Maskless Fabrication for Micropad Interconnection using Electroless NiB Deposition and Application to "Chemical" Flip-Chip Bonding

2008 ◽  
Keyword(s):  
Flip Chip ◽  
Flip Chip Bonding

Fully integrated low-power flip chip bonding of arrayed optoelectronic devices on SOS

2002 ◽  
Author(s):  
Ronald E. Reedy ◽  
Hal Anthony ◽  
Charles Kuznia ◽  
Mike Pendelton ◽  
Jim Cable ◽  
...  
Keyword(s):  
Low Power ◽  
Flip Chip ◽  
Optoelectronic Devices ◽  
Fully Integrated ◽  
Flip Chip Bonding

scholarly journals Flip-Chip Bonding Fabrication Technique

2017 ◽  
Vol 260 ◽  
pp. 012005
Author(s):  
Tengku Muhammad Afif bin Tengku Azmi ◽  
Nadzril bin Sulaiman
Keyword(s):  
Flip Chip ◽  
Fabrication Technique ◽  
Flip Chip Bonding

scholarly journals Hybrid-Integration of SOA on Silicon Photonics Platform Based on Flip-Chip Bonding

2019 ◽  
Vol 37 (2) ◽  
pp. 307-313 ◽  
Author(s):  
Takeshi Matsumoto ◽  
Teruo Kurahashi ◽  
Ryotaro Konoike ◽  
Keijiro Suzuki ◽  
Ken Tanizawa ◽  
...  
Keyword(s):  
Silicon Photonics ◽  
Flip Chip ◽  
Hybrid Integration ◽  
Flip Chip Bonding
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