Creep-fatigue modelling for solder-joint reliability predictions including the microstructural evolution of the solder

Mapping Intimacies ◽

10.1109/ectc.1990.122232 ◽

2002 ◽

Author(s):

H.J. Frost ◽

R.T. Howard

Keyword(s):

Solder Joint ◽

Microstructural Evolution ◽

Solder Joint Reliability ◽

Joint Reliability ◽

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Creep fatigue modeling for solder joint reliability predictions including the microstructural evolution of the solder

Microelectronics Reliability ◽

10.1016/0026-2714(91)90060-k ◽

1991 ◽

Vol 31 (5) ◽

pp. 1039

Keyword(s):

Solder Joint ◽

Microstructural Evolution ◽

Solder Joint Reliability ◽

Joint Reliability ◽

Creep Fatigue ◽

Fatigue Modeling

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Creep fatigue modeling for solder joint reliability predictions including the microstructural evolution of the solder

IEEE Transactions on Components Hybrids and Manufacturing Technology ◽

10.1109/33.62586 ◽

1990 ◽

Vol 13 (4) ◽

pp. 727-735 ◽

Author(s):

H.J. Frost ◽

R.T. Howard

Keyword(s):

Solder Joint ◽

Microstructural Evolution ◽

Solder Joint Reliability ◽

Joint Reliability ◽

Creep Fatigue ◽

Fatigue Modeling

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Solder Joint Reliability Assessment and Pad Size Studies of FO-WLP With Glass Substrate

IEEE Transactions on Device and Materials Reliability ◽

10.1109/tdmr.2021.3056054 ◽

2021 ◽

Vol 21 (1) ◽

pp. 96-101 ◽

Author(s):

P. H. Wang ◽

Y. C. Lee ◽

C. K. Lee ◽

H. H. Chang ◽

K. N. Chiang

Keyword(s):

Solder Joint ◽

Glass Substrate ◽

Reliability Assessment ◽

Solder Joint Reliability ◽

Joint Reliability

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Effect of PCB thickness on solder joint reliability of Quad Flat no-lead assembly under Power Cycling and Thermal Cycling

2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) ◽

10.1109/semi-therm.2017.7896911 ◽

2017 ◽

Author(s):

Unique Rahangdale ◽

Rahul Srinivas ◽

S. Krishnamurthy ◽

Pavan Rajmane ◽

Abel Misrak ◽

...

Keyword(s):

Solder Joint ◽

Thermal Cycling ◽

Solder Joint Reliability ◽

Joint Reliability ◽

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Experimental evaluation of SnAgCu solder joint reliability in 100-μm pitch flip-chip assemblies

Microelectronics Reliability ◽

10.1016/j.microrel.2014.01.011 ◽

2014 ◽

Vol 54 (5) ◽

pp. 939-944 ◽

Author(s):

Ye Tian ◽

Xi Liu ◽

Justin Chow ◽

Yi Ping Wu ◽

Suresh K. Sitaraman

Keyword(s):

Solder Joint ◽

Experimental Evaluation ◽

Flip Chip ◽

Solder Joint Reliability ◽

Snagcu Solder ◽

Joint Reliability

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Negative impact of certain adhesive configurations on solder joint reliability of package on package architecture: A comprehensive experimental and numerical study

2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2016.7517638 ◽

2016 ◽

Author(s):

Shantanu Tripathi ◽

Ru Han ◽

Milena Vujosevic

Keyword(s):

Solder Joint ◽

Negative Impact ◽

Numerical Study ◽

Solder Joint Reliability ◽

Joint Reliability

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SOLDERABILITY - THE KEY TO SOLDER JOINT RELIABILITY

10.2514/6.1966-2584 ◽

1966 ◽

Author(s):

ROBERT NORTH

Keyword(s):

Solder Joint ◽

Solder Joint Reliability ◽

Joint Reliability

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Effects of Voids and Their Interactions on SMT Solder Joint Reliability

Soldering & Surface Mount Technology ◽

10.1108/eb037876 ◽

1994 ◽

Vol 6 (3) ◽

pp. 21-32 ◽

Author(s):

S. Liu ◽

Y.H. Mei

Keyword(s):

Solder Joint ◽

Solder Joint Reliability ◽

Joint Reliability

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Substrate opening to increase solder joint reliability and circuit integration

2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) ◽

10.1109/eptc.2015.7412392 ◽

2015 ◽

Author(s):

Lim Teck Guan ◽

Che Faxing

Keyword(s):

Solder Joint ◽

Solder Joint Reliability ◽

Joint Reliability ◽

Circuit Integration

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Comprehensive board-level solder joint reliability modeling and testing of QFN and PowerQFN packages

Microelectronics Reliability ◽

10.1016/s0026-2714(03)00184-7 ◽

2003 ◽

Vol 43 (8) ◽

pp. 1329-1338 ◽

Author(s):

Tong Yan Tee ◽

Hun Shen Ng ◽

Daniel Yap ◽

Zhaowei Zhong

Keyword(s):

Solder Joint ◽

Solder Joint Reliability ◽

Reliability Modeling ◽

Joint Reliability ◽

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