Evaluation of Thermal Strains in BGA Packages Using Digital Speckle Correlation Technique and FEA
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1998 ◽
Vol 10
(1)
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pp. 63-73
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2000 ◽
Vol 23
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pp. 80-87
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2006 ◽
pp. 1117-1120
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2012 ◽
Vol 6
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pp. 162-170