Real-time temperature cycling estimation of IGBT power modules with power in-line measurements and compact thermal modeling

2016 ◽  
Author(s):  
F. Di Napoli ◽  
A. Magnani ◽  
M. Coppola ◽  
P. Guerriero ◽  
V. d'Alessandro ◽  
...  
Keyword(s):  
Real Time ◽  
Thermal Modeling ◽  
Temperature Cycling ◽  
Power Modules ◽  
Compact Thermal Modeling

Investigations on passive Temperature-Cycling Robustness of novel Interconnection Element for low-inductive Power Modules

2020 ◽  
Author(s):  
Alexander Klemm ◽  
Michael Schmidt ◽  
Martin Rittner ◽  
Michael Guyenot ◽  
Manfred Reinold ◽  
...  
Keyword(s):  
Temperature Cycling ◽  
Power Modules ◽  
Inductive Power

Analytical Leakage-Aware Thermal Modeling of a Real-Time System

2014 ◽  
Vol 63 (6) ◽  
pp. 1378-1392 ◽  
Author(s):  
Morteza Mohaqeqi ◽  
Mehdi Kargahi ◽  
Ali Movaghar
Keyword(s):  
Real Time ◽  
Thermal Modeling ◽  
Time System ◽  
Real Time System

Electrothermal CAD of power devices and circuits with fully physical time-dependent compact thermal modeling of complex nonlinear 3-d systems

2001 ◽  
Vol 24 (4) ◽  
pp. 566-590 ◽  
Author(s):  
W. Batty ◽  
C.E. Christoffersen ◽  
A.J. Panks ◽  
S. David ◽  
C.M. Snowden ◽  
...  
Keyword(s):  
Thermal Modeling ◽  
Time Dependent ◽  
Power Devices ◽  
Physical Time ◽  
Compact Thermal Modeling

Embedded Die Packages and Modules for Power Electronics Applications

2016 ◽  
Vol 2016 (DPC) ◽  
pp. 001918-001947 ◽  
Author(s):  
Lars Boettcher ◽  
S. Karaszkiewicz ◽  
D. Manessis ◽  
A. Ostmann
Keyword(s):  
Power Electronics ◽  
Power Efficiency ◽  
High Reliability ◽  
Heat Removal ◽  
Testing Temperature ◽  
Temperature Cycling ◽  
Switching Frequency ◽  
Large Area ◽  
Power Modules ◽  
Embedded Power

Packages and modules with embedded semiconductor dies are of interest for various application fields and power classes. First packages in the lower power range are available in volume production since almost six years. Recent developments focus on medium and higher power applications raging over 500W into the kW range. Different approaches are available to realize such packages and modules. This paper will give an overview and detailed description of the latest approaches for such embedded die structures. In common of all of these approaches, is the use of laminate based die embedding, which uses standard PCB manufacturing technologies. Main differences are the used base substrate, which can still be a ceramic (DBC), Cu leadframe or high current substrate. Examples for the different methods will be given. As the main part, this paper will describe concepts, which enable significant smaller form-factor of power electronics modules, thereby allowing for lower price, high reliability, capability of direct mounting on e.g. a motor so as to form one unit with the motor housing, wide switching frequency range (for large application field) and high power efficiency. The innovative character of this packaging concept is the idea to embed the power drive components (IGBTs, MOSFETs, diode) as thinned chips into epoxy-resin layer built-up and to realize large-area interconnections on both sides by direct copper plating the dies to form a conductor structure with lowest possible electrical impedance and to achieve an optimum heat removal. In this way a thin core is formed on a large panel format which is called Embedded Power Core. The paper will specifically highlight the first results on manufacturing an embedded power discrete package as an example of an embedded power core containing a thin rectifier diode. For module realization, the power cores are interconnected to insulated metal substrates (IMS) by the use of Ag sintering interconnection technologies for the final manufacturing of Power modules. The paper will elaborate on the sintering process for Power Core/IMS interconnections, the microscopically features of the sintered interfaces, and the lateral filling of the sintering gap with epoxy prepregs. Firstly, 500W power modules were manufactured using this approach. Reliability testing results, solder reflow testing, temperature cycling test and active power cycling, will be discussed in detail.

Fast Nonlinear Dynamic Compact Thermal Modeling With Multiple Heat Sources in Ultra-Thin Chip Stacking Technology

2017 ◽  
Vol 7 (1) ◽  
pp. 58-69 ◽  
Author(s):  
Lorenzo Codecasa ◽  
Vincenzo d'Alessandro ◽  
Alessandro Magnani ◽  
Niccolo Rinaldi
Keyword(s):  
Nonlinear Dynamic ◽  
Thermal Modeling ◽  
Heat Sources ◽  
Compact Thermal Modeling

Real-Time Monitoring of Thermal Response and Life-Time Varying Parameters in Power Modules

2020 ◽  
Vol 56 (5) ◽  
pp. 5279-5291 ◽  
Author(s):  
Christoph H. van der Broeck ◽  
Timothy A. Polom ◽  
Robert D. Lorenz ◽  
Rik W. De Doncker
Keyword(s):  
Real Time ◽  
Thermal Response ◽  
Life Time ◽  
Time Varying ◽  
Real Time Monitoring ◽  
Varying Parameters ◽  
Power Modules ◽  
Time Varying Parameters

Novel partition-based approach to dynamic compact thermal modeling

2016 ◽  
Author(s):  
Lorenzo Codecasa ◽  
Vincenzo d'Alessandro ◽  
Alessandro Magnani ◽  
Niccolo Rinaldi
Keyword(s):  
Thermal Modeling ◽  
Compact Thermal Modeling

Real-time life consumption power modules prognosis using on-line rainflow algorithm in metro applications

2010 ◽  
Author(s):  
Mahera Musallam ◽  
C. Mark Johnson ◽  
Chunyan Yin ◽  
Chris Bailey ◽  
Michel Mermet-Guyennet
Keyword(s):  
Real Time ◽  
Power Modules ◽  
On Line ◽  
Life Consumption
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