Effect of Sb on wetting behavior of near eutectic Sn-Cu solder micro-alloyed with Ni and Ge

2016 ◽  
Vol 28 (2) ◽  
pp. 93-100 ◽  
Author(s):  
Amir Hossein Nobari ◽  
Mehran Maalekian ◽  
Karl Seelig ◽  
Mihriban Pekguleryuz
Keyword(s):  
Contact Angle ◽  
Sessile Drop ◽  
Drop Test ◽  
Lead Free ◽  
Scanning Calorimetry ◽  
Balance Test ◽  
Content Type ◽  
Wetting Behavior ◽  
Free Solder ◽  
Wetting Balance Test

Purpose The purpose of this paper is to investigate the effect of Sb (0, 0.2 and 2 wt.%) on wetting performance of lead-free solder of near eutectic Sn-Cu micro-alloyed with Ni and Ge. Design/methodology/approach The melting characteristic of the lead-free alloys was studied using differential scanning calorimetry. Wettability was examined using wetting balance test for two liquid fluxes, water based and alcohol based in two temperatures 265°C and 277°C. Also, contact angle was measured using sessile drop test. Findings It is shown that 0.2 wt.% Sb reduces the melting temperature and pasty range. Moreover, the addition of 0.2 wt.% Sb improves wetting behavior for alcohol-based flux. It is also demonstrated that the effect of Sb on meniscus height in wetting balance test and contact angle in sessile drop test follows the trend of wetting performance. Originality/value It is found that adding 0.2 wt.% Sb improves the wettability of Ni-Ge micro-alloyed Sn-Cu solder; however, higher concentration of Sb does not benefit the alloy.

A review: lead free solder and its wettability properties

2016 ◽  
Vol 28 (3) ◽  
pp. 125-132 ◽  
Author(s):  
Ervina Efzan Mhd Noor ◽  
Nur Faziera Mhd Nasir ◽  
Siti Rabiatul Aisya Idris
Keyword(s):  
Surface Tension ◽  
Contact Angle ◽  
Electronic Packaging ◽  
Design Methodology ◽  
Lead Free ◽  
Lead Free Solder ◽  
Research Papers ◽  
Basic Principles ◽  
Content Type ◽  
Free Solder

Purpose The purpose of this paper is to publish on the review of the lead free solder for electronic packaging. This involved the basic principles of the solder, the lead solder and its legislation and the lead free solder with its mechanism. In addition, this paper also reviews on the lead free solder characteristics that focused on its wettability. Design/methodology/approach This paper approach on the review of the solder wettability on the surface. It reviews on the solder especially on the contact angle and surface tension that is covered under the wettability of the solder. Findings This paper also reviews on the lead free solder characteristics that focused on its wettability. Originality/value This paper summarized finding from other researchers. The authors collect and summarize the useful data from other papers or journals. It is to create an understanding for the reader by discussion from the others research papers findings.

Effects of Wetting Behavior on Gallium Addition in In-Zn Solder Alloy

2016 ◽  
Vol 857 ◽  
pp. 22-25 ◽  
Author(s):  
Mohd Noor Ervina Efzan ◽  
Mhd Nasir Nur Faziera
Keyword(s):  
Contact Angle ◽  
Solder Alloy ◽  
Lead Free ◽  
Lead Free Solder ◽  
Imcs Layer ◽  
Spreading Area ◽  
Wetting Behavior ◽  
Free Solder

This paper reported the investigation on gallium, Ga addition into In-4.8Zn lead-free solder to improve its wettability performances. The effect of addition of Ga in In-4.8Zn solder alloy was studied. The results show with the addition of 0.5% Ga into the In-4.8Zn composition, the spreading area of In-4.8Zn-0.5Ga solder on copper increase between 35.71 and 43.75 %. Hence, as the spreading area increases, the contact angle decreased from between 22.09 to 39.71 %. Additionally, the addition of Ga as dopant increased the thickness of IMCs layer.

scholarly journals Aluminum Melt Filtration with Carbon Bonded Alumina Filters

Materials ◽  
2020 ◽  
Vol 13 (18) ◽  
pp. 3962
Author(s):  
Claudia Voigt ◽  
Jana Hubálková ◽  
Tilo Zienert ◽  
Beate Fankhänel ◽  
Michael Stelter ◽  
...  
Keyword(s):  
Contact Angle ◽  
Sessile Drop ◽  
Contact Angles ◽  
Apparent Contact Angle ◽  
Drop Test ◽  
Aluminum Melt ◽  
Wetting Behavior ◽  
Purification Unit ◽  
Conventional Test ◽  
Porous Disc

