Electron diffusion in 0.18 μm MOS transistors at 200 μC

2008 ◽  
Author(s):  
Edmundo A. Gutierrez-D.
Keyword(s):  
Mos Transistors ◽  
Electron Diffusion

ANALYSIS OF HOT CARRIER DEGRADATION IN AC STRESSED N-CHANNEL MOS TRANSISTORS USING THE CHARGE PUMPING TECHNIQUE

1988 ◽  
Vol 49 (C4) ◽  
pp. C4-651-C4-655 ◽  
Author(s):  
R. BELLENS ◽  
P. HEREMANS ◽  
G. GROESENEKEN ◽  
H. E. MAES
Keyword(s):  
Mos Transistors ◽  
Charge Pumping ◽  
Hot Carrier ◽  
Hot Carrier Degradation

Transport and fluctuations in nonlinear-dissipative systems: role of interparticle collisions

1999 ◽  
Vol 4 ◽  
pp. 31-86 ◽  
Author(s):  
R. Katilius ◽  
A. Matulionis ◽  
R. Raguotis ◽  
I. Matulionienė
Keyword(s):  
Electric Fields ◽  
Carrier Density ◽  
Experimental Results ◽  
Dissipative Systems ◽  
Doped Semiconductors ◽  
Electron Diffusion ◽  
Electron Collisions ◽  
Electric Noise ◽  
Diffusion Phenomena

The goal of the paper is to overview contemporary theoretical and experimental research of the microwave electric noise and fluctuations of hot carriers in semiconductors, revealing sensitivity of the noise spectra to non-linearity in the applied electric field strength and, especially, in the carrier density. During the last years, investigation of electronic noise and electron diffusion phenomena in doped semiconductors was in a rapid progress. By combining analytic and Monte Carlo methods as well as the available experimental results on noise, it became possible to obtain the electron diffusion coefficients in the range of electric fields where inter-electron collisions are important and Price’s relation is not necessarily valid. Correspondingly, a special attention to the role of inter-electron collisions and of the non-linearity in the carrier density while shaping electric noise and diffusion phenomena in the non-equilibrium states will be paid. The basic and up-to-date information will be presented on methods and advances in this contemporary field - the field in which methods of non-linear analytic and computational analysis are indispensable while seeking coherent understanding and interpretation of experimental results.

A High PSRR Bandgap Voltage Reference with Virtually Diode-Connected MOS Transistors

2010 ◽  
Vol E93-C (12) ◽  
pp. 1708-1712 ◽  
Author(s):  
Kianoush SOURI ◽  
Hossein SHAMSI ◽  
Mehrshad KAZEMI ◽  
Kamran SOURI
Keyword(s):  
Voltage Reference ◽  
Mos Transistors ◽  
Bandgap Voltage Reference

ОСОБЕННОСТИ ЭКСТРАКЦИИ SPICE-МОДЕЛЕЙ ТРАНЗИСТОРОВ ДЛЯ ТЕХНОЛОГИЙ КНИ ГЛУБОКОГО СУБМИКРОННОГО УРОВНЯ

2020 ◽  
Vol 96 (3s) ◽  
pp. 680-683
Author(s):  
А.В. Нуштаев ◽  
А.Г. Потупчик
Keyword(s):  
Process Design ◽  
Development Process ◽  
Dynamic Parameters ◽  
Mos Transistors ◽  
Spice Model

Разработаны тестовые структуры для экстракции и верификации статических и динамических параметров SPICE-моделей транзисторов. Проведена экстракция SPICE-моделей МОП-транзисторов А-типа в рамках разработки комплекта средств проектирования для технологии КНИ-180. Проведена верификация статических и динамических параметров полученных моделей транзисторов. The paper highlights test structures for the extraction and verification of static and dynamic parameters of the transistor SPICE model. The SPICE models of A-type MOS transistors for development process design kit for S0I180 technology have been extracted. Verification of static and dynamic parameters of the obtained transistor models has been carried out.

