Sensitivity improvement of SAW pressure sensors based on finite element analysis

2016 ◽  
Author(s):  
Juan Ren ◽  
Kanat Anurakparadorn ◽  
Zhuangde Jiang ◽  
Xueyong Wei
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Pressure Sensors ◽  
Element Analysis ◽  
Sensitivity Improvement

scholarly journals Microstructure-Based Interfacial Tuning Mechanism of Capacitive Pressure Sensors for Electronic Skin

2016 ◽  
Vol 2016 ◽  
pp. 1-8 ◽  
Author(s):  
Weili Deng ◽  
Xinjie Huang ◽  
Wenjun Chu ◽  
Yueqi Chen ◽  
Lin Mao ◽  
...  
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Pressure Sensors ◽  
Pressure Response ◽  
Analysis Method ◽  
Element Analysis ◽  
Finite Element Analysis Method ◽  
Tuning Mechanism ◽  
Electronic Skin ◽  
Further Development

In order to investigate the interfacial tuning mechanism of electronic skin (e-skin), several models of the capacitive pressure sensors (CPS) with different microstructures and several sizes of microstructures are constructed through finite element analysis method. The simulative pressure response, the sensitivity, and the linearity of the designed CPS show that the sensor with micropyramids has the best performance in all the designed models. The corresponding theoretically predicted sensitivity is as high as 6.3 × 10−7 fF/Pa, which is about 49 times higher than that without any microstructure. Additionally, these further simulative results show that the smaller the ratios ofL/Hof pyramid, the better the sensitivity but the worse the linearity. When the ratio ofL/Hof pyramid is about2, the sensitivity and the linearity could reach a balance point. The simulative results evidently provide the important theoretically directive significance for the further development ofe-skin.

Finite element analysis of fiber-optic Fabry–Perot pressure sensors based on silicon diaphragms

2019 ◽  
Vol 58 (31) ◽  
pp. 8465
Author(s):  
Rongkun Wang ◽  
Longfei Xiao ◽  
Qi Li ◽  
Xiangang Xu ◽  
Xiufang Chen ◽  
...  
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Fiber Optic ◽  
Pressure Sensors ◽  
Element Analysis ◽  
Fabry Perot

Development of Biocompatible MEMS Wireless Capacitive Pressure Sensor

2005 ◽  
Vol 2 (4) ◽  
pp. 287-296
Author(s):  
Shankaran Janardhanan ◽  
Joan. Z. Delalic ◽  
Jeffrey Catchmark ◽  
Dharanipal Saini
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Resonant Frequency ◽  
Pressure Sensor ◽  
Impedance Matching ◽  
Pressure Sensors ◽  
Important Variable ◽  
Bladder Pressure ◽  
Capacitive Pressure Sensor ◽  
Element Analysis

The objective of this research was to develop a wireless pressure sensor useful for monitoring bladder pressure. The wireless sensor consists of an active capacitive element and an inductor coil. The changes in pressure are related to the changes in the resonant frequency of the internal sensor. The existing pressure sensors have inductors formed on both sides of the substrate. The changes in internal capacitance of these sensors are related to the changes in pressure by impedance matching of the internal LC circuit. The deviation in bladder pressure is an important variable in evaluating the diseased state of the bladder. The inductor designed for this application is a spirally wound inductor fabricated adjacent to the capacitor. The external sensing uses equivalent changes in internal LC. The resonant frequency of the internal sensor is defined by the deformation of the plate, causing the plate to touch the dielectric on the fixed capacitive plate, which is reflected as changes in capacitance(C). The deformation of the plate has been modeled using Finite Element Analysis. The finite element analysis optimizes the dimensions of the design. Remote sensing is achieved through inductive coupling and the changes in pressure are determined. The device is tested for pressures ranging from 0–150 mmHg, bladder pressure. The RF Telemetry system has been modeled using Sonnet. The frequency range is between 100–670 MHz which is in compliance to that specified by Federal Communications Commission (FCC) regulations.

scholarly journals A Smart Stent for Monitoring Eventual Restenosis: Computational Fluid Dynamic and Finite Element Analysis in Descending Thoracic Aorta

Machines ◽  
2020 ◽  
Vol 8 (4) ◽  
pp. 81
Author(s):  
Betsy D. M. Chaparro-Rico ◽  
Fabio Sebastiano ◽  
Daniele Cafolla
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Flow Velocity ◽  
Computational Fluid Dynamic ◽  
Stent Implantation ◽  
Fluid Dynamic ◽  
Pressure Sensors ◽  
Metal Mesh ◽  
Element Analysis ◽  
Mesh Structure