The wetting behavior was measured for Al2O3-C in contact with AlSi7Mg with a conventional sessile drop test (vacuum, 950 °C and 180 min) and a sessile drop test with a capillary purification unit (vacuum, 730 °C and 30 min). The conventional test yielded contact angles of around 92°, whereas the sessile drop measurement with capillary purification showed a strongly non-wetting behavior with a determined apparent contact angle of the rolling drop of 157°. Filtration tests, which were repeated twice, showed that the Al2O3-C filter possessed a better filtration behavior than the Al2O3 reference filter. For both filtration trials, the PoDFA (porous disc filtration analysis) index of the Al2O3-C filter sample was equal to half of the PoDFA index of the Al2O3 reference filter sample, indicating a significantly improved filtration performance when using Al2O3-C filter. Notable is the observation of a newly formed layer between the aluminum and the Al2O3-C coating. The layer possessed a thickness between 10 µm up to 50 µm and consisted of Al, C, and O, however, with different ratios than the original Al2O3-C coating. Thermodynamic calculations based on parameters of the wetting and filtration trials underline the possible formation of an Al4O4C-layer.

Wetting characteristic of Sn-(3-x)Ag-0.5Cu-xBi quaternary solder alloy systems

2019 ◽  
Vol 32 (1) ◽  
pp. 19-23 ◽  
Author(s):  
Ahmet Mustafa Erer ◽  
Serkan Oguz
Keyword(s):  
Solder Alloy ◽  
Sessile Drop ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Content Type ◽  
Cu Substrate ◽  
Wetting Properties ◽  
Free Solder ◽  
Drop Technique

Purpose This paper aims to invastigate of the wetting and interfacial properties of Sn-(3-x)Ag-0.5Cu-(x)Bi (x = 0.5, 1 and 2 in Wt.%) Pb-free solder alloys at various temperatures ( 250, 280 and 310°C) on Cu substrate in Ar atmosphere. Design/methodology/approach In this study, new Sn-(3-x)Ag-0.5Cu-xBi systems, low Ag content quaternary lead-free solder alloys, were produced by adding 0.5, 1 and 2% Bi to the near-eutectic SAC305 alloy. The wetting angles of three new alloys, Sn-2.5Ag-0.5Cu-0.5 Bi(SAC-0.5 Bi), Sn-2Ag-0.5Cu-1Bi(SAC-1Bi) and Sn-1Ag-0.5Cu-2Bi(SAC-2Bi) were measured by sessile drop technique on the Cu substrate in argon atmosphere. Findings In accordance with the interfacial analyses, intermetallic compounds of Cu3Sn, Cu6Sn5, and Ag3Sn were detected at the SAC-Bi/Cu interface. The results of wetting tests show that the addition of 1 Wt.% Bi improves the wetting properties of the Sn-3Ag-0.5Cu solder. The lowest wetting angle (θ) was obtained as 35,34° for Sn-2Ag-0.5Cu-1Bi alloy at a temperature of 310 °C. Originality/value This work was carried out with our handmade experiment set and the production of the quaternary lead-free solder alloy used in wetting tests belongs to us. Experiments were conducted using the sessile drop method in accordance with wetting tests.

Effects of In and Sb addition on the thermal and wetting behavior of Sn-3.5Ag solder

2018 ◽  
Vol 30 (4) ◽  
pp. 233-240 ◽  
Author(s):  
Md Hasnine
Keyword(s):  
Differential Scanning Calorimetry ◽  
Melting Point ◽  
Thermal Behavior ◽  
Surface Finish ◽  
Design Methodology ◽  
Solder Alloys ◽  
Scanning Calorimetry ◽  
Content Type ◽  
Cu Substrate ◽  
Free Solder

Purpose This paper aims to investigate the effect of In and Sb additions on the thermal behavior and wettability of Sn-3.5Ag-xIn-ySb (x = 0, 1.0 and 1.5 Wt.%, y = 0, 1.0, 1.4 and 2.1 Wt.%) solder alloys. Design/methodology/approach The thermal behavior of the Pb-free solder alloys was studied using differential scanning calorimetry. Wetting balance experiments were performed in accordance with the IPC standard, IPC-TM-650 and at a temperature of 260°C. Also, a solder spread test was performed on a Cu surface finish using the JIS-Z-3197 solderability standard. Findings It is shown that among the selected Sn-3.5Ag-xIn-ySb (x = 0, 1.0 and 1.5 Wt.%, y = 0, 1.0, 1.4 and 2.1 Wt.%) alloys, Sn-3.5Ag-1.5In-1Sb showed the lowest melting point and the lowest undercooling temperature. The best wettability was achieved when the In and Sb contents were approximately 1.5 and 1.0 Wt.%, respectively. The effect of the combined addition of In and Sb on solder spreadability on a Cu substrate was also demonstrated. Originality/value It was found that adding approximately 1.5 and 1.0 Wt.% of In and Sb, respectively, in Sn-3.5Ag solder provided the best wetting performance and improved the solder spreadability.

