Quality Monitoring and Prospects of Wire Bonding
2012 ◽
Vol 588-589
◽
pp. 1156-1160
Keyword(s):
Wire bonding is rapidly developmental technology of microelectronic packaging nearly half a century and become the main trend of semiconductor packaging field currently. This article introduces the main process parameters influencing on bonding quality, the methods to improve the bonding reliability, and prospects of developmental tendency of wire bonding.
2011 ◽
Vol 25
(3)
◽
pp. 884-900
◽
Keyword(s):
Keyword(s):
2016 ◽
Vol 716
◽
pp. 114-120
◽
Keyword(s):
2010 ◽
Vol 43
◽
pp. 578-582
◽
2012 ◽
Vol 192
◽
pp. 180-184
◽
Keyword(s):
Keyword(s):
2013 ◽
Vol 135
(1)
◽
Keyword(s):