Analysis of CNTFET Sequential Circuit Using Metastability and Robustnes of Voltage and Temperature Variations

2017 ◽  
Author(s):  
Neetu Sardana ◽  
L.K. Ragha
Keyword(s):  
Sequential Circuit ◽  
Temperature Variations

Observations of the spatial structure of interstellar hydrogen

1967 ◽  
Vol 31 ◽  
pp. 45-46
Author(s):  
Carl Heiles
Keyword(s):  
High Resolution ◽  
Spatial Structure ◽  
Velocity Dispersion ◽  
Temperature Variations

High-resolution 21-cm line observations in a region aroundlII= 120°,b11= +15°, have revealed four types of structure in the interstellar hydrogen: a smooth background, large sheets of density 2 atoms cm-3, clouds occurring mostly in groups, and ‘Cloudlets’ of a few solar masses and a few parsecs in size; the velocity dispersion in the Cloudlets is only 1 km/sec. Strong temperature variations in the gas are in evidence.

Clean Electron Microscope Substrate Films Used for Micrometeorite Collection and Study

1967 ◽  
Vol 25 ◽  
pp. 366-367
Author(s):  
D. M. Davies ◽  
R. Kemner ◽  
E. F. Fullam
Keyword(s):  
Thin Film ◽  
Electron Microscope ◽  
High Altitude ◽  
Amyl Acetate ◽  
Temperature Variations ◽  
Film Forming ◽  
Film Specimen ◽  
Particulate Contaminants

All serious electron microscopists at one time or another have been concerned with the cleanliness and freedom from artifacts of thin film specimen support substrates. This is particularly important where there are relatively few particles of a sample to be found for study, as in the case of micrometeorite collections. For the deposition of such celestial garbage through the use of balloons, rockets, and aircraft, the thin film substrates must have not only all the attributes necessary for use in the electron microscope, but also be able to withstand rather wide temperature variations at high altitude, vibration and shock inherent in the collection vehicle's operation and occasionally an unscheduled violent landing.Nitrocellulose has been selected as a film forming material that meets these requirements yet lends itself to a relatively simple clean-up procedure to remove particulate contaminants. A 1% nitrocellulose solution is prepared by dissolving “Parlodion” in redistilled amyl acetate from which all moisture has been removed.

Holocene sea surface temperature variations recorded in corals from Kikai Island, Japan

2017 ◽  
Vol 51 (4) ◽  
pp. e9-e14 ◽  
Author(s):  
Hiroto Kajita ◽  
Atsuko Yamazaki ◽  
Takaaki Watanabe ◽  
Chung-Che Wu ◽  
Chuan-Chou Shen ◽  
...  
Keyword(s):  
Surface Temperature ◽  
Sea Surface Temperature ◽  
Sea Surface ◽  
Temperature Variations

INVAR

Alloy Digest ◽  
1964 ◽  
Vol 13 (3) ◽  
Keyword(s):  
Corrosion Resistance ◽  
High Temperature ◽  
Physical Properties ◽  
Iron Alloy ◽  
Heat Treating ◽  
Temperature Variations ◽  
Nickel Iron ◽  
Dimensional Changes ◽  
Temperature Performance ◽  
Nickel Iron Alloy

Abstract INVAR is a 36% nickel-iron alloy having the lowest coefficient of expansion, recommended for applications requiring no dimensional changes with temperature variations. This datasheet provides information on composition, physical properties, hardness, elasticity, and tensile properties. It also includes information on low and high temperature performance, and corrosion resistance as well as forming, heat treating, machining, joining, and surface treatment. Filing Code: Fe-24. Producer or source: Carpenter.

Low Power and High Speed Sequential Circuits Test Architecture

2019 ◽  
Vol 12 ◽  
Author(s):  
Ahmed K. Jameil ◽  
Yasir Amer Abbas ◽  
Saad Al-Azawi
Keyword(s):  
Power Consumption ◽  
Low Power ◽  
Test Generation ◽  
High Speed ◽  
Fir Filter ◽  
Sequential Circuits ◽  
Fir Filters ◽  
Design Verification ◽  
Sequential Circuit ◽  
Generation Algorithm

Background: The designed circuits are tested for faults detection in fabrication to determine which devices are defective. The design verification is performed to ensure that the circuit performs the required functions after manufacturing. Design verification is regarded as a test form in both sequential and combinational circuits. The analysis of sequential circuits test is more difficult than in the combinational circuit test. However, algorithms can be used to test any type of sequential circuit regardless of its composition. An important sequential circuit is the finite impulse response (FIR) filters that are widely used in digital signal processing applications. Objective: This paper presented a new design under test (DUT) algorithm for 4-and 8-tap FIR filters. Also, the FIR filter and the proposed DUT algorithm is implemented using field programmable gate arrays (FPGA). Method: The proposed test generation algorithm is implemented in VHDL using Xilinx ISE V14.5 design suite and verified by simulation. The test generation algorithm used FIR filtering redundant faults to obtain a set of target faults for DUT. The fault simulation is used in DUT to assess the benefit of test pattern in fault coverage. Results: The proposed technique provides average reductions of 20 % and 38.8 % in time delay with 57.39 % and 75 % reductions in power consumption and 28.89 % and 28.89 % slices reductions for 4- and 8-tap FIR filter, respectively compared to similar techniques. Conclusions: The results of implementation proved that a high speed and low power consumption design can be achieved. Further, the speed of the proposed architecture is faster than that of existing techniques.

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