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150 mm RF GaN Technology for Commercial RF Applications (Invited)
2021 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)
◽
10.1109/edtm50988.2021.9420945
◽
2021
◽
Author(s):
B. Green
◽
K. Moore
◽
S. Klingbeil
◽
C. Ramplev
◽
P. Renaud
◽
...
Keyword(s):
Rf Applications
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Guidelines for the measurement method of power durability for surface acoustic wave (SAW) and bulk acoustic wave (BAW) devices in radio frequency (RF) applications
10.3403/30366384u
◽
2020
◽
Keyword(s):
Acoustic Wave
◽
Radio Frequency
◽
Surface Acoustic Wave
◽
Measurement Method
◽
Bulk Acoustic Wave
◽
Rf Applications
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Collaborative Research and Development Delivery Order 0024: Synthesis, Processing, and Evaluation of Polymers for RF Applications
10.21236/ada462792
◽
2006
◽
Author(s):
Christy R. Vestal
Keyword(s):
Research And Development
◽
Collaborative Research
◽
Rf Applications
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Erratum: Integrated optical mixer for RF applications
Electronics Letters
◽
10.1049/el:19910249
◽
1991
◽
Vol 27
(4)
◽
pp. 392
Author(s):
D. Uttamchandani
◽
H.S. Al-Raweshidy
Keyword(s):
Integrated Optical
◽
Rf Applications
◽
Optical Mixer
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Development and testing of a high voltage direct converter for high power RF applications
IET Pulsed Power Symposium 2006
◽
10.1049/ic:20060095
◽
2006
◽
Cited By ~ 2
Author(s):
D.J. Cook
◽
J.C. Clare
◽
P.W. Wheeler
Keyword(s):
High Voltage
◽
High Power
◽
Rf Applications
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Analysis of field-plate LDMOS devices for RF applications
9th International Seminar on Power Semiconductors (ISPS 2008)
◽
10.1049/ic:20080226
◽
2008
◽
Author(s):
I. Cortes
◽
D. Flores
◽
F. Morancho
◽
S. Hidalgo
◽
J. Rebollo
Keyword(s):
Field Plate
◽
Rf Applications
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A Novel LTCC-based 3D Packaging for Ultrawideband RF Applications
2019 International Conference on Microwave and Millimeter Wave Technology (ICMMT)
◽
10.1109/icmmt45702.2019.8992260
◽
2019
◽
Author(s):
Jifan Zhang
◽
Dong Dong
◽
Jianghong Liu
◽
Haoxiang Lai
Keyword(s):
3D Packaging
◽
Rf Applications
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Prospects of Two-dimensional Material-based Field-Effect Transistors for Analog/RF Applications
2021 34th International Conference on VLSI Design and 2021 20th International Conference on Embedded Systems (VLSID)
◽
10.1109/vlsid51830.2021.00021
◽
2021
◽
Author(s):
Arjun Kumar
◽
Akhilesh Rawat
◽
Brajesh Rawat
Keyword(s):
Field Effect
◽
Field Effect Transistors
◽
Two Dimensional
◽
Rf Applications
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Area-Efficient Extended 3-D Inductor Based on TSV Technology for RF Applications
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
◽
10.1109/tvlsi.2020.3036385
◽
2020
◽
pp. 1-10
Author(s):
Chenbing Qu
◽
Zhangming Zhu
◽
Yunfei En
◽
Liwei Wang
◽
Xiaoxian Liu
Keyword(s):
Rf Applications
◽
Area Efficient
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Development and power device reliability assessment of resonant pulsed power converters for RF applications
IET Conference on High Power RF Technologies
◽
10.1049/cp.2009.0009
◽
2009
◽
Author(s):
F. Carastro
◽
J.C. Clare
◽
M.J. Bland
◽
C.M. Johnson
◽
P.W. Wheeler
Keyword(s):
Power Converters
◽
Reliability Assessment
◽
Pulsed Power
◽
Power Device
◽
Device Reliability
◽
Rf Applications
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Integrated MIM Perovskite Capacitors for RF Applications
Integrated Ferroelectrics
◽
10.1080/10584580490895392
◽
2004
◽
Vol 66
(1)
◽
pp. 231-242
◽
Cited By ~ 2
Author(s):
DEFAŸ EMMANUEL
◽
BLANCHET FLORIA
◽
BILLARD CHRISTOPHE
◽
FORT CHARLES
◽
DAVID JEAN-BAPTISTE
◽
...
Keyword(s):
Rf Applications
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