The red shift of ZnSSe metal-semiconductor-metal light emitting diodes with high injection currents

Although light-emitting diodes (LEDs) hold great promises for high-efficiency lighting applications, the cost per lumen still poses a challenge for LEDs to fast penetrate into the markets. Increasing the output power per LED chip reduces the number of chips required for a specific luminous flux, thus reducing the cost of LED luminaires. However, it is well known that the luminous output power of LEDs (Pout) cannot be enhanced simply by increasing the injection current density (Jinj) due to efficiency droop. Extensive efforts have been made towards avoiding efficiency droop at high injection current densities (e.g., Jinj > 50 A/cm2). Gardner et al. reported a double-heterostructure LED with an external quantum efficiency (EQE) of 40% at 200 A/cm2. Xie et al. introduced an electron-blocking layer into the LED devices and the EQE peak occurred at 900 A/cm2 approximately. Nevertheless, the EQE is always lower than 100%, excessive heat will accumulate in LEDs at high current densities and increase the junction temperatures, which will damage the device and limit its luminous output power and lifetime. In this paper, the recombination mechanism in the LED active area is analyzed and an analytic relationship between Pout and Jinj is proposed. The calculated results show that the best Pout currently achieved is far lower than its potential value. The temperature dependence of the Pout-Jinj relationship is also calculated and the thermal state of LEDs at high injection current densities predicted. The results demonstrate that LED luminaires with thermal management based on conventional fin-shaped heat sinks suffer from thermal runaway due to excessive heat accumulation before reaching their ultimate output power. The gap between the existing and predicted Pout is mainly due to thermal runaway of LED devices at high injection current densities, instead of efficiency droop. Therefore, the short-term solution of LED luminous output power enhancement should be better cooling of LED modules, such as jet/spray cooling, heat pipe cooling, or 3D embedded two-phase cooling. Long-term solutions continue to focus on reducing the efficiency droop with improved LED device structures and advanced materials.

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Study the Effect of Junction Temperature on the Peak Wavelength in GaN-Based High-Power Green Light Emitting Diodes

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.399-401.1034 ◽

2011 ◽

Vol 399-401 ◽

pp. 1034-1038

Author(s):

Rong Rong Zhuang ◽

Ping Cai ◽

Jiang Li Huang

Keyword(s):

High Power ◽

Temperature Rise ◽

Light Emitting Diodes ◽

Green Light ◽

Red Shift ◽

Junction Temperature ◽

Spectral Peak ◽

Peak Wavelength ◽

Drive Current ◽

Light Emitting

The junction temperature of GaN-based high-power green light emitting diodes is measured using the temperature coefficients of the diode forward voltage, from changes in temperature and changes in drive current to measure the LED junction temperature and the corresponding spectral, Respectively. Experiments show that, junction temperature due to environmental temperature increased, and the red shift of the spectral peak wavelength. When low temperature or less then the rated current range, the drive current increased in junction temperature rise due to the spectral peak wavelength blue shift . When the current is increased in the range of close to or greater than the rated current, leading to the junction temperature rise will cause spectral red shift . The peak wavelengths’ shift degree of 0.0579nm / k, 0.0751 nm / k and-0.1974nm / k, -0.0915 nm / k are calculated in both cases. The phenomenon is due to the LED junction temperature increases lead to band gap shrinkage, and the result of the role of spontaneous polarization and piezoelectric polarization in Ⅲ-nitride semiconductor materials.

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