Assessment of board level solder joint reliability for PBGA assemblies with lead‐free solders

2002 ◽  
Vol 14 (3) ◽  
pp. 46-50 ◽  
Author(s):  
Shi‐Wei Ricky Lee ◽  
Ben Hoi Wai Lui ◽  
Y.H. Kong ◽  
Bernard Baylon ◽  
Timothy Leung ◽  
...  
Keyword(s):  
Solder Joint ◽  
Lead Free ◽  
Solder Joint Reliability ◽  
Joint Reliability ◽  
Lead Free Solders ◽  
Board Level

scholarly journals Lead-free Solder Joint Reliability – State of the Art and Perspectives

2005 ◽  
Vol 2 (1) ◽  
pp. 72-83 ◽  
Author(s):  
Jianbiao Pan ◽  
Jyhwen Wang ◽  
David M. Shaddock
Keyword(s):  
Solder Joint ◽  
Electronics Industry ◽  
Lead Free ◽  
Lead Free Solder ◽  
Joint Failure ◽  
Solder Joint Reliability ◽  
Electronic Products ◽  
Joint Reliability ◽  
Free Solder ◽  
Lead Free Solders

There is an increasing demand for replacing tin-lead (Sn/Pb) solders with lead-free solders in the electronics industry due to health and environmental concerns. The European Union recently passed a law to ban the use of lead in electronic products. The ban will go into effect in July of 2006. The Japanese electronics industry has worked to eliminate lead from consumer electronic products for several years. Although currently there are no specific regulations banning lead in electronics devices in the United States, many companies and consortiums are working on lead-free solder initiatives including Intel, Motorola, Agilent Technologies, General Electric, Boeing, NEMI and many others to avoid a commercial disadvantage. The solder joints reliability not only depends on the solder joint alloys, but also on the component and PCB metallizations. Reflow profile also has significant impact on lead-free solder joint performance because it influences wetting and microstructure of the solder joint. A majority of researchers use temperature cycling for accelerated reliability testing since the solder joint failure mainly comes from thermal stress due to CTE mismatch. A solder joint failure could be caused by crack initiation and growth or by macroscopic solder facture. There are conflicting views of the reliability comparison between lead-free solders and tin-lead solders. This paper first reviews lead-free solder alloys, lead-free component lead finishes, and lead-free PCB surface finishes. The issue of tin whiskers is also discussed. Next, lead-free solder joint testing methods are presented; finite element modeling of lead-free solder joint reliability is reviewed; and experimental data comparing lead-free and tin-lead solder joint reliability are summarized. Finally the paper gives perspectives of transitions to totally lead-free manufacturing.

Experimental and numerical analysis of BGA lead-free solder joint reliability under board-level drop impact

2009 ◽  
Vol 49 (1) ◽  
pp. 79-85 ◽  
Author(s):  
Fang Liu ◽  
Guang Meng ◽  
Mei Zhao ◽  
Jun feng Zhao
Keyword(s):  
Numerical Analysis ◽  
Solder Joint ◽  
Drop Impact ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Joint Reliability ◽  
Joint Reliability ◽  
Free Solder ◽  
Board Level

Reliability of Lead-Free Solder Joints

2006 ◽  
Vol 128 (3) ◽  
pp. 297-301 ◽  
Author(s):  
John H. Lau
Keyword(s):  
Solder Joint ◽  
Hazardous Substances ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Joint Reliability ◽  
Joint Reliability ◽  
The World ◽  
The Future ◽  
Free Solder ◽  
Lead Free Solders

Reliability of the restriction of the use of certain hazardous substances in electrical and electronic equipment compliant products is investigated in this study. Emphasis is placed on the lead-free solder joint reliability. Solder is the electrical and mechanical “glue” of electronics assemblies. Will lead-free solders provide the characteristics necessary to allow the world to depend on it in the future? This paper cannot answer this question; however, it will help all participants in the soldering world better understand what needs to be done in order to answer this question and plan for the future.

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