scholarly journals Quantum Interference in the Spin-Polarized Heavy Fermion CompoundCeB6: Evidence for Topological Deformation of the Fermi Surface in Strong Magnetic Fields

1998 ◽  
Vol 81 (4) ◽  
pp. 870-873 ◽  
Author(s):  
N. Harrison ◽  
D. W. Hall ◽  
R. G. Goodrich ◽  
J. J. Vuillemin ◽  
Z. Fisk
1988 ◽  
Vol 38 (16) ◽  
pp. 11221-11224 ◽  
Author(s):  
H. T. C. Stoof ◽  
L. P. H. de Goey ◽  
B. J. Verhaar ◽  
W. Glöckle

2019 ◽  
Vol 2 (1) ◽  
Author(s):  
D. Braithwaite ◽  
M. Vališka ◽  
G. Knebel ◽  
G. Lapertot ◽  
J.-P. Brison ◽  
...  

AbstractThe nearly ferromagnetic superconductor UTe2 shows several intriguing phenomena, including an extraordinary reinforcement of superconductivity in very strong magnetic fields. Here we show that pressure tunes the system to a more correlated state and probable magnetic order. The superconducting critical temperature is also strongly enhanced, reaching almost 3 K, a new record for U-based heavy fermion superconductors. Most spectacularly under pressure we find a transition within the superconducting state, putting UTe2 among the very rare systems having multiple superconducting phases. UTe2 under pressure is a treasure trove of several of the most fascinating phenomena in unconventional superconductivity and may well be a keystone in their understanding.


2019 ◽  
Vol 10 (1) ◽  
Author(s):  
Atindra Nath Pal ◽  
Dongzhe Li ◽  
Soumyajit Sarkar ◽  
Sudipto Chakrabarti ◽  
Ayelet Vilan ◽  
...  

AbstractKey spin transport phenomena, including magnetoresistance and spin transfer torque, cannot be activated without spin-polarized currents, in which one electron spin is dominant. At the nanoscale, the relevant length-scale for modern spintronics, spin current generation is rather limited due to unwanted contributions from poorly spin-polarized frontier states in ferromagnetic electrodes, or too short length-scales for efficient spin splitting by spin-orbit interaction and magnetic fields. Here, we show that spin-polarized currents can be generated in silver-vanadocene-silver single molecule junctions without magnetic components or magnetic fields. In some cases, the measured spin currents approach the limit of ideal ballistic spin transport. Comparison between conductance and shot-noise measurements to detailed calculations reveals a mechanism based on spin-dependent quantum interference that yields very efficient spin filtering. Our findings pave the way for nanoscale spintronics based on quantum interference, with the advantages of low sensitivity to decoherence effects and the freedom to use non-magnetic materials.


2004 ◽  
Vol 93 (24) ◽  
Author(s):  
Takao Ebihara ◽  
N. Harrison ◽  
M. Jaime ◽  
Shinya Uji ◽  
J. C. Lashley

1960 ◽  
Vol 70 (4) ◽  
pp. 693-714 ◽  
Author(s):  
G.M. Strakhovskii ◽  
N.V. Kravtsov

2002 ◽  
Vol 172 (11) ◽  
pp. 1303 ◽  
Author(s):  
Anatolii K. Zvezdin ◽  
Viktor V. Kostyuchenko ◽  
V.V. Platonov ◽  
V.I. Plis ◽  
A.I. Popov ◽  
...  

Author(s):  
Steve K. Hsiung ◽  
Kevan V. Tan ◽  
Andrew J. Komrowski ◽  
Daniel J. D. Sullivan ◽  
Jan Gaudestad

Abstract Scanning SQUID (Superconducting Quantum Interference Device) Microscopy, known as SSM, is a non-destructive technique that detects magnetic fields in Integrated Circuits (IC). The magnetic field, when converted to current density via Fast Fourier Transform (FFT), is particularly useful to detect shorts and high resistance (HR) defects. A short between two wires or layers will cause the current to diverge from the path the designer intended. An analyst can see where the current is not matching the design, thereby easily localizing the fault. Many defects occur between or under metal layers that make it impossible using visible light or infrared emission detecting equipment to locate the defect. SSM is the only tool that can detect signals from defects under metal layers, since magnetic fields are not affected by them. New analysis software makes it possible for the analyst to overlay design layouts, such as CAD Knights, directly onto the current paths found by the SSM. In this paper, we present four case studies where SSM successfully localized short faults in advanced wire-bond and flip-chip packages after other fault analysis methods failed to locate the defects.


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