Accumulated creep strain and energy density based thermal fatigue life prediction models for SnAgCu solder joints
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2014 ◽
Vol 8
(1/2/3)
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pp. 3
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1998 ◽
Vol 30
(1-2)
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pp. 31-45
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1993 ◽
Vol 45
(5)
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pp. 643-654
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1992 ◽
Vol 15
(4)
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pp. 559-570
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