Diffusion Bonding Technology of Tungsten and SiC/SiC Composites for Nuclear Applications

2011 ◽  
Vol 18 (16) ◽  
pp. 162015 ◽  
Author(s):  
Hirotatsu Kishimoto ◽  
Tamaki Shibayama ◽  
Takahiro Abe ◽  
Kazuya Shimoda ◽  
Satoshi Kawamura ◽  
...  
Keyword(s):  
Diffusion Bonding ◽  
Bonding Technology ◽  
Sic Composites ◽  
Nuclear Applications

Manufacturing of Aerospace Parts with Diffusion Bonding Technology

2011 ◽  
Vol 87 ◽  
pp. 182-185 ◽  
Author(s):  
Ho Sung Lee ◽  
Jong Hoon Yoon ◽  
Joon Tae Yoo
Keyword(s):  
Combustion Chamber ◽  
Diffusion Bonding ◽  
Thin Sheet ◽  
Bonding Process ◽  
Microstructure Development ◽  
Aerospace Materials ◽  
Bonding Technology

The objective of this study is to manufacture aerospace components with diffusion bonding technology. Examples produced with this technology consist of thin-sheet diffusion bonding and massive diffusion bonding. The mechanism of diffusion bonding process was presented with schematic microstructure development. Aerospace parts include titanium tanks and a scaled combustion chamber with bonded steel and copper. The microstructure of bonded region shows no indication of heterogeneous phases at interface. It is shown that the diffusion bonding of aerospace materials was successfully performed to manufacture lightweight aerospace parts.

Efficient Diffusion Bonding between BSCCO Superconducting Multifilamentary Tapes

2008 ◽  
Vol 580-582 ◽  
pp. 295-298
Author(s):  
Gui Sheng Zou ◽  
Yan Ju Wang ◽  
Ai Ping Wu ◽  
Hai Lin Bai ◽  
Nai Jun Hu ◽  
...  
Keyword(s):  
High Temperature ◽  
Diffusion Bonding ◽  
New Technology ◽  
Bonding Temperature ◽  
Interface Bonding ◽  
Bonding Pressure ◽  
Bonding Parameters ◽  
Efficient Diffusion ◽  
Bonding Technology ◽  
Multifilamentary Tapes

To improve the joining efficiency of Bi-Sr-Ca-Cu-O ( BSCCO) superconducting tapes, a new diffusion bonding technology with a direct uniaxial pressing at high temperature was developed to join 61-filament tapes. It was observed that bonding parameters such as bonding pressure and holding time, significantly affected the critical current ratio (CCRo). A peak CCRo value of 89 % for the lap-joined tapes was achieved at 3 MPa for 2 h when bonding temperature was 800 °C. Compared with the conventional diffusion bonding technology, this new technology remarkably shortened the fabrication period and improved the superconductivity of the joints. The bonding interface and microstructures of the joints were evaluated and correlated to the CCRo. An uniaxial pressing at high temperature was beneficial to interface bonding, and there was an optimal pressure value for the CCRo.

scholarly journals Fabrication of AZ91/SiC Composites by Accumulated Diffusion Bonding Process

2016 ◽  
Vol V5 (12) ◽  
Author(s):  
V. Sivaramakrishnan ◽  
M. Rajamuthamilselvan ◽  
S. Ramanathan ◽  
Keyword(s):  
Diffusion Bonding ◽  
Bonding Process ◽  
Sic Composites
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