Nickel electroforming with 355 nm UV laser process applied to 4G solidly mounted resonator packaging

Purpose – The purpose of this paper is to form good cutting qualities in glass-epoxy material for opening flexible areas of rigid-flex printed circuit boards (PCB) by ultraviolet (UV) laser cutting. Design/methodology/approach – The cut width and cut depth of glass-epoxy materials were both observed to evaluate their cutting qualities. The heat affected zone (HAZ) of the glass-epoxy material was also investigated after UV laser cutting. The relationships between the cut width and the parameters of various factors were analyzed using an orthogonal experimental design. Findings – The cut width of the glass-epoxy material gradually increased with the increment of the laser power and Z-axis height, while cutting speed and laser frequency had less effect on the cut width. Optimal parameters of the UV laser process for cutting glass-epoxy material were obtained and included a laser power of 6W, a cutting speed of 170 mm/s, a laser frequency of 50 kHz and a Z-axis height of 0.6 mm, resulting in an average cut width of 25 μm and small HAZ. Originality/value – Flexible areas of rigid-flex PCBs are in good agreement with the cutting qualities of the UV laser. The use of a UV laser process could have important potential for cutting glass-epoxy materials used in the PCB industry.

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Laser Process for Selective Emitter Silicon Solar Cells

International Journal of Photoenergy ◽

10.1155/2012/413863 ◽

2012 ◽

Vol 2012 ◽

pp. 1-5 ◽

Cited By ~ 4

Author(s):

G. Poulain ◽

D. Blanc ◽

A. Focsa ◽

B. Bazer-Bachi ◽

M. Gauthier ◽

...

Keyword(s):

Solar Cells ◽

Antireflection Coating ◽

Silicon Solar Cells ◽

Uv Laser ◽

Selective Emitter ◽

Laser Process ◽

Resistance Variation ◽

Matter Interaction ◽

The Cost ◽

Processing Steps

Selective emitter solar cells can provide a significant increase in conversion efficiency. However current approaches need many technological steps and alignment procedures. This paper reports on a preliminary attempt to reduce the number of processing steps and therefore the cost of selective emitter cells. In the developed procedure, a phosphorous glass covered with silicon nitride acts as the doping source. A laser is used to open locally the antireflection coating and at the same time achieve local phosphorus diffusion. In this process the standard chemical etching of the phosphorous glass is avoided. Sheet resistance variation from 100 Ω/sq to 40 Ω/sq is demonstrated with a nanosecond UV laser. Numerical simulation of the laser-matter interaction is discussed to understand the dopant diffusion efficiency. Preliminary solar cells results show a 0.5% improvement compared with a homogeneous emitter structure.

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Microfabrication of Polymers Using KrF Excimer Laser Beam

Key Engineering Materials ◽

10.4028/www.scientific.net/kem.326-328.115 ◽

2006 ◽

Vol 326-328 ◽

pp. 115-118

Author(s):

Dong Sig Shin ◽

Jae Hoon Lee ◽

Jeong Suh

Keyword(s):

Laser Ablation ◽

Binding Energy ◽

Laser Beam ◽

Excimer Laser ◽

Polymer Chains ◽

Laser Beams ◽

Adhesive Tape ◽

Uv Laser ◽

Laser Process ◽

Krf Excimer Laser

Pulsed UV laser beams, which are widely used in the processing of polymers, offer many advantages in the field of polymer production, primarily because their photon energy is higher than the binding energy of the polymer. In particular, the fabrication of polymers with an excimer laser process is faster and more convenient than with other processes. Nevertheless, some problems occur in the precision microprocessing of polymers, including the formation and deposition of surface debris, which is produced from the breakdown of either polymer chains or radical bonds. In the present work, a process for eliminating carbonized surface debris contamination generated by the laser ablation of a polymer was developed. The proposed approach for removing surface debris utilizes an erasable ink pasted on the polymer. The surface debris ejected from the polymer is then combined with the ink layer on the polymer. Finally, both the surface debris and the ink layer can be removed using adhesive tape.

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