2021 IEEE Applied Power Electronics Conference and Exposition (APEC)

2021 ◽

Author(s):

Qihao Song ◽

Ruizhe Zhang ◽

Joseph P. Kozak ◽

Jingcun Liu ◽

Qiang Li ◽

...

Keyword(s):

Gan Hemts

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Practical considerations of Voltage-Source-Inverters Input Impedance Modeling for System Stability Analysis

2021 IEEE Applied Power Electronics Conference and Exposition (APEC) ◽

10.1109/apec42165.2021.9487469 ◽

2021 ◽

Author(s):

M. Sanz ◽

D. Ochoa ◽

A. Lazaro ◽

A. Barrado ◽

D. Santamargarita ◽

...

Keyword(s):

Stability Analysis ◽

Input Impedance ◽

System Stability ◽

Voltage Source ◽

Voltage Source Inverters ◽

Impedance Modeling ◽

System Stability Analysis

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Soft Start-up of Three Phase CLLC Converter Based on State Trajectory Control

2021 IEEE Applied Power Electronics Conference and Exposition (APEC) ◽

10.1109/apec42165.2021.9487467 ◽

2021 ◽

Author(s):

Ahmed Nabih ◽

Feng Jin ◽

Qiang Li ◽

Fred. C. Lee

Keyword(s):

Trajectory Control ◽

State Trajectory ◽

Soft Start ◽

Start Up ◽

Three Phase

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A Large Air-Gap Multi-MHz Capacitive Wireless Power Transfer System Using Compact Charging Pads

2021 IEEE Applied Power Electronics Conference and Exposition (APEC) ◽

10.1109/apec42165.2021.9487177 ◽

2021 ◽

Author(s):

Sounak Maji ◽

Sreyam Sinha ◽

Brandon Regensburger ◽

Khurram K. Afridi

Keyword(s):

Wireless Power Transfer ◽

Air Gap ◽

Transfer System ◽

Power Transfer ◽

Wireless Power ◽

Wireless Power Transfer System

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Optimization Algorithms for Dynamic Tuning of Wide Bandgap Semiconductor Device Models

2021 IEEE Applied Power Electronics Conference and Exposition (APEC) ◽

10.1109/apec42165.2021.9487029 ◽

2021 ◽

Author(s):

William Collings ◽

Tolen Nelson ◽

Andrew Sellers ◽

Raghav Khanna ◽

Alan Courtay ◽

...

Keyword(s):

Semiconductor Device ◽

Optimization Algorithms ◽

Wide Bandgap ◽

Wide Bandgap Semiconductor ◽

Dynamic Tuning

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Single-Stage Three-Phase Step-Up SEPIC Differential Grid-Tied Inverter Features an In-depth Mathematical Analysis for Solving Practical Design Issues

2021 IEEE Applied Power Electronics Conference and Exposition (APEC) ◽

10.1109/apec42165.2021.9487369 ◽

2021 ◽

Author(s):

Ahmed Shawky ◽

Mahmoud A. Sayed ◽

Takaharu Takeshita

Keyword(s):

Mathematical Analysis ◽

Single Stage ◽

Design Issues ◽

Phase Step ◽

Three Phase ◽

Practical Design

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Simplified Frequency-Domain Analysis of Improved Asymmetrical PWM Technique for DC-DC Resonant Converters

2021 IEEE Applied Power Electronics Conference and Exposition (APEC) ◽

10.1109/apec42165.2021.9487302 ◽

2021 ◽

Author(s):

Abhishek Awasthi ◽

Praveen Jain

Keyword(s):

Frequency Domain ◽

Domain Analysis ◽

Frequency Domain Analysis ◽

Resonant Converters

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A 10-level GaN-based Flying Capacitor Multilevel Boost Converter for Radiation-Hardened Operation in Space Applications

2021 IEEE Applied Power Electronics Conference and Exposition (APEC) ◽

10.1109/apec42165.2021.9487143 ◽

2021 ◽

Author(s):

Samantha Coday ◽

Ansel Barchowsky ◽

Robert C.N. Pilawa-Podgurski

Keyword(s):

Boost Converter ◽

Space Applications ◽

Radiation Hardened

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A Seamless Transition Control Method for Series Voltage Injection of Transformerless Perturbation Injectors

2021 IEEE Applied Power Electronics Conference and Exposition (APEC) ◽

10.1109/apec42165.2021.9487465 ◽

2021 ◽

Author(s):

Sizhan Zhou ◽

Bo Wen ◽

Rolando Burgos ◽

Jake Verhulst ◽

Mohamed Belkhayat ◽

...

Keyword(s):

Control Method ◽

Transition Control ◽

Seamless Transition

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Tiny Wafer Level Chip Scale Packaged Inductive Components for High Frequency Isolated/Non-Isolated DC-DC Converters

2021 IEEE Applied Power Electronics Conference and Exposition (APEC) ◽

10.1109/apec42165.2021.9487348 ◽

2021 ◽

Author(s):

Dragan Dinulovic ◽

Mahmoud Shousha ◽

Martin Haug

Keyword(s):

High Frequency ◽

Wafer Level

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2021 IEEE Applied Power Electronics Conference and Exposition (APEC)
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Robustness of Cascode GaN HEMTs under Repetitive Overvoltage and Surge Energy Stresses

Practical considerations of Voltage-Source-Inverters Input Impedance Modeling for System Stability Analysis

Soft Start-up of Three Phase CLLC Converter Based on State Trajectory Control

A Large Air-Gap Multi-MHz Capacitive Wireless Power Transfer System Using Compact Charging Pads

Optimization Algorithms for Dynamic Tuning of Wide Bandgap Semiconductor Device Models

Single-Stage Three-Phase Step-Up SEPIC Differential Grid-Tied Inverter Features an In-depth Mathematical Analysis for Solving Practical Design Issues

Simplified Frequency-Domain Analysis of Improved Asymmetrical PWM Technique for DC-DC Resonant Converters

A 10-level GaN-based Flying Capacitor Multilevel Boost Converter for Radiation-Hardened Operation in Space Applications

A Seamless Transition Control Method for Series Voltage Injection of Transformerless Perturbation Injectors

Tiny Wafer Level Chip Scale Packaged Inductive Components for High Frequency Isolated/Non-Isolated DC-DC Converters

Export Citation Format

2021 IEEE Applied Power Electronics Conference and Exposition (APEC)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Robustness of Cascode GaN HEMTs under Repetitive Overvoltage and Surge Energy Stresses

Practical considerations of Voltage-Source-Inverters Input Impedance Modeling for System Stability Analysis

Soft Start-up of Three Phase CLLC Converter Based on State Trajectory Control

A Large Air-Gap Multi-MHz Capacitive Wireless Power Transfer System Using Compact Charging Pads

Optimization Algorithms for Dynamic Tuning of Wide Bandgap Semiconductor Device Models

Single-Stage Three-Phase Step-Up SEPIC Differential Grid-Tied Inverter Features an In-depth Mathematical Analysis for Solving Practical Design Issues

Simplified Frequency-Domain Analysis of Improved Asymmetrical PWM Technique for DC-DC Resonant Converters

A 10-level GaN-based Flying Capacitor Multilevel Boost Converter for Radiation-Hardened Operation in Space Applications

A Seamless Transition Control Method for Series Voltage Injection of Transformerless Perturbation Injectors

Tiny Wafer Level Chip Scale Packaged Inductive Components for High Frequency Isolated/Non-Isolated DC-DC Converters

2021 IEEE Applied Power Electronics Conference and Exposition (APEC)
Latest Publications