3D Electromagnetic Modeling of Through Silicon Vias and Interposers in Electronic Packaging

2012 ◽  
Vol 2012 (1) ◽  
pp. 001057-001067
Author(s):  
Darryl Kostka ◽  
Antonio Ciccomancini Scogna
Keyword(s):  
High Speed ◽  
Signal Transmission ◽  
Form Factors ◽  
Point Of View ◽  
Electromagnetic Modeling ◽  
Electromagnetic Simulations ◽  
Full Wave ◽  
3D Ics ◽  
Silicon Vias ◽  
Delivery Networks

3D ICs promise “more than Moore” integration by packing a lot of functionality into small form factors. Interposers along with TSVs play an important role in 3D integration from an electrical, thermal and mechanical point of view. The goal of this paper is to electrically model TSVs and 3D interposers by means of three 3D full wave electromagnetic simulations. A comparative analysis of various configurations of signal delivery networks in 3D interposers for high speed signal transmission is presented.

scholarly journals Analytical Modeling of Metamaterial Differential Transmission Line Using Corrugated Ground Planes in High-Speed Printed Circuit Boards

Electronics ◽  
2019 ◽  
Vol 8 (3) ◽  
pp. 299 ◽  
Author(s):  
Myunghoi Kim
Keyword(s):  
Analytical Model ◽  
High Speed ◽  
Printed Circuit Boards ◽  
Signal Transmission ◽  
Circuit Boards ◽  
Transmission Characteristics ◽  
Differential Signal ◽  
Printed Circuit ◽  
Full Wave ◽  
Differential Transmission

An analytical model for metamaterial differential transmission lines (MTM-DTLs) with a corrugated ground-plane electromagnetic bandgap (CGP-EBG) structure in high-speed printed circuit boards is proposed. The proposed model aims to efficiently and accurately predict the suppression of common-mode noise and differential signal transmission characteristics. Analytical expressions for the four-port impedance matrix of the CGP-EBG MTM-DTL are derived using coupled-line theory and a segmentation method. Converting the impedance matrix into mixed-mode scattering parameters enables obtaining common-mode noise suppression and differential signal transmission characteristics. The comprehensive evaluations of the CGP-EBG MTM-DTL using the proposed analytical model are also reported, which is validated by comparing mixed-mode scattering parameters Scc21 and Sdd21 with those obtained from full-wave simulations and measurements. The proposed analytical model provides a drastic reduction of computation time and accurate results compared to full-wave simulation.

High Speed Signal Transmission using Through-Si Vias and Coplanar Waveguides in a 3D IC Test Structure

2013 ◽  
Vol 2013 (1) ◽  
pp. 000228-000232
Author(s):  
Min Xu ◽  
Robert Geer ◽  
Pavel Kabos ◽  
Thomas Wallis
Keyword(s):  
Integrated Circuits ◽  
High Frequency ◽  
High Speed ◽  
Signal Transmission ◽  
Coplanar Waveguides ◽  
Scattering Parameter ◽  
High Frequency Signal ◽  
3D Integrated Circuits ◽  
High Bandwidth ◽  
Silicon Vias

High frequency signal transmission through silicon substrates is critical for 3D heterogeneous integration. This paper presented fabrication, testing, and simulation of high-frequency interconnects based on through-silicon vias (TSVs) and coplanar waveguides (CPWs) for stacked 3D integrated circuits (3D ICs). Our simulation results showed that adding ground TSVs can improve signal transmission by 6× at 50GHz. We further investigated signal/ground TSV (1SXG) configurations for high-bandwidth signal transmission links. Scattering parameter measurements of fabricated 1SXG TSV structures for frequencies from 100MHz to 50GHz show low insertion loss (S21 less than −1dB up to 50GHz) and return loss (S11 lower than −15dB). These results indicate that these vertical interconnects exhibit good performance for high speed signal transmission. To understand the RF signal transmission in 3D interconnects, we used full wave electromagnetic simulation to investigate the electromagnetic field distribution associated with the ground TSV placement. We observed that the ground TSVs induced substantial overall field confinement, consistent with the experimental observation of improved signal transmission. Simulations also provided design guidance with respect to the substrate conductivity's impact on EM confinement and signal transmission.

