Performance analysis of a synthetic jet-microchannel hybrid heat sink for electronic cooling

2009 ◽  
Author(s):  
T T Chandratilleke ◽  
D Jagannatha ◽  
R Narayanaswamy
Keyword(s):  
Performance Analysis ◽  
Heat Sink ◽  
Synthetic Jet ◽  
Electronic Cooling

Performance analysis of heat pipe aided NEPCM heat sink for transient electronic cooling

2017 ◽  
Vol 73 ◽  
pp. 1-13 ◽  
Author(s):  
K.R. Suresh Kumar ◽  
R. Dinesh ◽  
A. Ameelia Roseline ◽  
S. Kalaiselvam
Keyword(s):  
Performance Analysis ◽  
Heat Pipe ◽  
Heat Sink ◽  
Electronic Cooling

Cooling Performance Analysis of Heat Sink

2011 ◽  
Vol 1 (9) ◽  
pp. 65-67
Author(s):  
Pritesh S Patel ◽  
◽  
Prof. Dattatraya G Subhedar ◽  
Prof. Kamlesh V Chauhan
Keyword(s):  
Performance Analysis ◽  
Heat Sink ◽  
Cooling Performance

scholarly journals Cooling Performance of Heat Sinks Used in Electronic Devices

2018 ◽  
Vol 171 ◽  
pp. 02003
Author(s):  
Ibrahim Mjallal ◽  
Hussein Farhat ◽  
Mohammad Hammoud ◽  
Samer Ali ◽  
Ali AL Shaer ◽  
...  
Keyword(s):  
Heat Sink ◽  
Electronic Devices ◽  
Heat Fluxes ◽  
Electronic Cooling ◽  
Heat Sinks ◽  
Passive Cooling ◽  
Short Term ◽  
Cooling Systems ◽  
Thermal Output ◽  
Electrical Devices

Existing passive cooling solutions limit the short-term thermal output of systems, thereby either limiting instantaneous performance or requiring active cooling solutions. As the temperature of the electronic devices increases, their failure rate increases. That’s why electrical devices should be cooled. Conventional electronic cooling systems usually consist of a metal heat sink coupled to a fan. This paper compares the heat distribution on a heat sink relative to different heat fluxes produced by electronic chips. The benefit of adding a fan is also investigated when high levels of heat generation are expected.

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