A novel Intelligent Power Module (IPM) in a compact transfer Mold package with New High Voltage Integrated Circuit (HVIC) and integrated bootstrap diodes

Author(s):  
Mustafa Cem Ozkilic ◽  
Marco Honsberg ◽  
Thomas Radke
2019 ◽  
Vol 1237 ◽  
pp. 042075
Author(s):  
Qing Hua ◽  
Jiaxing Zheng ◽  
Shixin Wang ◽  
Zhijian Pan ◽  
Yan Leng ◽  
...  

Author(s):  
Trong Trung Le ◽  
Zarel Valdez-Nava ◽  
Guillaume Belijar ◽  
Sombel Diaham ◽  
Lionel Laudebat ◽  
...  

Sensors ◽  
2021 ◽  
Vol 21 (8) ◽  
pp. 2590
Author(s):  
Alexandre Robichaud ◽  
Dominic Deslandes ◽  
Paul-Vahé Cicek ◽  
Frederic Nabki

This paper proposes a system in package (SiP) for ultrasonic ranging composed of a 4 × 8 matrix of piezoelectric micromachined ultrasonic transducers (PMUT) and an interface integrated circuit (IC). The PMUT matrix is fabricated using the PiezoMUMPS process and the IC is implemented in the AMS 0.35 µm technology. Simulation results for the PMUT are compared to the measurement results, and an equivalent circuit has been derived to allow a better approximation of the load of the PMUT on the IC. The control circuit is composed of a high-voltage pulser to drive the PMUT for transmission and of a transimpedance amplifier to amplify the received echo. The working frequency of the system is 1.5 MHz.


Author(s):  
Zhao Wen-jie ◽  
Wan Cheng-an ◽  
Gao Yi-fei ◽  
Zhang Guo-shuai ◽  
Zheng Yan ◽  
...  

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