Research on the EM Modeling of Optimization of PCB Grounded Via

2012 ◽  
Vol 195-196 ◽  
pp. 1153-1157
Author(s):  
Liang Qi Gui ◽  
Cao Yang ◽  
Jia He ◽  
Xiao Ping Gao ◽  
Ke Chen ◽  
...  
Keyword(s):  
High Speed ◽  
Signal Transmission ◽  
Wave Model ◽  
Simulation Software ◽  
Design Parameters ◽  
Optimized Design ◽  
Analysis Model ◽  
Scattering Parameter ◽  
Full Wave ◽  
The Impact

Grounded vias modeling is used to analyze the impact on the high speed PCB EMC and SI issues in three aspects, including theoretical analysis, simulator modeling and practical PCB test. In this paper, we discuss the full-wave complex scattering parameter model and full-wave model. Then the full-wave analysis model of the through holes for model validation and comparison are established, by using numerical simulation software HFSS and CST Microwave Studio. The initial test results on the practical PCB show that the analyzed method is reasonable and accurate. And optimized design parameters can ensure the continuity of the impedance of vias, and introduce lesser return loss and insertion loss. It is shown that the signal transmission performance is greatly improved with the grounded via added, which is helpful in specifying the manufacturing tolerance of via designs.

scholarly journals Review of Bumpless Build Cube (BBCube) Using Wafer-on-Wafer (WOW) and Chip-on-Wafer (COW) for Tera-Scale Three-Dimensional Integration (3DI)

Electronics ◽  
2022 ◽  
Vol 11 (2) ◽  
pp. 236
Author(s):  
Takayuki Ohba ◽  
Koji Sakui ◽  
Shinji Sugatani ◽  
Hiroyuki Ryoson ◽  
Norio Chujo
Keyword(s):  
High Speed ◽  
Three Dimensional ◽  
Thermal Characteristics ◽  
Thermal Dissipation ◽  
3D Ics ◽  
Buffer Power ◽  
Small Form Factor ◽  
Silicon Vias ◽  
Interconnect Technology ◽  
Lower Impedance

Bumpless Build Cube (BBCube) using Wafer-on-Wafer (WOW) and Chip-on-Wafer (COW) for Tera-Scale Three-Dimensional Integration (3DI) is discussed. Bumpless interconnects between wafers and between chips and wafers are a second-generation alternative to the use of micro-bumps for WOW and COW technologies. WOW and COW technologies for BBCube can be used for homogeneous and heterogeneous 3DI, respectively. Ultra-thinning of wafers down to 4 μm offers the advantage of a small form factor, not only in terms of the total volume of 3D ICs, but also the aspect ratio of Through-Silicon-Vias (TSVs). Bumpless interconnect technology can increase the number of TSVs per chip due to the finer TSV pitch and the lower impedance of bumpless TSV interconnects. In addition, high-density TSV interconnects with a short length provide the highest thermal dissipation from high-temperature devices such as CPUs and GPUs. This paper describes the process platform for BBCube WOW and COW technologies and BBCube DRAMs with high speed and low IO buffer power by enhancing parallelism and increasing yield by using a vertically replaceable memory block architecture, and also presents a comparison of thermal characteristics in 3D structures constructed with micro-bumps and BBCube.

scholarly journals Characterization of Tiled Architecture for C-Band 1-Bit Beam-Steering Transmitarray

Sensors ◽  
2021 ◽  
Vol 21 (4) ◽  
pp. 1259
Author(s):  
Dmitry Kozlov ◽  
Irina Munina ◽  
Pavel Turalchuk ◽  
Vitalii Kirillov ◽  
Alexey Shitvov ◽  
...  
Keyword(s):  
Communication Systems ◽  
Beam Steering ◽  
Unit Cell ◽  
Electromagnetic Simulations ◽  
Fifth Generation ◽  
Full Wave ◽  
Array Architecture ◽  
Modulation Pattern ◽  
Good Agreement