ВЛИЯНИЕ ТВЕРДОФАЗНОЙ РЕКРИСТАЛЛИЗАЦИИ С ДВОЙНОЙ ИМПЛАНТАЦИЕЙ НА ПЛОТНОСТЬ СТРУКТУРНЫХ ДЕФЕКТОВ В УЛЬТРАТОНКИХ СЛОЯХ КРЕМНИЯ НА САПФИРЕ

2020 ◽  
Vol 96 (3s) ◽  
pp. 154-159
Author(s):  
Н.Н. Егоров ◽  
С.А. Голубков ◽  
С.Д. Федотов ◽  
В.Н. Стаценко ◽  
А.А. Романов ◽  
...  
Keyword(s):  
Dislocation Density ◽  
Solid Phase ◽  
Modern Method ◽  
Structural Defects ◽  
Structural Quality ◽  
Mos Transistors ◽  
Ultrathin Layers ◽  
Heteroepitaxial Layers ◽  
Xrd And Tem

Высокая плотность структурных дефектов является основной проблемой при изготовлении электроники на гетероструктурах «кремний на сапфире» (КНС). Современный метод получения ультратонких структур КНС с помощью твердофазной эпитаксиальной рекристаллизации позволяет значительно снизить дефектность в гетероэпитаксиальном слое КНС. В данной работе ультратонкие (100 нм) слои КНС были получены путем рекристаллизации и утонения субмикронных (300 нм) слоев кремния на сапфире, обладающих различным структурным качеством. Плотность структурных дефектов в слоях КНС оценивалась с помощью рентгеноструктурного анализа и просвечивающей электронной микроскопии. Кривые качания от дифракционного отражения Si(400), полученные в ω-геометрии, продемонстрировали максимальную ширину на полувысоте пика не более 0,19-0,20° для ультратонких слоев КНС толщиной 100 нм. Формирование структурно совершенного субмикронного слоя КНС 300 нм на этапе газофазной эпитаксии обеспечивает существенное уменьшение плотности дислокаций в ультратонком кремнии на сапфире до значений ~1 • 104 см-1. Тестовые n-канальные МОП-транзисторы на ультратонких структурах КНС характеризовались подвижностью носителей в канале 725 см2 Вс-1. The high density of structural defects is the main problem on the way to the production of electronics on silicon-on-sapphire (SOS) heteroepitaxial wafers. The modern method of obtaining ultrathin SOS wafers is solid-phase epitaxial recrystallization which can significantly reduce the density of defects in the SOS heteroepitaxial layers. In the current work, ultrathin (100 nm) SOS layers were obtained by recrystallization and thinning of submicron (300 nm) SOS layers, which have various structural quality. The density of structural defects in the layers was estimated by using XRD and TEM. Full width at half maximum of rocking curves (ω-geometry) was no more than 0.19-0.20° for 100 nm ultra-thin SOS layers. The structural quality of 300 nm submicron SOS layers, which were obtained by CVD, depends on dislocation density in 100 nm ultrathin layers. The dislocation density in ultrathin SOS layers was reduced by ~1 • 104 cm-1 due to the utilization of the submicron SOS with good crystal quality. Test n-channel MOS transistors based on ultra-thin SOS wafers were characterized by electron mobility in the channel 725 cm2 V-1 s-1.

scholarly journals A Study on the Variable Inductor Design by Switching the Main Paths and the Coupling Coils

Electronics ◽  
2021 ◽  
Vol 10 (15) ◽  
pp. 1856
Author(s):  
Yen-Chung Chiang ◽  
Juo-Chen Chen ◽  
Yu-Hsin Chang
Keyword(s):  
Design Method ◽  
The Other ◽  
Cmos Process ◽  
Mos Transistors ◽  
Quality Factors ◽  
Process Technology ◽  
Variation Versus ◽  
Variable Inductor ◽  
Metal Layers ◽  
Coupled Coils

In a radio frequency (RF) system, it is possible to use variable inductors for providing tunable or selective frequency range. Variable inductors can be implemented by the microelectromechanical system (MEMS) process or by using transistors as switches to change the routing of coils or coupling quantities. In this paper, we investigated the design method of a variable inductor by using MOS transistors to switch the main coil paths and the secondary coupled coils. We observed the effects of different metal layers, turn numbers, and layout arrangements for secondary-coupled coils and compared their characteristics on the inductances and quality factors. We implemented two chips in the 0.18 m CMOS process technology for each kind of arrangement for verification. One inductor can achieve inductance values from about 300 pH to 550 pH, and the other is between 300 pH and 575 pH, corresponding to 59.3% and 62.5%, respectively, inductance variation range at 4 GHz frequency. Additionally, their fine step sizes of the switched inductances are from 0.5% to 6% for one design, and 1% to 12.5% for the other. We found that both designs achieved a large inductance tuning range and moderate inductance step sizes with a slight difference behavior on the inductance variation versus frequency.

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