The application of HITCE ceramic material for LGA-type chip scale package

Author(s):  
K. Maeda ◽  
M. Higashi ◽  
M. Kokubu ◽  
S. Nakagawa
Author(s):  
Jason H. Lagar ◽  
Rudolf A. Sia

Abstract Most Wafer Level Chip Scale Package (WLCSP) units returned by customers for failure analysis are mounted on PCB modules with an epoxy underfill coating. The biggest challenge in failure analysis is the sample preparation to remove the WLCSP device from the PCB without inducing any mechanical defect. This includes the removal of the underfill material to enable further electrical verification and fault isolation analysis. This paper discusses the evaluations conducted in establishing the WLCSP demounting process and removal of the epoxy underfill coating. Combinations of different sample preparation techniques and physical failure analysis steps were evaluated. The established process enabled the electrical verification, fault isolation and further destructive analysis of WLCSP customer returns mounted on PCB and with an epoxy underfill coating material. This paper will also showcase some actual full failure analysis of WLCSP customer returns where the established process played a vital role in finding the failure mechanism.


2019 ◽  
Vol 770 (5) ◽  
pp. 45-50
Author(s):  
S.N. LEONOVICH ◽  
◽  
D.V. SVIRIDOV ◽  
A.L. BELANOVICH ◽  
L.S. KARPUSHENKOVA ◽  
...  

2016 ◽  
Vol 870 ◽  
pp. 191-195
Author(s):  
N.A. Vil'bitskaya ◽  
S.A. Vilbitsky ◽  
A.G. Avakyan

The peculiarities of using mathematical and statistical data processing methods in studying the intensification in the process of sintering a ceramic material with a high content of high-calcium waste, and mineralizing sintering lithium-containing waste were studied. The region of optimal ceramic masses composition, which allows obtaining ceramic tiles with high functional properties, was defined.


2010 ◽  
Vol 62 ◽  
pp. 203-208 ◽  
Author(s):  
Pasquale Bene ◽  
Danilo Bardaro ◽  
Daniela Bello ◽  
Orazio Manni

The aim of the work is the study of the pyroplasticity in ceramic materials in order to simulate the deformations of complex ceramic component during sintering. A ceramic material undergoing densification can be treated as a linear viscous material. Generally, the viscosity decreases as the temperature increases, however the densification and the consequent grain growth, result in a viscosity increase. A bending creep test is proposed for measuring the change in viscosity of the ceramic material during densification. Equations, based on beam deflection theory, are derived to determine the viscosity during the whole firing cycle by measuring the deflection in the centre of specimens. In addition, dilatometric analyses are performed to measure the sintering shrinkage and the specimen density, which continuously changes during the sintering process. On the basis of an accurate experimental characterization the parameters of Maxwell viscoelastic constitutive law are derived. A numerical-experimental procedure has been adopted in order to calibrate the numerical model that, finally, has been used to predict the pyroplastic deformations of complex ceramic components.


Author(s):  
L. Shiv ◽  
M. Heschel ◽  
H. Korth ◽  
S. Weichel ◽  
R. Hauffe ◽  
...  

1992 ◽  
Vol 37 (3) ◽  
pp. 305-310 ◽  
Author(s):  
Dong Guoqiang ◽  
Rajni Kaul ◽  
Bo Mattiasson

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