SAC–xTiO2 nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly

2018 ◽  
Vol 30 (1) ◽  
pp. 1-13 ◽  
Author(s):  
Fakhrozi Che Ani ◽  
Azman Jalar ◽  
Abdullah Aziz Saad ◽  
Chu Yee Khor ◽  
Roslina Ismail ◽  
...  
Keyword(s):  
Electron Microscope ◽  
Solder Joint ◽  
Solder Joints ◽  
Ion Beam ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Paste ◽  
Content Type ◽  
X Ray ◽  
Free Solder

Purpose This paper aims to investigate the characteristics of ultra-fine lead-free solder joints reinforced with TiO2 nanoparticles in an electronic assembly. Design/methodology/approach This study focused on the microstructure and quality of solder joints. Various percentages of TiO2 nanoparticles were mixed with a lead-free Sn-3.5Ag-0.7Cu solder paste. This new form of nano-reinforced lead-free solder paste was used to assemble a miniature package consisting of an ultra-fine capacitor on a printed circuit board by means of a reflow soldering process. The microstructure and the fillet height were investigated using a focused ion beam, a high-resolution transmission electron microscope system equipped with an energy dispersive X-ray spectrometer (EDS), and a field emission scanning electron microscope coupled with an EDS and X-ray diffraction machine. Findings The experimental results revealed that the intermetallic compound with the lowest thickness was produced by the nano-reinforced solder with a TiO2 content of 0.05 Wt.%. Increasing the TiO2 content to 0.15 Wt.% led to an improvement in the fillet height. The characteristics of the solder joint fulfilled the reliability requirements of the IPC standards. Practical implications This study provides engineers with a profound understanding of the characteristics of ultra-fine nano-reinforced solder joint packages in the microelectronics industry. Originality/value The findings are expected to provide proper guidelines and references with regard to the manufacture of miniaturized electronic packages. This study also explored the effects of TiO2 on the microstructure and the fillet height of ultra-fine capacitors.

Influence of aging on microstructure and hardness of lead-free solder alloys

2020 ◽  
Vol 33 (1) ◽  
pp. 57-64
Author(s):  
Carina Morando ◽  
Osvaldo Fornaro
Keyword(s):  
Isothermal Aging ◽  
Treatment Time ◽  
Cast Alloy ◽  
Scanning Calorimetry ◽  
Content Type ◽  
X Ray ◽  
Different Temperatures ◽  
Free Solder ◽  
Cast Condition ◽  
Dsc Calorimetry

Purpose The purpose of this paper is to carry out a study of the evolution of the microstructure and the microhardness of Sn-Cu-Ag alloys from as-cast condition and under artificial isothermal aging at different temperatures (100ºC and 180ºC) for a treatment time up to 500 h. A comparison with Sn-37% Pb eutectic solder samples was also made. Design/methodology/approach Sn-3.5%Ag, Sn-0.7%Cu and Sn-3.5%Ag-0.9%Cu were poured in two different cooling rate conditions and then aged at 100ºC (373ºK) and 180 °C (453ºK) during 500 h. Microstructural changes were observed by optical microscopy, scanning electron micrograph and energy dispersive X-ray microanalysis. Differential scanning calorimetry technique (DSC) was also used to confirm the obtained results. Findings A decrease up to 20% in microhardness respect to the value of the as-cast alloy was observed for both aging temperatures. These changes can be explained considering the coarsening and recrystallization of Sn dendrites present in the microstructures of all the systems studied. Originality/value There is no evidence of dissolution or precipitation of new phases in the range of studied temperatures that could be detected by DSC calorimetry technique. The acting mechanisms must be the result of coarsening of Sn dendrites and the residual stresses relaxation during the first stages of the isothermal aging.

Effect of Sb additions on the creep behaviour of low temperature lead-free Sn–8Zn–3Bi solder alloy

2020 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Guang Ren ◽  
Maurice Collins
Keyword(s):  
Low Temperature ◽  
Solder Alloy ◽  
Creep Behaviour ◽  
Lead Free ◽  
Coefficient Of Determination ◽  
Secondary Creep ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Content Type ◽  
Free Solder

Purpose This paper aims to investigate the creep behaviour of the recently developed Sn–8Zn–3Bi–xSb (x = 0, 0.5, 1.0 and 1.5) low temperature lead-free solder alloys. Design/methodology/approach An in-house compressive test rig was developed to perform creep tests under stresses of 20–40 MPa and temperature range 25°C–75 °C. Dorn power law and Garofalo hyperbolic sine law were used to model the secondary creep rate. Findings High coefficient of determination R2 of 0.99 is achieved for both the models. It was found that the activation energy of Sn–8Zn–3Bi solder alloy can be significantly increased with addition of Sb, by 60% to 90 kJ/mol approximately, whereas the secondary creep exponent falls in the range 3–7. Improved creep resistance is attributed to solid solution strengthening introduced by micro-alloying. Creep mechanisms that govern the deformation of these newly developed lead-free solder alloys have also been proposed. Originality/value The findings are expected to fill the gap of knowledge on creep behaviour of these newly developed solder alloys, which are possible alternatives as lead-free interconnecting material in low temperature electronic assembly.

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