Fully integrated low-power flip chip bonding of arrayed optoelectronic devices on SOS
2015 ◽
Vol 5
(10)
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pp. 1533-1540
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2019 ◽
Vol 95
◽
pp. 48-53
Keyword(s):
2014 ◽
Vol 49
(8)
◽
pp. 1682-1693
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Keyword(s):
1998 ◽
Vol 45
(4)
◽
pp. 2272-2278
◽
Keyword(s):
Keyword(s):