Even though scientific studies of smart stents are extensive, current smart stents focus on pressure sensors. This paper presents a novel implantable biocompatible smart stent for monitoring eventual restenosis. The device is comprised of a metal mesh structure, a biocompatible and adaptable envelope, and pair-operated ultrasonic sensors for restenosis monitoring through flow velocity. Aside from continuous monitoring of restenosis post-implantation, it is also important to evaluate whether the stent design itself causes complications such as restenosis or thrombosis. Therefore, computational fluid dynamic (CFD) analysis before and after stent implantation were carried out as well as finite element analysis (FEA). The proposed smart stent was put in the descending thoracic section of a virtually reconstructed aorta that comes from a computed tomography (CT) scan. Blood flow velocity showed that after stent implantation, there is not liquid retention or vortex generation. In addition, blood pressures after stent implantation were within the normal blood pressure values. The stress and the factor of safety (FOS) analysis showed that the stress values reached by the stent are very far from the yield strength limit of the materials and that the stent is stiff enough to support the applied loads exported from the CFD results.

scholarly journals Finite Element Analysis of Membranes for MEMS Capacitive Pressure Sensors

2016 ◽  
Vol V5 (10) ◽  
Author(s):  
V. K. Saravanan ◽  
R. Vinobakrishnan ◽  
Dr. Jeyanthinath Mayandi ◽  
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Pressure Sensors ◽  
Element Analysis

Micro-Raman Study of Stress Distribution and Thermal Relaxation of Oxidized Silicon Membranes

1996 ◽  
Vol 444 ◽  
Author(s):  
C. Malhaire ◽  
Y. Guyot ◽  
M. Le Berre ◽  
B. Champagnonn ◽  
A. Sibai ◽  
...  
Keyword(s):  
Finite Element Analysis ◽  
Raman Spectroscopy ◽  
Finite Element ◽  
Stress Distribution ◽  
Pressure Sensors ◽  
Biaxial Stress ◽  
Membrane Thickness ◽  
Element Analysis ◽  
Membrane Area ◽  
Micro Raman Spectroscopy

AbstractComposite SiO2/Si membranes are used in various type of sensors among them, resonant and pressure sensors. However due to a large thermal mismatch, residual induced stresses may affect the devices long term reliability especially for thin membranes (˜5 μm). In this study, we have characterized test structures consisting of SiO2/Si membranes with respective thickness ratio between 2 and 10. Micro-Raman Spectroscopy, well known to be an accurate, non destructive method to determine residual stresses in microelectronic devices, has shown to be a powerful testing technique to measure local stresses on micromachined structures such as membranes, with a high spatial (10 μm2 ) and stress resolution (8 MPa). At room temperature, Raman line (520 cm−1) shifts between 0.05 and 1 cm−1 are observed. Highest frequency shifts of 1cm−1 corresponds to a 230 MPa biaxial stress. Finite Element analysis (ANSYS) was used to model the thermal stress distribution over the micromachined bilayer membrane, yielding a satisfactorily agreement with the experimental results over a large membrane area. The Finite Element analysis was correlated with optical profilometer deflection measurements. Membrane deflections up to 48 μm (more than 10 times the membrane thickness) have been measured. Furthermore, Micro-Raman Spectroscopy results up to 300°C are shown and related to temperature dependent deflection measurements.

scholarly journals Sensitivity improvement of a new structure crack meter with angular adjustment

2019 ◽  
Vol 52 (9-10) ◽  
pp. 1545-1551
Author(s):  
Li Hong ◽  
Jiahui Wang ◽  
Zhenjing Yao
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Element Analysis ◽  
The Finite Element Analysis ◽  
Shape Structure ◽  
Sensitivity Improvement ◽  
Experimental Findings ◽  
Higher Sensitivity ◽  
Ansys Workbench ◽  
Structure Crack

In order to enhance the sensitivity improvement of crack meter in ruins rescue site, this paper proposes a novel crack meter with a V-shape structure. The mathematical analysis showed that there is a negative correlation between sensitivity of proposed crack and angle of V-shape structure. The finite element analysis using the ANSYS Workbench illustrates that sensitivity of proposed crack meter has rapid reduce with angle of V-shape structure of 14°–28°. Experimental findings show that the proposed V-shape structure crack meter has a higher sensitivity than the traditional one. With 14° V-shape structure crack meter, the sensitivity was enhanced to 1.16 mV/(mm/V), with an increase of 2.3 times over the traditional crack meter sensitivity of 0.35 mV/(mm/V).

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