An estimation method of chip level power distribution network inductance using full wave simulation and segmentation method

2008 ◽  
Author(s):  
Jaemin Kim ◽  
Jongjoo Shim ◽  
Woojin Lee ◽  
Jun So Pak ◽  
Joungho Kim
Keyword(s):  
Power Distribution ◽  
Distribution Network ◽  
Estimation Method ◽  
Segmentation Method ◽  
Power Distribution Network ◽  
Wave Simulation ◽  
Full Wave

scholarly journals Power Integrity Analysis of Power Distribution Network Segmented Using DGS–Electromagnetic Bandgap Structure in Mixed-Signal PCBs

Electronics ◽  
2020 ◽  
Vol 9 (12) ◽  
pp. 2036
Author(s):  
Myunghoi Kim
Keyword(s):  
Power Distribution ◽  
Domain Decomposition Method ◽  
Distribution Network ◽  
Power Integrity ◽  
Electromagnetic Bandgap ◽  
Power Distribution Network ◽  
Wave Simulation ◽  
Full Wave ◽  
Resonant Modes ◽  
Integrity Analysis

In this paper, we present the power integrity analysis of a power distribution network (PDN) employing a segmentation technique based on the electromagnetic bandgap (EBG) structure with a defected ground structure (DGS). For efficient analysis of power integrity, a domain decomposition method (DDM) with a novel modeling of the DGS–EBG-based PDN is presented. In the DDM, analytical models for the partitioned parts of the PDN are developed, and their impedance parameters are analytically extracted. The resonant modes for the power integrity analysis are rigorously examined using the DDM and electric-field distribution. The effect of the DGS–EBG stopband on the resonant modes are analyzed. The proposed DDM and power integrity analysis are verified using full-wave simulation and measurements. The DDM result shows good agreement with the full-wave simulation and measurements.

Comparison Between Multilayer Ceramic and Organic Package Substrates Based Upon Signal and Power Integrity

2011 ◽  
Vol 2011 (1) ◽  
pp. 000905-000913
Author(s):  
Jerry Aguirre ◽  
Paul Garland ◽  
Marcos Vargas ◽  
Heather Tallo ◽  
Joseph Tallo
Keyword(s):  
Power Distribution ◽  
Flip Chip ◽  
Organic Substrate ◽  
Electrical Performance ◽  
Power Integrity ◽  
Power Distribution Network ◽  
Wave Simulation ◽  
Full Wave ◽  
Differential Pair ◽  
Multilayer Ceramic

Comparisons between organic and ceramic packaging is a difficult task given the considerable number of differences in material properties and potential tradeoffs between cost, electrical performance, thermal performance, and environmental factors. This paper presents a power and signal integrity comparison between a select set of multilayer organic technologies (HDBU and CPCore) and multilayer ceramic technologies (HTCC and LTCC). The geometry and material property impact on electrical performance for the flip-chip first level interconnect are qualitatively discussed and compared. The broadband frequency performance for the ball grid array (BGA) second-level interconnect to a PWB is simulated and characterized to 40 GHz for a differential pair using full-wave simulation. The impedance of the power distribution network (PDN) for a ceramic package is characterized by measurement to correlate with full-wave simulation to then subsequently compare with an organic substrate PDN.

scholarly journals Segmentation method based modeling and analysis of a glass package power distribution network (PDN)

2020 ◽  
Vol 11 (2) ◽  
pp. 170-188
Author(s):  
Youngwoo Kim ◽  
Daisuke Fujimoto ◽  
Shugo Kaji ◽  
Shinpei Wada ◽  
Hyunwook Park ◽  
...  
Keyword(s):  
Power Distribution ◽  
Distribution Network ◽  
Segmentation Method ◽  
Power Distribution Network ◽  
Modeling And Analysis
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