase Change ◽  
Flow Boiling ◽  
Laser Diodes ◽  
High Heat ◽  
Heat Fluxes ◽  
High Heat Flux ◽  
Maximum Heat ◽  
Average Maximum

Liquid-vapor phase change heat transfer in microchannels offers a number of significant advantages for thermal management of high heat flux laser diodes, including reduced flow rates and near constant temperature heat rejection. Modern laser diode bars can produce waste heat loads >1 kW cm−2, and prior studies show that microchannel flow boiling heat transfer at these heat fluxes is possible in very compact heat exchanger geometries. This paper describes further performance improvements through area enhancement of microchannels using a pyramid etching scheme that increases heat transfer area by ∼40% over straight walled channels, which works to promote heat spreading and suppress dry-out phenomenon when exposed to high heat fluxes. The device is constructed from a reactive ion etched silicon wafer bonded to borosilicate to allow flow visualization. The silicon layer is etched to contain an inlet and outlet manifold and a plurality of 40μm wide, 200μm deep, 2mm long channels separated by 40μm wide fins. 15μm wide 150μm long restrictions are placed at the inlet of each channel to promote uniform flow rate in each channel as well as flow stability in each channel. In the area enhanced parts either a 3μm or 6μm sawtooth pattern was etched vertically into the walls, which were also scalloped along the flow path with the a 3μm periodicity. The experimental results showed that the 6μm area-enhanced device increased the average maximum heat flux at the heater to 1.26 kW cm2 using R134a, which compares favorably to a maximum of 0.95 kw cm2 dissipated by the plain walled test section. The 3μm area enhanced test sections, which dissipated a maximum of 1.02 kW cm2 showed only a modest increase in performance over the plain walled test sections. Both area enhancement schemes delayed the onset of critical heat flux to higher heat inputs.

High heat flux flow boiling in silicon multi-microchannels – Part I: Heat transfer characteristics of refrigerant R236fa

2008 ◽  
Vol 51 (21-22) ◽  
pp. 5400-5414 ◽  
Author(s):  
Bruno Agostini ◽  
John Richard Thome ◽  
Matteo Fabbri ◽  
Bruno Michel ◽  
Daniele Calmi ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Flow Boiling ◽  
High Heat ◽  
High Heat Flux ◽  
Heat Transfer Characteristics ◽  
Flux Flow ◽  
Transfer Characteristics

Contribution of Microlayer Evaporation During Flow Boiling Inside Microchannels

2008 ◽  
Author(s):  
A. Mukherjee
Keyword(s):  
Thin Film ◽  
Heat Transfer ◽  
Flow Boiling ◽  
Nucleate Boiling ◽  
Transfer Mechanism ◽  
Heat Transfer Mechanism ◽  
Cross Sectional ◽  
Thin Film Evaporation ◽  
Nucleate Boiling Heat Transfer ◽  
Microlayer Evaporation

Flow boiling through microchannels is characterized by nucleation and growth of vapor bubbles that fills the entire channel cross-sectional area. As the bubble nucleates and grows inside the microchannel, a thin film of liquid or a microlayer gets trapped between the bubble and the channel walls. The heat transfer mechanism present at the channel walls during flow boiling is studied numerically. These mechanisms are compared to the heat transfer mechanisms present during nucleate boiling and in a moving evaporating meniscus. It is shown that the thermal and the flow fields present inside the microchannels around the bubbles are fundamentally different compared to nucleate boiling or in a moving evaporating meniscus. It is explained that how thin film evaporation is responsible for creating an apparent nucleate boiling heat transfer mechanism inside the microchannels.

Nucleate Boiling of Dielectric Liquids on Hydrophobic Patterned Surfaces

2014 ◽  
Author(s):  
Nihal E. Joshua ◽  
Denesh K. Ajakumar ◽  
Huseyin Bostanci
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Nucleate Boiling ◽  
High Heat ◽  
Copper Surface ◽  
Dielectric Liquid ◽  
Working Fluid ◽  
Patterned Surfaces ◽  
High Heat Flux ◽  
Dielectric Liquids

This study experimentally investigated the effect of hydrophobic patterned surfaces in nucleate boiling heat transfer. A dielectric liquid, HFE-7100, was used as the working fluid in the saturated boiling tests. Dielectric liquids are known to have highly-wetting characteristics. They tend to fill surface cavities that would normally trap vapor/gas, and serve as active nucleation sites during boiling. With the lack of these vapor filled cavities, boiling of a dielectric liquid leads to high incipience superheats and accompanying temperature overshoots. Heater samples in this study were prepared by applying a thin Teflon (AF400, Dupont) coating on 1-cm2 smooth copper surfaces following common photolithography techniques. Matching size thick film resistors, attached onto the copper samples, generated heat and simulated high heat flux electronic devices. Tests investigated the heater samples featuring circular pattern sizes between 40–100 μm, and corresponding pitch sizes between 80–200 μm. Additionally, a plain, smooth copper surface was tested to obtain reference data. Based on data, hydrophobic patterned surfaces effectively eliminated the temperature overshoot at boiling incipience, and considerably improved nucleate boiling performance in terms of heat transfer coefficient and critical heat flux over the reference surface. Hydrophobic patterned surfaces therefore demonstrated a practical surface modification method for heat transfer enhancement in immersion cooling applications.

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