3D Full-Wave Simulation of Stub Length Effect of Vias in High Speed PCB Design

Author(s):  
Eric Steenbergen ◽  
Niek Moonen ◽  
Frank Leferink
Electronics ◽  
2018 ◽  
Vol 7 (9) ◽  
pp. 201 ◽  
Author(s):  
Myunghoi Kim

In this paper, we present a unit-cell-based domain decomposition method (UC-DDM) for rapid and accurate simulation of predicting the parallel plate noise (PPN) suppression of a truncated electromagnetic bandgap (EBG) structure in high-speed printed circuit boards (PCBs). The proposed UC-DDM divides the analysis domain of the truncated EBG structure into UCs as sub-domains. Solving a sub-domain is based on a novel UC model, yielding an analytical expression for the impedance parameter (Z-parameter) of the UC. The novel UC model is derived using a spatial decomposition technique, which results in the modal decomposition of quasi-transverse electromagnetic (TEM) and transverse magnetic (TM) modes. In addition, we analytically derive a impedance-parameter recombination method (ZRM) to obtain the analytical solution of a finite EBG array from the sub-domain results. The proposed UC-DDM is verified through comparison with full-wave simulation results for various EBG arrays. Comparison between the UC-DDM and a full-wave simulation of a truncated EBG structure reveals that a substantial improvement in computation time with high accuracy is achieved. It is demonstrated that the simulation time of the proposed method is only 0.1% of that of a full-wave simulation without accuracy degradation.


1997 ◽  
Author(s):  
Yves Peysson ◽  
Eric Sébelin ◽  
Xavier Litaudon ◽  
Didier Moreau ◽  
Jean-Claude Miellou ◽  
...  

2012 ◽  
Vol 2012 (1) ◽  
pp. 001068-001072
Author(s):  
Xichen Guo ◽  
Ji Chen ◽  
David R. Jackson ◽  
Marina Y. Koledintseva ◽  
James Drewniak ◽  
...  

Conductor loss due to the roughened metal foil surface has significant effects on high-speed signals propagation on backplane traces designed for 10+ Gbps network. A practical method to evaluate these effects, including the signal attenuation and the propagation phase velocity, is proposed in this paper. A periodic structure is assumed to model the morphology of the roughness profile. The equivalent surface impedance is extracted from the grating surface wave propagation constant to model the roughness. This modified surface impedance can hence be used in the traditional attenuation constant formula to calculate the actual conductor loss. This approach is validated using both full-wave simulation tool and measurement, and is shown to be able to provide robust result within 0.2 dB/m relative error.


2012 ◽  
Vol 2012 (1) ◽  
pp. 001057-001067
Author(s):  
Darryl Kostka ◽  
Antonio Ciccomancini Scogna

3D ICs promise “more than Moore” integration by packing a lot of functionality into small form factors. Interposers along with TSVs play an important role in 3D integration from an electrical, thermal and mechanical point of view. The goal of this paper is to electrically model TSVs and 3D interposers by means of three 3D full wave electromagnetic simulations. A comparative analysis of various configurations of signal delivery networks in 3D interposers for high speed signal transmission is presented.


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