Intelligent bidirectional power switch module for matrix converter applications

Author(s):  
J. L. Galvez ◽  
X. Jorda ◽  
M. Vellvehi ◽  
J. Millan ◽  
M. A. Jose-Prieto ◽  
...  
Author(s):  
Ba-Sy Nguyen ◽  
Paul C.-P. Chao

Abstract Pulsed electric field (PEF) technology is a promising non-thermal pasteurization method that can be utilized to inactivate microorganisms in liquid food with high-voltage PEF. The power switch which is an important component of the PEF systems. This paper presents a design and implementation of an insulated gate bipolar transistor (IGBT) module which includes connections of three series and four parallel IGBTs and its special gate driver for small liquid food treatment systems at home. In this approach, two important issues must be considered. The first is to provide a safe operating condition for each single IGBTs in transient intervals. The second is to design gate drive systems with the capability of driving a large number of discrete devices simultaneously and ensure the current and voltage of single IGBTs in the module to be approximations. To evaluate the operation of the proposed structure, a module of three series and four parallel switches with the voltage capability of 1.8 kV and 60A is tested experimentally.


2010 ◽  
Vol 112 ◽  
pp. 113-127 ◽  
Author(s):  
Adrien Zéanh ◽  
Olivier Dalverny ◽  
Moussa Karama ◽  
Arezki Bouzourene

This paper presents a Finite Elements Modelling (FEM) based methodology dedicated to the evaluation of the lifetime and the reliability of assemblies involving brittle materials under cyclic loading. It focuses on the particular case of metal bonded Aluminium Nitride (AlN) substrates used in power electronic switch modules. The ceramic fracture criterion was formulated according to the weakest link concept, under Weibull's approach. The material's parameters were determined by running three points bending tests. In order to check the relevancy of the proposed methodology, a non linear thermomechanical Finite Elements Model allowed computing the number of thermal cycles before substrate brittle fracture within a test vehicle, which was then compared to experimental results. Once validated, the methodology was applied to two different configurations of a power switch module, designed for harsh environment aeronautic applications. The corresponding external loading profile was considered to compute and monitor the evolution of the maximal principal stresses within the ceramic substrates whole volumes. Their lifetimes and reliabilities was finally assessed and compared to the applications requirements.


2010 ◽  
Vol 2010 (HITEC) ◽  
pp. 000316-000324
Author(s):  
Michael J. Palmer ◽  
R. Wayne Johnson ◽  
Tracy Autry ◽  
Rizal Aguirre ◽  
Victor Lee ◽  
...  

A hermetic, multichip power package for silicon carbide devices that will operate in a 200°C ambient and switch 50 to 100 amps has been developed. The Al2O3/MoCu structure, upon which the SiC JFETs and diodes have been attached, was designed in a manner to hermetically seal the device areas. Details of the materials and processes used to fabricate the package are discussed. Die attach, ribbon bonding and lid attach are also described.


Author(s):  
K. Selvakumar ◽  
R. Palanisamy ◽  
Arul Rayappan Stalin ◽  
P. Gopi ◽  
P. Ponselvin ◽  
...  

<p>This paper illustrates the simulation of 3-phase matrix converter using Space Vector Modulation (SVM). Variable AC output voltage engendered using matrix converter with bidirectional power switches controlled by appropriate switching pulse. The conventional PWM converter engenders switching common mode voltage across the load system terminals, which cause to common mode current and its leads to bearing failure in load drive. These problems can be rectified using SVM and which minimize the effect on the harmonic fluctuation in AC output voltage and stress on the power switch is reduced using bidirectional switch for proposed 3-phase matrix converter. The simulation results have been presented to validate the proposed system using matlab / simulink.</p>


2015 ◽  
Vol 19 (95) ◽  
pp. 88-91
Author(s):  
Anna S. Sergiienko ◽  
◽  
Sergej S. Starostin

1996 ◽  
Vol 116 (4) ◽  
pp. 404-411 ◽  
Author(s):  
Jun Oyama ◽  
Xiaorong Xia ◽  
Tsuyoshi Higuchi ◽  
Eiji Yamada ◽  
Takashi Koga

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