Fault Analysis and Simulation Test Research on Lightning Stroke-Caused Wire-Breakage of Overhead Ground Line

Author(s):  
Zhou Luyao ◽  
Li Te ◽  
Ye Jinbiao ◽  
Zhou Xiangxian ◽  
Wu Xuxiang ◽  
...  
2014 ◽  
Vol 701-702 ◽  
pp. 1187-1193
Author(s):  
Qing Wu ◽  
Guan Jun Qian ◽  
Bin Hu ◽  
Song Huang ◽  
Xian He Dou ◽  
...  

Lightning strokes are the main cause for the trip fault of transmission line with a rated voltage of 110 kV and above. The counterattack trip and the shielding failure trip were thought to be the two kinds of fault type caused by lightning strokes. According to the development process of the two fault types, a few effective lightning protection methods are proposed. However, there is no relative report about the case that the ground wire and the conductor are stricken simultaneously. Therefore, no specific protection method is presented. In this paper, the possibility of the both stroke is analyzed, according the the mechanism of lightning stroke and the characteristics of lightning strokes. Then, a series of simulation test were designed and carried out. The observation results recorded by high-speed camera indicate that the downward leader could strike grounded wire and conductor simultaneously. At last, based on the intelligent monitoring system of transmission line, the traveling wave current of a lightning stroke was recorded. And after comparing the current with the simulation results by ATP/EMTP, the stroke was thought to be a both stroke. The photos in the fault point indicate that there are discharge points both on the grounded wire and conductor. And this field data clarified that the trip fault was caused by both stroke. A new lightning stroke fault was presented and verified in this paper, this report will supply important reference for lightning protection of transmission line.


2018 ◽  
Vol 138 (5) ◽  
pp. 346-351 ◽  
Author(s):  
Hiroyuki Kaneko ◽  
Naoki Itamoto ◽  
Kazuo Shinjo

2008 ◽  
Vol 1 (3) ◽  
pp. 36-44
Author(s):  
M. Rizwan Khan ◽  
Atif Iqbal ◽  
Mukhtar Ahmad

Author(s):  
Steve K. Hsiung ◽  
Kevan V. Tan ◽  
Andrew J. Komrowski ◽  
Daniel J. D. Sullivan ◽  
Jan Gaudestad

Abstract Scanning SQUID (Superconducting Quantum Interference Device) Microscopy, known as SSM, is a non-destructive technique that detects magnetic fields in Integrated Circuits (IC). The magnetic field, when converted to current density via Fast Fourier Transform (FFT), is particularly useful to detect shorts and high resistance (HR) defects. A short between two wires or layers will cause the current to diverge from the path the designer intended. An analyst can see where the current is not matching the design, thereby easily localizing the fault. Many defects occur between or under metal layers that make it impossible using visible light or infrared emission detecting equipment to locate the defect. SSM is the only tool that can detect signals from defects under metal layers, since magnetic fields are not affected by them. New analysis software makes it possible for the analyst to overlay design layouts, such as CAD Knights, directly onto the current paths found by the SSM. In this paper, we present four case studies where SSM successfully localized short faults in advanced wire-bond and flip-chip packages after other fault analysis methods failed to locate the defects.


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