Highly functionalized EMC package materials for fingerprint sensors

2018 ◽  
Author(s):  
Junghwa Kim ◽  
Junwoo Lee ◽  
Yongyeop Park ◽  
Jiah Yoon ◽  
Jiyoon Cho ◽  
...  
Keyword(s):  
Package Materials

The Expected Environment for Waste Packages in a Salt Repository

1983 ◽  
Vol 26 ◽  
Author(s):  
L. R. Pederson ◽  
D. E. Clark ◽  
F. N. Hodges ◽  
G. L. Mcvpy ◽  
D. Rai
Keyword(s):  
Rock Salt ◽  
Near Field ◽  
Materials Testing ◽  
Site Specific ◽  
Waste Package ◽  
Barrier Materials ◽  
Waste Forms ◽  
Temperature Irradiation ◽  
Salt Brine ◽  
Package Materials

ABSTRACTThis paper discusses results of recent efforts to define the very near-field (within approximately 2m) environmental conditions to which waste packages will be exposed in a salt repository. These conditions must be considered in the experimental design for waste package materials testing, which includes corrosion of barrier materials and leaching of waste forms. Site-specific brine compositions have been determined, and “standard” brine compositions have been selected for testing purposes. Actual brine compositions will vary depending on origin, temperature, irradiation history, and contact with irradiated rock salt. Results of irradiating rock salt, synthetic brines, rock salt/brine mixtures, and reactions of irradiated rock salt with brine solutions are reported.

Use of Plastic Commercial Off-the-Shelf (COTS) Microcircuits for Space Applications

2003 ◽  
Author(s):  
R. David Gerke ◽  
Andrew A. Shapiro ◽  
Shri Agawal ◽  
David M. Peters ◽  
Michael A. Sandor
Keyword(s):  
Lower Cost ◽  
High Reliability ◽  
Space Applications ◽  
Active Devices ◽  
Lower Weight ◽  
Payload Mass ◽  
Commercial Off The Shelf ◽  
Time Required ◽  
The Cost ◽  
Package Materials

Commercial-off-the-shelf (COTS) plastic encapsulated microcircuits (PEM) are candidate-packaging technologies for spacecraft due to their enhanced performance, lower weight and lower cost. Much of the electronics used in space applications would be considered obsolete by everyday standards. This is primarily due the cost and time required for full space qualification. In order to gain the performance available in today’s electronics, COTS PEMs offer a viable path. PEMs can weigh half as much as their counter part ceramic packages. A lighter package results in a smaller overall payload for the same board functionality, a concern of critical importance for space missions because the payload mass dictates the launch vehicle requirements. Costs can be potentially reduced by using screening, accelerated testing or partial qualification techniques to complement the existing commercial qualification as well as by the reduced package materials costs. Assessing the risk associated with potentially lower reliability devices, engineers within the commercial and aerospace industries are using trade-off and risk analysis to aid in reducing spacecraft system cost while increasing performance and maintaining high reliability. In this paper we will outline the issues facing the use of COTS PEMs for spaceflight hardware from the aspect of both the electronic active devices as well as their packages. Finally, we will provide some guidelines for their use.

Preservation of cold-stored guavas influenced by package materials

2005 ◽  
Vol 18 (2) ◽  
pp. 71-76 ◽  
Author(s):  
Angelo Pedro Jacomino ◽  
Ilana Urbano Bron ◽  
Claire Isabel Grígoli de Luca Sarantópoulos ◽  
José Maria Monteiro Sigrist
Keyword(s):  
Package Materials

Analysis on Application of New Technology and Material in Package Design

2014 ◽  
Vol 643 ◽  
pp. 352-355
Author(s):  
Wan Qiu Jiang ◽  
Ke Zhang ◽  
De Kun Shen ◽  
Jing Zhang
Keyword(s):  
Everyday Life ◽  
New Technology ◽  
Package Design ◽  
Scientific Technology ◽  
Package Materials

With the daily improving consumption and scientific technology, higher demands on package design are getting even rigorous no matter on industrial or daily products, relevant package materials have appeared with the development of ecological, anti-counterfeiting, buffer and sterile technologies, which severely improves the quality of modern packaging, bringing more convenience and surprise for our everyday life.

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