A new implementation of a beam-steering transmitarray is proposed based on the tiled array architecture. Each pixel of the transmitarray is manufactured as a standalone unit which can be hard-wired for specific transmission characteristics. A set of complementary units, providing reciprocal phase-shifts, can be assembled in a prescribed spatial phase-modulation pattern to perform beam steering and beam forming in a broad spatial range. A compact circuit model of the tiled unit cell is proposed and characterized with full-wave electromagnetic simulations. Waveguide measurements of a prototype unit cell have been carried out. A design example of a tiled 10 × 10-element 1-bit beam-steering transmitarray is presented and its performance benchmarked against the conventional single-panel, i.e., unibody, counterpart. Prototypes of the tiled and single-panel C-band transmitarrays have been fabricated and tested, demonstrating their close performance, good agreement with simulations and a weak effect of fabrication tolerances. The proposed transmitarray antenna configuration has great potential for fifth-generation (5G) communication systems.

Comparison of the reluctance laminated and solid rotor synchronous machine operating at high temperatures

2019 ◽  
Vol 38 (4) ◽  
pp. 1111-1119 ◽  
Author(s):  
Marcin Lefik ◽  
Krzysztof Komeza ◽  
Ewa Napieralska-Juszczak ◽  
Daniel Roger ◽  
Piotr Andrzej Napieralski
Keyword(s):  
High Speed ◽  
Design Methodology ◽  
Three Dimensional ◽  
Synchronous Machine ◽  
Point Of View ◽  
Heat Sources ◽  
Model Calculations ◽  
Content Type ◽  
Thermal Phenomenon ◽  
Practical Implications

Purpose The purpose of this paper is to present a comparison between reluctance synchronous machine-enabling work at high internal temperature (HT° machine) with laminated and solid rotor. Design/methodology/approach To obtain heat sources for the thermal model, calculations of the electromagnetic field were made using the Opera 3D program including effect of rotation and the resulting eddy current losses. To analyse the thermal phenomenon, the 3D coupled thermal-fluid (CFD) model is used. Findings The presented results show clearly that laminated construction is much better from a point of view of efficiency and temperature. However, solid construction can be interesting for high speed machines due to their mechanical robustness. Research limitations/implications The main problem, despite the use of parallel calculations, is the long calculation time. Practical implications The obtained simulation and experimental results show the possibility of building a machine operating at a much higher ambient temperature than it was previously produced for example in the vicinity of the aircraft turbines. Originality/value The paper presents the application of fully three-dimensional coupled electromagnetic and thermal analysis of new machine constructions designed for elevated temperature.

High-power InAlAs/InGaAs Schottky barrier photodiodes for analog microwave signal transmission

2022 ◽  
Vol 43 (1) ◽  
pp. 012302
Author(s):  
K. S. Zhuravlev ◽  
A. L. Chizh ◽  
K. B. Mikitchuk ◽  
A. M. Gilinsky ◽  
I. B. Chistokhin ◽  
...  
Keyword(s):  
Schottky Barrier ◽  
Transmission Lines ◽  
High Power ◽  
High Speed ◽  
Signal Transmission ◽  
Mesa Structure ◽  
Microwave Characterization ◽  
Absorbing Layer ◽  
Analog Transmission

Abstract The design, manufacturing and DC and microwave characterization of high-power Schottky barrier InAlAs/InGaAs back-illuminated mesa structure photodiodes are presented. The photodiodes with 10 and 15 μm mesa diameters operate at ≥40 and 28 GHz, respectively, have the output RF power as high as 58 mW at a frequency of 20 GHz, the DC responsivity of up to 1.08 A/W depending on the absorbing layer thickness, and a photodiode dark current as low as 0.04 nA. We show that these photodiodes provide an advantage in the amplitude-to-phase conversion factor which makes them suitable for use in high-speed analog transmission lines with stringent requirements for phase noise.

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