scholarly journals Fabrication of AZ91/SiC Composites by Accumulated Diffusion Bonding Process

2016 ◽  
Vol V5 (12) ◽  
Author(s):  
V. Sivaramakrishnan ◽  
M. Rajamuthamilselvan ◽  
S. Ramanathan ◽  
Keyword(s):  
Diffusion Bonding ◽  
Bonding Process ◽  
Sic Composites

Diffusion Bonding Technology of Tungsten and SiC/SiC Composites for Nuclear Applications

2011 ◽  
Vol 18 (16) ◽  
pp. 162015 ◽  
Author(s):  
Hirotatsu Kishimoto ◽  
Tamaki Shibayama ◽  
Takahiro Abe ◽  
Kazuya Shimoda ◽  
Satoshi Kawamura ◽  
...  
Keyword(s):  
Diffusion Bonding ◽  
Bonding Technology ◽  
Sic Composites ◽  
Nuclear Applications

Optimization of Process Parameters of Diffusing Bonding of Titanium with Titanium and Titanium with Copper

2013 ◽  
Vol 856 ◽  
pp. 153-158
Author(s):  
Kasigavi Chandrappa ◽  
Joel Hemanth
Keyword(s):  
Applied Stress ◽  
Diffusion Bonding ◽  
Bonding Temperature ◽  
Bonding Process ◽  
Micro Hardness ◽  
Hardness Testing ◽  
Cu Alloy ◽  
Optimization Of Process Parameters ◽  
Different Temperatures ◽  
Through Diffusion

The diffusion bonding of Ti to Ti, Ti-Cu alloy at different temperatures ranging from 673 K to 923 K under an applied stress of 100 MPa for 1 h was studied. The observation of the microstructure reveals that sound joints between the Ti-Ti and dissimilar titanium/Copper metals sheet were successfully joined by diffusion bonding process. Ti-Cu alloy without any pores or cracks can be achieved through diffusion bonding at temperatures over 873 K under the applied stress of 100 MPa for 1 h. The bond is composed of the zones, and its width increases with the increase of bonding temperature. The Micro hardness at the interface of joints bonded under different conditions was evaluated through Micro hardness testing and the fracture mode was analyzed by SEM observation.

Novel Method for Diffusion Bonding Superalloys and Aluminium Alloys (USA Patent 6,669,534 B2, European Patent Pending)

2005 ◽  
Vol 502 ◽  
pp. 431-436 ◽  
Author(s):  
A.A. Shirzadi ◽  
E.R. Wallach
Keyword(s):  
Diffusion Bonding ◽  
Aluminium Alloys ◽  
Transient Liquid Phase ◽  
Bonding Process ◽  
Metallic Alloys ◽  
European Patent ◽  
Sophisticated Equipment ◽  
Novel Method ◽  
Oxide Removal ◽  
Cobalt Base

A novel method for diffusion bonding metallic alloys with stable surface oxide films (e.g. nickel and cobalt base superalloys and aluminium alloys) has been developed. The stable oxides on the faying surfaces of these alloys are replaced, prior to the bonding process, with a very thin metallic layer and/or less stable oxides, using a proprietary non-chemical oxide removal method based on the use of gallium. This new method is very rapid and neither requires the use of any sophisticated equipment nor is a costly process. Bonding is then readily achieved by either solid-state or transient-liquid-phase (TLP) diffusion bonding. Using this method, bonds in nickelbase and cobalt-base superalloys with “virtually invisible” bond interfaces and bonds in aluminium alloys with strengths as high as those of the parent alloys can be produced.

Technologies of Joining between ITER Reference Grade Beryllium and Copper Alloys by Diffusion Bonding Process

1996 ◽  
Vol 30 (3P2A) ◽  
pp. 689-693 ◽  
Author(s):  
Eliseo Visca ◽  
Enrico Di Pietro ◽  
Giancarlo Ceccotti ◽  
Giovanni Mercurio
Keyword(s):  
Diffusion Bonding ◽  
Copper Alloys ◽  
Bonding Process

Modelling of Solid-State Diffusion Bonding with a Real Rough Surface

2005 ◽  
Vol 475-479 ◽  
pp. 3185-3188 ◽  
Author(s):  
G.Q. Wu ◽  
Z. Huang ◽  
Han Yun Li
Keyword(s):  
Theoretical Model ◽  
Solid State ◽  
Diffusion Bonding ◽  
Bonding Process ◽  
Solid State Diffusion ◽  
Diffusion Distance ◽  
State Diffusion ◽  
Definite Time ◽  
Visualization And Simulation ◽  
Bonding Surface

By using the real information of the intended bonding surface and considering the effect of the diffusion distance in a definite time, a new theoretical model for diffusion bonding was proposed. The model, reflecting the characteristic of real bonding process effectively, realizes the visualization and simulation of the bonding process in which many voids disappear dynamically. The results show that the simulation is close to those experimental results from the phenomena of voids closure.

Sign in / Sign up

Export Citation Format

Share Document