High frequency performance of integral capacitors in cofired ceramic substrates

2002 ◽  
Author(s):  
Y. Taguchi ◽  
M. Itagaki ◽  
O. Inoue ◽  
J. Kato ◽  
K. Eda
Keyword(s):  
High Frequency ◽  
Ceramic Substrates ◽  
High Frequency Performance

Evaluation of die to organic laminate to PCB interconnects up to 50GHz

2019 ◽  
Vol 2019 (1) ◽  
pp. 000223-000227
Author(s):  
Selaka Bulumulla ◽  
Koushik Ramachandran
Keyword(s):  
High Frequency ◽  
Printed Circuit Board ◽  
Substrate Material ◽  
Circuit Board ◽  
Test Vehicle ◽  
Ceramic Substrates ◽  
High Frequencies ◽  
Multiple Levels ◽  
High Frequency Performance ◽  
High Density Packaging

Abstract Ceramic substrates have traditionally been used in RF and microwave packaging applications because of the electrical properties at high frequencies. However, there is significant interest in using organic laminates due to its tighter wiring ground rules for high density packaging and lower cost of fabrication. The high frequency performance of interconnection from die to PCB using an organic packaging substrate has not yet been studied in detail. In this work, the interconnect performance of die to organic laminate to PCB up to 50 GHz was modeled and characterized using a test vehicle assembly. The test vehicle was specifically designed with test pads to characterize the interconnect performance at multiple levels of interconnection. A comparison study using a ceramic package substrate was also carried out. The modeling and hardware testing results from this study showed −3dB bandwidth of more than 50GHz for printed circuit board (PCB) to organic laminate and a bandwidth of 40GHz for the die to organic laminate to PCB interconnection. The results from this study showed that the organic laminate demonstrated a high frequency performance comparable to that of the ceramic substrate, which makes it suitable as a packaging substrate material for high frequency applications.

DC and high frequency performance of 0.1 [micro sign]m n-type Si∕Si0.6Ge0.4 MODFET with fMAX=188 GHz at 300K and fMAX=230 GHz at 50K

2003 ◽  
Vol 39 (1) ◽  
pp. 149 ◽  
Author(s):  
M. Enciso-Aguilar ◽  
F. Aniel ◽  
P. Crozat ◽  
R. Adde ◽  
H.-J. Herzog ◽  
...  
Keyword(s):  
High Frequency ◽  
High Frequency Performance

High-frequency performance of separate absorption grading, charge, and multiplication InP/InGaAs avalanche photodiodes

1993 ◽  
Vol 5 (6) ◽  
pp. 672-674 ◽  
Author(s):  
L.E. Tarof ◽  
J. Yu ◽  
R. Bruce ◽  
D.G. Knight ◽  
T. Baird ◽  
...  
Keyword(s):  
High Frequency ◽  
Avalanche Photodiodes ◽  
High Frequency Performance

The High-Frequency Performance of Hetero-Material-Gate CNTFETs with Gate Underlap

2014 ◽  
Vol 23 (4) ◽  
pp. 315-319
Author(s):  
Wei Wang ◽  
Xiao Yang ◽  
Na Li ◽  
Lu Zhang ◽  
Gongshu Yue ◽  
...  
Keyword(s):  
High Frequency ◽  
High Frequency Performance ◽  
Gate Underlap

scholarly journals Scaling and high-frequency performance of AlN/GaN HEMTs

2011 ◽  
Author(s):  
Xi Luo ◽  
Subrata Halder ◽  
Walter R. Curtice ◽  
James C. M. Hwang ◽  
Kelson D. Chabak ◽  
...  
Keyword(s):  
High Frequency ◽  
Gan Hemts ◽  
High Frequency Performance
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