High-speed optoelectronic VLSI switching chip with <4000 optical I/O based on flip-chip bonding of MQW modulators and detectors to silicon CMOS

IEEE Journal of Selected Topics in Quantum Electronics ◽

10.1109/2944.541876 ◽

1996 ◽

Vol 2 (1) ◽

pp. 77-84 ◽

Author(s):

A.L. Lentine ◽

K.W. Goossen ◽

J.A. Walker ◽

L.M.F. Chirovsky ◽

L.A. D'Asaro ◽

...

Keyword(s):

Flip Chip ◽

Flip Chip Bonding ◽

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High-speed electroabsorption (EA) modulator modules using the flip-chip bonding (FCB) technique

OFC 2001. Optical Fiber Communication Conference and Exhibit. Technical Digest Postconference Edition (IEEE Cat. 01CH37171) ◽

10.1109/ofc.2001.928517 ◽

2002 ◽

Author(s):

T. Miyahara ◽

S. Kaneko ◽

M. Noda ◽

M. Ishizaki ◽

Y. Kitamura ◽

...

Keyword(s):

Flip Chip ◽

Flip Chip Bonding

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High-speed electroabsorption (EA) modulator modules using the flip-chip bonding (FCB) technique

Optical Fiber Communication Conference and International Conference on Quantum Information ◽

10.1364/ofc.2001.wdd67 ◽

2001 ◽

Author(s):

T. Miyahara ◽

S. Kaneko ◽

M. Noda ◽

M. Ishizaki ◽

Y. Kitamura ◽

...

Keyword(s):

Flip Chip ◽

Flip Chip Bonding

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Flip-chip bonding of high-speed laser diodes

Conference Proceedings LEOS'96 9th Annual Meeting IEEE Lasers and Electro-Optics Society ◽

10.1109/leos.1996.571573 ◽

2002 ◽

Author(s):

S. Lindgren ◽

H. Ahlfeldt ◽

B. Kerzar ◽

O. Kjebon

Keyword(s):

Flip Chip ◽

Laser Diodes ◽

Flip Chip Bonding

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In situ observation of ultrasonic flip-chip bonding using high-speed camera

Japanese Journal of Applied Physics ◽

10.7567/jjap.54.030204 ◽

2015 ◽

Vol 54 (3) ◽

pp. 030204 ◽

Author(s):

Takanori Shuto ◽

Tanemasa Asano

Keyword(s):

Flip Chip ◽

In Situ Observation ◽

High Speed Camera ◽

Flip Chip Bonding

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Pb/In solder bump formation for a flip-chip bonding technique at high speed optical communication devices

Proceedings of APCCAS'96 - Asia Pacific Conference on Circuits and Systems ◽

10.1109/apcas.1996.569305 ◽

2002 ◽

Author(s):

Haksoo Han ◽

Hyunsoo Chung ◽

Sungkook Park ◽

Yungil Joe ◽

Sungsoo Park ◽

...

Keyword(s):

Optical Communication ◽

Flip Chip ◽

Solder Bump ◽

Flip Chip Bonding ◽

Communication Devices ◽

Bonding Technique

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Flip-chip bonding of VCSEL arrays with silicon driver chips for high speed data links

Conference Proceedings. LEOS'98. 11th Annual Meeting. IEEE Lasers and Electro-Optics Society 1998 Annual Meeting (Cat. No.98CH36243) ◽

10.1109/leos.1998.737783 ◽

2002 ◽

Author(s):

U. Koelle ◽

S.R. Johnson ◽

P. Kelkar ◽

R. Turpin ◽

P. Dowd ◽

...

Keyword(s):

Flip Chip ◽

Flip Chip Bonding ◽

High Speed Data ◽

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Improvement of light extraction for AlGaN-based near UV LEDs with flip-chip bonding fabricated on grooved sapphire substrate using laser ablation

Materials Science in Semiconductor Processing ◽

10.1016/j.mssp.2019.02.011 ◽

2019 ◽

Vol 95 ◽

pp. 48-53

Author(s):

Chun-Han Ku ◽

Wei-Kai Wang ◽

Ray-Hua Horng

Keyword(s):

Laser Ablation ◽

Sapphire Substrate ◽

Flip Chip ◽

Light Extraction ◽

Flip Chip Bonding ◽

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Maskless Fabrication for Micropad Interconnection using Electroless NiB Deposition and Application to "Chemical" Flip-Chip Bonding

ECS Meeting Abstracts ◽

10.1149/ma2008-02/38/2521 ◽

2008 ◽

Keyword(s):

Flip Chip ◽

Flip Chip Bonding

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Fully integrated low-power flip chip bonding of arrayed optoelectronic devices on SOS

10.1117/12.453687 ◽

2002 ◽

Author(s):

Ronald E. Reedy ◽

Hal Anthony ◽

Charles Kuznia ◽

Mike Pendelton ◽

Jim Cable ◽

...

Keyword(s):

Low Power ◽

Flip Chip ◽

Optoelectronic Devices ◽

Fully Integrated ◽

Flip Chip Bonding

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High-speed flip-chip InP/InGaAs avalanche photodiodes with ultralow capacitance and large gain-bandwidth products

IEEE Photonics Technology Letters ◽

10.1109/68.118025 ◽

1991 ◽

Vol 3 (12) ◽

pp. 1115-1116 ◽

Author(s):

Y. Kito ◽

H. Kuwatsuka ◽

T. Kumai ◽

M. Makiuchi ◽

T. Uchida ◽

...

Keyword(s):

Flip Chip ◽

Avalanche Photodiodes ◽

Gain Bandwidth ◽

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