Effects of Assembly Process Parameters on the Structure and Thermal Stability of Sn-Capped Cu Bump Bonds

Author(s):  
Alan Huffman ◽  
Matthew Lueck ◽  
Christopher Bower ◽  
Dorota Temple
1987 ◽  
Vol 93 ◽  
Author(s):  
T. Venkatesan ◽  
S. A. Schwarz ◽  
P. Mei ◽  
H. W. Yoon

ABSTRACTSubsequent to the implantation of certain ions, the thermal stability of AlGaAs/GaAs superlattices can be reduced, enabling mixing of the layers at temperatures where they would otherwise be stable. The mixed layers have intermediate alloy composition and are of good crystalline quality. As a result this process is of great value in device fabrication where a high degree of vertical and lateral bandgap control is desirable. This paper reviews our work in understanding the mechanism of diffusion, its dependence on varilous process parameters, and potential applications in device fabrication.


2016 ◽  
Vol 14 (1) ◽  
pp. 86-96 ◽  
Author(s):  
Chaolin Ye ◽  
Guozhen Ma ◽  
Zhihua Zhu ◽  
Wuchang Fu ◽  
Junpeng Duan ◽  
...  

2011 ◽  
Vol 683 ◽  
pp. 249-254 ◽  
Author(s):  
Emanuela Cerri

Friction Stir Welding process introduces a degree of deformation in the material that is related to process parameters. They directly regulate the heat input of welding process and then the morphology and the microstructure characteristics. In the present work, an investigation was carried out on 6082T6 butt joints obtained by Friction Stir Welding process. The microstructure and mechanical characterizations were performed before and after a post-welding treatment at 535°C for 2 hours and cold deformation. The thermal stability of fine recrystallized grains in the nugget zone depends on process parameters and post-welding heat treatment and it has unusual consequences on mechanical properties. In fact abnormal grain growth, that occurs in the nugget zone, increases ductility of the joints and homogenizes the hardness profile of the whole joint.


2019 ◽  
Vol 29 (1-2) ◽  
pp. 241-254 ◽  
Author(s):  
Valentina Donadei ◽  
Heli Koivuluoto ◽  
Essi Sarlin ◽  
Petri Vuoristo

Abstract The present work investigates the effect of different process parameters on the production of low-density polyethylene (LDPE) coatings by flame spray technology. Previously, flame spraying of polymers has been successfully performed to obtain durable icephobic coatings, providing an interesting solution for applications facing icing problems, e.g. in marine, aviation, energy, and transportation industry. However, the fine tailoring of the process parameters represents a necessary strategy for optimising the coating production due to the unique thermal properties of each polymer. For this purpose, we vary the heat input of the process during flame spraying of the coating, by changing the transverse speed and the spraying distance. The results show that the variation in the process parameters strongly influenced the quality of the polymer coating, including its areal roughness, thickness, chemical composition, thermal stability, and degree of crystallinity. Furthermore, we demonstrate that these properties significantly affect the icephobic behaviour of the surface within the spray window of the chosen parameters. In conclusion, the relationship between the thermal degradation of the polymer and the icephobicity of the surface was defined. This highlights the importance of process parameter optimisation in order to achieve the desired icephobic performance of the LPDE coatings.


Author(s):  
Shiro Fujishiro ◽  
Harold L. Gegel

Ordered-alpha titanium alloys having a DO19 type structure have good potential for high temperature (600°C) applications, due to the thermal stability of the ordered phase and the inherent resistance to recrystallization of these alloys. Five different Ti-Al-Ga alloys consisting of equal atomic percents of aluminum and gallium solute additions up to the stoichiometric composition, Ti3(Al, Ga), were used to study the growth kinetics of the ordered phase and the nature of its interface.The alloys were homogenized in the beta region in a vacuum of about 5×10-7 torr, furnace cooled; reheated in air to 50°C below the alpha transus for hot working. The alloys were subsequently acid cleaned, annealed in vacuo, and cold rolled to about. 050 inch prior to additional homogenization


Author(s):  
Yih-Cheng Shih ◽  
E. L. Wilkie

Tungsten silicides (WSix) have been successfully used as the gate materials in self-aligned GaAs metal-semiconductor-field- effect transistors (MESFET). Thermal stability of the WSix/GaAs Schottky contact is of major concern since the n+ implanted source/drain regions must be annealed at high temperatures (∼ 800°C). WSi0.6 was considered the best composition to achieve good device performance due to its low stress and excellent thermal stability of the WSix/GaAs interface. The film adhesion and the uniformity in barrier heights and ideality factors of the WSi0.6 films have been improved by depositing a thin layer of pure W as the first layer on GaAs prior to WSi0.6 deposition. Recently WSi0.1 has been used successfully as the gate material in 1x10 μm GaAs FET's on the GaAs substrates which were sputter-cleaned prior to deposition. These GaAs FET's exhibited uniform threshold voltages across a 51 mm wafer with good film adhesion after annealing at 800°C for 10 min.


1991 ◽  
Vol 1 (12) ◽  
pp. 1823-1836 ◽  
Author(s):  
M. Bessière ◽  
A. Quivy ◽  
S. Lefebvre ◽  
J. Devaud-Rzepski ◽  
Y. Calvayrac

1994 ◽  
Vol 4 (4) ◽  
pp. 653-657
Author(s):  
B. Bonzi ◽  
M. El Khomssi ◽  
H. Lanchon-Ducauquis

1998 ◽  
Vol 08 (PR2) ◽  
pp. Pr2-63-Pr2-66 ◽  
Author(s):  
R. Varga ◽  
P. Vojtaník ◽  
A. Lovas

Sign in / Sign up

Export Citation Format

Share Document