Electrothermal CAD of power devices and circuits with fully physical time-dependent compact thermal modeling of complex nonlinear 3-d systems

2001 ◽  
Vol 24 (4) ◽  
pp. 566-590 ◽  
Author(s):  
W. Batty ◽  
C.E. Christoffersen ◽  
A.J. Panks ◽  
S. David ◽  
C.M. Snowden ◽  
...  
Keyword(s):  
Thermal Modeling ◽  
Time Dependent ◽  
Power Devices ◽  
Physical Time ◽  
Compact Thermal Modeling

scholarly journals Multi-Variable Thermal Modeling of Power Devices Considering Mutual Coupling

2019 ◽  
Vol 9 (16) ◽  
pp. 3240
Author(s):  
Wei ◽  
Cheng ◽  
Lu ◽  
Siwakoti ◽  
Zhang
Keyword(s):  
Working Conditions ◽  
Thermal Effects ◽  
Mutual Coupling ◽  
Thermal Modeling ◽  
Power Converter ◽  
Thermal Coupling ◽  
Power Devices ◽  
Cooling Process ◽  
Converter Design ◽  
Design Power

In relation to power converter design, power density is increasing while the form factor isdecreasing. This trend generally reduces the rate of the cooling process, which increases the mutualthermal coupling among the surrounding power components. Most of the traditional modelsusually ignore the mutual effects or just focus on the conduction coupling. To deal with these factors,the thermal modeling for a boost converter system has been built to compare the junctiontemperatures (Tj) and the increments under different working conditions in order to consider theconduction coupling. A multi-variable thermal resistances model is proposed in this paper toincorporate the convection thermal coupling into the mutual thermal effects. The couplingresistances, MOSFET to the diode[...]

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