Characterization of Integrated Inductors on Flexible Substrate for Heterogeneous Integration

Author(s):  
Wilson Freitas ◽  
Nailson Carvalho ◽  
Rodrigo Souza ◽  
Leandro Manera
2017 ◽  
Vol 7 (9) ◽  
pp. 890 ◽  
Author(s):  
Mariya Aleksandrova ◽  
Georgi Kolev ◽  
Yordanka Vucheva ◽  
Habib Pathan ◽  
Krassimir Denishev
Keyword(s):  

Polymers ◽  
2019 ◽  
Vol 11 (2) ◽  
pp. 245 ◽  
Author(s):  
Sang Lee ◽  
Sangyoon Lee

Although printed electronics technology has been recently employed in the production of various devices, its use for the fabrication of electronic devices with air-gap structures remains challenging. This paper presents a productive roll-to-roll printed electronics method for the fabrication of capacitive touch sensors with air-gap structures. Each layer of the sensor was fabricated by printing or coating. The bottom electrode, and the dielectric and sacrificial layers were roll-to-roll slot-die coated on a flexible substrate. The top electrode was formed by roll-to-roll gravure printing, while the structural layer was formed by spin-coating. In particular, the sacrificial layer was coated with polyvinyl alcohol (PVA) and removed in water to form an air-gap. The successful formation of the air-gap was verified by field emission scanning electron microscopy (FE-SEM). Electrical characteristics of the air-gap touch sensor samples were analyzed in terms of sensitivity, hysteresis, and repeatability. Experimental results showed that the proposed method can be suitable for the fabrication of air-gap sensors by using the roll-to-roll printed electronics technology.


2019 ◽  
Vol 19 (8) ◽  
pp. 4803-4806
Author(s):  
Shenawar Ali Khan ◽  
Hyeon-Seok Jeong ◽  
Sheik Abdur Rahman ◽  
Jin-Hyuk Bae ◽  
Woo Young Kim

2016 ◽  
Vol 847 ◽  
pp. 143-147
Author(s):  
Ya Dan Li ◽  
Zhuang Hao Zheng ◽  
Ping Fan ◽  
Jing Ting Luo ◽  
Guang Xing Liang ◽  
...  

CoSb3 thermoelectric thin films were prepared on polyimide flexible substrate by radio frequency (RF) magnetron sputtering technology using a cobalt antimony alloy target. Ti and In were added into CoSb3 thin films by co-sputtering. The influence of Ti and In on the thermoelectric properties of CoSb3 thin films was investigated. X-ray diffraction result shows that the major diffraction peaks of all the thin films match the standard peaks related to the CoSb3 phase. The sample has best thermoelectric properties when the Ti sputtering time was 1min and In sputtering time was 30 seconds.


2020 ◽  
Author(s):  
Nisha Joseph ◽  
Tina Sebastian ◽  
Jilu C. John ◽  
Saji Augustine

2010 ◽  
Author(s):  
M. M. Jatlaoui ◽  
D. Dragomirescu ◽  
S. Charlot ◽  
P. Pons ◽  
H. Aubert ◽  
...  

2005 ◽  
Vol 128 (3) ◽  
pp. 236-245 ◽  
Author(s):  
Bivragh Majeed ◽  
Kieran Delaney ◽  
John Barton ◽  
Niall McCarthy ◽  
Sean C. O’Mathuna ◽  
...  

In this paper we describe the materials-related challenges in applying folded flex packaging technology to wireless sensor networks and propose solutions for implementing miniaturized 5mm cube platforms. The focus is to apply thin silicon stacking methods using thin flexible substrate interconnect and in particular to investigate the behavior of the selected materials. Both commercial and in-house polyimide substrates, in the thickness range 25μm down to 3μm (each with 4μm of sputtered copper) were analyzed for appropriate electrical, chemical, and mechanical properties. The characterization highlighted that in flex of thickness below 10μm, a dramatic decrease in stiffness occurs and the polyimide wrinkles due to stresses generated by the copper sputtering process. An evaluation determined that specific steps, such as polymer support ring formation, could be employed to eliminate impact of wrinkling on the process of developing the 5mm cube prototypes.


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